JPH0139217B2 - - Google Patents

Info

Publication number
JPH0139217B2
JPH0139217B2 JP3428580A JP3428580A JPH0139217B2 JP H0139217 B2 JPH0139217 B2 JP H0139217B2 JP 3428580 A JP3428580 A JP 3428580A JP 3428580 A JP3428580 A JP 3428580A JP H0139217 B2 JPH0139217 B2 JP H0139217B2
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductors
inspection
mirror
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3428580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56130934A (en
Inventor
Naoto Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP3428580A priority Critical patent/JPS56130934A/ja
Publication of JPS56130934A publication Critical patent/JPS56130934A/ja
Publication of JPH0139217B2 publication Critical patent/JPH0139217B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/02—Viewing or reading apparatus
    • G02B27/022—Viewing apparatus
    • G02B27/024—Viewing apparatus comprising a light source, e.g. for viewing photographic slides, X-ray transparancies
    • G02B27/025—Viewing apparatus comprising a light source, e.g. for viewing photographic slides, X-ray transparancies and magnifying means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Microscoopes, Condenser (AREA)
JP3428580A 1980-03-17 1980-03-17 Inspecting device for semiconductor element Granted JPS56130934A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3428580A JPS56130934A (en) 1980-03-17 1980-03-17 Inspecting device for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3428580A JPS56130934A (en) 1980-03-17 1980-03-17 Inspecting device for semiconductor element

Publications (2)

Publication Number Publication Date
JPS56130934A JPS56130934A (en) 1981-10-14
JPH0139217B2 true JPH0139217B2 (enrdf_load_stackoverflow) 1989-08-18

Family

ID=12409880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3428580A Granted JPS56130934A (en) 1980-03-17 1980-03-17 Inspecting device for semiconductor element

Country Status (1)

Country Link
JP (1) JPS56130934A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57115843A (en) * 1981-01-10 1982-07-19 Mitsubishi Electric Corp Testing device for wafer
JPS58142548A (ja) * 1982-02-18 1983-08-24 Nec Corp Ｉｃハンドリング装置
JPH0783043B2 (ja) * 1985-02-04 1995-09-06 オリンパス光学工業株式会社 ウエハ検査顕微鏡装置
JPS6255501A (ja) * 1985-09-04 1987-03-11 Canon Inc レ−ザ測長装置
JPS6394650A (ja) * 1986-10-08 1988-04-25 Tokyo Electron Ltd プロ−ブ装置

Also Published As

Publication number Publication date
JPS56130934A (en) 1981-10-14

Similar Documents

Publication Publication Date Title
JP2000266521A (ja) 外観検査装置
JPH0139217B2 (enrdf_load_stackoverflow)
JP3824847B2 (ja) ワークのテーピングシステム
JP2018503575A (ja) 反転装置、物品処理システム及び方法
JPH04129630A (ja) 搬送装置
JP3113729B2 (ja) 同軸駆動部を有する平行リンクロボット
JP2007287909A (ja) 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
JP2020051998A (ja) 製品異常判定装置
JPH07241534A (ja) 基板洗浄装置
JPS62136428A (ja) 角形マスク基板移送機構
JPH03227036A (ja) ウェーハ移載方法
CN107089497B (zh) 电子元器件的处理装置和处理方法
JPH11211615A (ja) 表示パネル用基板の検査装置
CN221840954U (zh) 一种电路板双面外观检测装置
JPS58130815A (ja) 被搬送物の向き修正装置
JP2002148204A (ja) 棒状体の表面検査装置
JP3116302B2 (ja) ワークの処理装置
JP3216154B2 (ja) 真空成膜装置
JPH04144823A (ja) 板状体の反転装置
JP3305567B2 (ja) ワーク処理装置
JPS58167347A (ja) 印刷装置
JP2003098108A (ja) 容器検査装置および容器検査方法
CN118369280A (zh) 工件的搬运方法及工件搬运装置
KR20250121883A (ko) 기판 절단 장치
JPH01150847A (ja) 瓶口部の欠陥検査装置