JPH0136696B2 - - Google Patents
Info
- Publication number
- JPH0136696B2 JPH0136696B2 JP57150752A JP15075282A JPH0136696B2 JP H0136696 B2 JPH0136696 B2 JP H0136696B2 JP 57150752 A JP57150752 A JP 57150752A JP 15075282 A JP15075282 A JP 15075282A JP H0136696 B2 JPH0136696 B2 JP H0136696B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- ion implantation
- disk
- support means
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005468 ion implantation Methods 0.000 claims description 23
- 238000001816 cooling Methods 0.000 claims description 16
- 239000003507 refrigerant Substances 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 2
- 239000007943 implant Substances 0.000 claims 1
- 239000004071 soot Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 30
- 239000002245 particle Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000005465 channeling Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000012056 semi-solid material Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
Landscapes
- Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57150752A JPS5941828A (ja) | 1982-09-01 | 1982-09-01 | イオン打込装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57150752A JPS5941828A (ja) | 1982-09-01 | 1982-09-01 | イオン打込装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5941828A JPS5941828A (ja) | 1984-03-08 |
JPH0136696B2 true JPH0136696B2 (fr) | 1989-08-02 |
Family
ID=15503636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57150752A Granted JPS5941828A (ja) | 1982-09-01 | 1982-09-01 | イオン打込装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5941828A (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4700077A (en) * | 1986-03-05 | 1987-10-13 | Eaton Corporation | Ion beam implanter control system |
EP0287630A4 (fr) * | 1986-10-08 | 1989-07-25 | Varian Associates | Procede et appareil de balayage a angle d'incidence constant pour systemes a faisceaux d'ions. |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52123174A (en) * | 1976-04-09 | 1977-10-17 | Hitachi Ltd | Specimen scanning method for ion implantation |
JPS53119670A (en) * | 1977-03-28 | 1978-10-19 | Toshiba Corp | Ion implanting method and apparatus for the same |
-
1982
- 1982-09-01 JP JP57150752A patent/JPS5941828A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52123174A (en) * | 1976-04-09 | 1977-10-17 | Hitachi Ltd | Specimen scanning method for ion implantation |
JPS53119670A (en) * | 1977-03-28 | 1978-10-19 | Toshiba Corp | Ion implanting method and apparatus for the same |
Also Published As
Publication number | Publication date |
---|---|
JPS5941828A (ja) | 1984-03-08 |
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