JPH0142496B2 - - Google Patents

Info

Publication number
JPH0142496B2
JPH0142496B2 JP19157782A JP19157782A JPH0142496B2 JP H0142496 B2 JPH0142496 B2 JP H0142496B2 JP 19157782 A JP19157782 A JP 19157782A JP 19157782 A JP19157782 A JP 19157782A JP H0142496 B2 JPH0142496 B2 JP H0142496B2
Authority
JP
Japan
Prior art keywords
lead frame
frame
pin
plating
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19157782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5980956A (ja
Inventor
Kazuo Ozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Plant Kogyo Kk
Original Assignee
Fuji Plant Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Plant Kogyo Kk filed Critical Fuji Plant Kogyo Kk
Priority to JP19157782A priority Critical patent/JPS5980956A/ja
Publication of JPS5980956A publication Critical patent/JPS5980956A/ja
Publication of JPH0142496B2 publication Critical patent/JPH0142496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reciprocating Conveyors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP19157782A 1982-10-30 1982-10-30 長尺リ−ドフレ−ムの搬送・位置決め方法 Granted JPS5980956A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19157782A JPS5980956A (ja) 1982-10-30 1982-10-30 長尺リ−ドフレ−ムの搬送・位置決め方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19157782A JPS5980956A (ja) 1982-10-30 1982-10-30 長尺リ−ドフレ−ムの搬送・位置決め方法

Publications (2)

Publication Number Publication Date
JPS5980956A JPS5980956A (ja) 1984-05-10
JPH0142496B2 true JPH0142496B2 (enExample) 1989-09-13

Family

ID=16276969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19157782A Granted JPS5980956A (ja) 1982-10-30 1982-10-30 長尺リ−ドフレ−ムの搬送・位置決め方法

Country Status (1)

Country Link
JP (1) JPS5980956A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0646641B2 (ja) * 1988-04-18 1994-06-15 三洋電機株式会社 半導体装置の組立装置及びその測定方法
NL1006561C2 (nl) * 1997-07-11 1999-01-12 Fico Bv Transporteur voor leadframes en transportsamenstel.
KR100562411B1 (ko) * 1999-11-03 2006-03-17 삼성테크윈 주식회사 구동 롤러 장치 및 그것을 구비한 에칭 소재의 장력 유지시스템

Also Published As

Publication number Publication date
JPS5980956A (ja) 1984-05-10

Similar Documents

Publication Publication Date Title
US4706379A (en) Parts mounting apparatus
DE3855324T2 (de) Vorrichtung zum Positionieren eines Wafers
US6243160B1 (en) Exposure device for a strip-like workpiece
DE69401622T2 (de) Automatische Bestückungseintichtung für elektronische Teile
US4624358A (en) Device for transferring lead frame
DE69401459T2 (de) Vorrichtung zum Montieren von elektronischen Bauelementen auf Platten
JPH0142496B2 (enExample)
JP3635168B2 (ja) リードフレームのテーピング装置
JPH10107128A (ja) ウェーハリングの供給装置
EP1295840A2 (en) Linear capper and capping method
KR101877836B1 (ko) 자재 생산 설비 내에서의 자재 회전을 위한 컨베이어 장치
JP2861304B2 (ja) アウターリードボンディング方法
KR101816089B1 (ko) 자재 생산 설비 내에서의 자재 회전 방법
JPH1170436A (ja) 板状ワークの搬送装置
JP3768472B2 (ja) テープ搬送装置
JPH08301428A (ja) ワーク搬送装置
KR0158741B1 (ko) 인쇄회로기판 이송장치
JP3158875B2 (ja) チップのボンディング方法
JP2551531B2 (ja) 部分メッキ方法、および部分メッキ装置
JPH033727A (ja) フープフレームの搬送および位置決め機構
DE3586539T2 (de) Vorrichtung zum uebertragen elektronischer teile.
KR980011666A (ko) 평면브라운관의 마스크 용접 장치 및 방법
JPS63154233A (ja) ワ−ク送り装置
JP2001015530A (ja) 帯板状部材の搬送装置
JPH0287546A (ja) 保護フイルムの貼付方法