JPH0138952Y2 - - Google Patents
Info
- Publication number
- JPH0138952Y2 JPH0138952Y2 JP1466882U JP1466882U JPH0138952Y2 JP H0138952 Y2 JPH0138952 Y2 JP H0138952Y2 JP 1466882 U JP1466882 U JP 1466882U JP 1466882 U JP1466882 U JP 1466882U JP H0138952 Y2 JPH0138952 Y2 JP H0138952Y2
- Authority
- JP
- Japan
- Prior art keywords
- leg
- thermally conductive
- support plate
- conductive support
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 23
- 230000003287 optical effect Effects 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000004804 winding Methods 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Facsimile Heads (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1466882U JPS58118755U (ja) | 1982-02-04 | 1982-02-04 | 半導体撮像素子の実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1466882U JPS58118755U (ja) | 1982-02-04 | 1982-02-04 | 半導体撮像素子の実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58118755U JPS58118755U (ja) | 1983-08-13 |
| JPH0138952Y2 true JPH0138952Y2 (cs) | 1989-11-21 |
Family
ID=30027124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1466882U Granted JPS58118755U (ja) | 1982-02-04 | 1982-02-04 | 半導体撮像素子の実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58118755U (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013190871A1 (ja) * | 2012-06-20 | 2013-12-27 | アオイ電子株式会社 | 光源一体型光センサ |
-
1982
- 1982-02-04 JP JP1466882U patent/JPS58118755U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58118755U (ja) | 1983-08-13 |
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