JPH0143608B2 - - Google Patents
Info
- Publication number
- JPH0143608B2 JPH0143608B2 JP56126894A JP12689481A JPH0143608B2 JP H0143608 B2 JPH0143608 B2 JP H0143608B2 JP 56126894 A JP56126894 A JP 56126894A JP 12689481 A JP12689481 A JP 12689481A JP H0143608 B2 JPH0143608 B2 JP H0143608B2
- Authority
- JP
- Japan
- Prior art keywords
- annular
- insert
- housing
- heating unit
- nozzle hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/30—Extrusion nozzles or dies
- B29C48/32—Extrusion nozzles or dies with annular openings, e.g. for forming tubular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/09—Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels
- B29C48/10—Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels flexible, e.g. blown foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/92—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92609—Dimensions
- B29C2948/92647—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92704—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92819—Location or phase of control
- B29C2948/92857—Extrusion unit
- B29C2948/92904—Die; Nozzle zone
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56126894A JPS5829624A (ja) | 1981-08-13 | 1981-08-13 | インフレ−シヨンフイルム用ダイ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56126894A JPS5829624A (ja) | 1981-08-13 | 1981-08-13 | インフレ−シヨンフイルム用ダイ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5829624A JPS5829624A (ja) | 1983-02-21 |
| JPH0143608B2 true JPH0143608B2 (enrdf_load_stackoverflow) | 1989-09-21 |
Family
ID=14946496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56126894A Granted JPS5829624A (ja) | 1981-08-13 | 1981-08-13 | インフレ−シヨンフイルム用ダイ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5829624A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11146110B2 (en) | 2019-03-28 | 2021-10-12 | Lapis Semiconductor Co., Ltd. | Power reception device |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62238731A (ja) * | 1986-04-10 | 1987-10-19 | Showa Denko Kk | インフレ−シヨンフイルムの成形方法 |
| JPH0288213A (ja) * | 1988-09-27 | 1990-03-28 | Tomy Kikai Kogyo Kk | 溶融押出式フイルム成形による複厚フイルムの製造方法 |
| JPH0698671B2 (ja) * | 1989-03-30 | 1994-12-07 | トミー機械工業株式会社 | 溶融押出式フイルム成形の膜厚制御装置 |
| EP0423386B1 (en) * | 1989-10-17 | 1993-07-28 | Tomi Machinery Manfuacturing Co., Ltd. | Synthetic resin film, method of uniforming the film thickness upon molding of such film and apparatus therefor |
| JPH088098Y2 (ja) * | 1993-12-16 | 1996-03-06 | トミー機械工業株式会社 | 複厚フィルム製造装置 |
-
1981
- 1981-08-13 JP JP56126894A patent/JPS5829624A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11146110B2 (en) | 2019-03-28 | 2021-10-12 | Lapis Semiconductor Co., Ltd. | Power reception device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5829624A (ja) | 1983-02-21 |
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