JPH0135483Y2 - - Google Patents
Info
- Publication number
- JPH0135483Y2 JPH0135483Y2 JP6819284U JP6819284U JPH0135483Y2 JP H0135483 Y2 JPH0135483 Y2 JP H0135483Y2 JP 6819284 U JP6819284 U JP 6819284U JP 6819284 U JP6819284 U JP 6819284U JP H0135483 Y2 JPH0135483 Y2 JP H0135483Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor circuit
- socket
- pin
- circuit
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 36
- 239000004020 conductor Substances 0.000 claims description 33
- 238000010586 diagram Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6819284U JPS60179046U (ja) | 1984-05-09 | 1984-05-09 | 半導体回路の保護装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6819284U JPS60179046U (ja) | 1984-05-09 | 1984-05-09 | 半導体回路の保護装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60179046U JPS60179046U (ja) | 1985-11-28 |
JPH0135483Y2 true JPH0135483Y2 (it) | 1989-10-30 |
Family
ID=30602721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6819284U Granted JPS60179046U (ja) | 1984-05-09 | 1984-05-09 | 半導体回路の保護装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60179046U (it) |
-
1984
- 1984-05-09 JP JP6819284U patent/JPS60179046U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60179046U (ja) | 1985-11-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5031076A (en) | Multifunctional card having a static protection | |
US6610923B1 (en) | Multi-chip module utilizing leadframe | |
JPH05196692A (ja) | 集積回路パッケージのテスト用のコネクタ・アセンブリ | |
US5671121A (en) | Kangaroo multi-package interconnection concept | |
JPH04329277A (ja) | プリント基板接続装置 | |
JPH0638463B2 (ja) | 電子パッケージ | |
JPH0135483Y2 (it) | ||
US3017550A (en) | Semiconductor device | |
JP2817712B2 (ja) | 半導体装置及びその実装方法 | |
JPH06132447A (ja) | 混成型集積回路装置 | |
JPH038632Y2 (it) | ||
KR100216499B1 (ko) | 칩 온 보드(Chip On Board) 패키지의 삽입형 테스트 소켓 | |
JP2798593B2 (ja) | 半導体装置 | |
JP2879672B2 (ja) | 半導体パッケージのテスト用ソケット | |
JPH07120543B2 (ja) | 電気コネクタ | |
KR100246317B1 (ko) | 반도체 패키지 | |
JP2003031710A (ja) | モノリシックicパッケージ | |
KR800001583B1 (ko) | 전자시계 모듈의 제조방법 | |
JP2786047B2 (ja) | 樹脂封止型半導体装置 | |
JPH04107191A (ja) | Icカード | |
JPS62163351A (ja) | Icソケツト | |
JPH06338366A (ja) | ツーピースコネクタ | |
JPH0347331Y2 (it) | ||
JPS59228739A (ja) | 半導体装置 | |
JPS58184796A (ja) | 半導体カセツト |