JPH0144032B2 - - Google Patents

Info

Publication number
JPH0144032B2
JPH0144032B2 JP58022520A JP2252083A JPH0144032B2 JP H0144032 B2 JPH0144032 B2 JP H0144032B2 JP 58022520 A JP58022520 A JP 58022520A JP 2252083 A JP2252083 A JP 2252083A JP H0144032 B2 JPH0144032 B2 JP H0144032B2
Authority
JP
Japan
Prior art keywords
holes
hole
substrate
alumina substrate
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58022520A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59148387A (ja
Inventor
Eiji Imamura
Shigeo Eda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP58022520A priority Critical patent/JPS59148387A/ja
Publication of JPS59148387A publication Critical patent/JPS59148387A/ja
Publication of JPH0144032B2 publication Critical patent/JPH0144032B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
JP58022520A 1983-02-14 1983-02-14 セラミツク焼結体基板の穴加工方法 Granted JPS59148387A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58022520A JPS59148387A (ja) 1983-02-14 1983-02-14 セラミツク焼結体基板の穴加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58022520A JPS59148387A (ja) 1983-02-14 1983-02-14 セラミツク焼結体基板の穴加工方法

Publications (2)

Publication Number Publication Date
JPS59148387A JPS59148387A (ja) 1984-08-25
JPH0144032B2 true JPH0144032B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-09-25

Family

ID=12085044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58022520A Granted JPS59148387A (ja) 1983-02-14 1983-02-14 セラミツク焼結体基板の穴加工方法

Country Status (1)

Country Link
JP (1) JPS59148387A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3096214B2 (ja) * 1995-01-18 2000-10-10 太陽誘電株式会社 レーザ加工装置及びこれを用いた電子部品の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50119278A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-03-06 1975-09-18

Also Published As

Publication number Publication date
JPS59148387A (ja) 1984-08-25

Similar Documents

Publication Publication Date Title
KR100521941B1 (ko) 다층 세라믹 기판의 제조 방법
JPS6132489A (ja) 多層印刷回路基板
JPH0144032B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3076215B2 (ja) セラミック多層基板及びその製造方法
JPH05335438A (ja) リードレスチップキャリア
JP2002290029A (ja) 配線基板の製造方法及び配線基板
JPH0529102A (ja) 電子部品
JPH0540582Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH03268478A (ja) 電子回路及びその製法
JP2757349B2 (ja) 混成集積回路用基板及びそれを用いた混成集積回路装置の製造方法
JPH0767001B2 (ja) 電子部品用基板
JPS6181693A (ja) セラミツク基板の製造方法およびこれに用いるグリ−ンシ−ト
JPS62149190A (ja) セラミツク回路基板の製造方法
JPH0226383B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0528725Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6142990A (ja) 厚膜印刷基板
JPH0638441Y2 (ja) 面実装用ハイブリッドｉｃの実装構造
JPH0423812B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6341003A (ja) チツプ形電子部品の製造方法
JPS62149189A (ja) セラミツク湿式印刷多層基板
JPS6020945Y2 (ja) マルチチツプｌｓｉパツケ−ジ
JPH0148667B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS63194A (ja) セラミツク基板の製造方法
JPS618347A (ja) セラミツク・グリンシ−トの製造方法
JPH11274359A (ja) セラミック多層回路基板の製造方法およびセラミック多層回路基板用親基板