JPH0135483Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Technical Field) The present invention relates to a protection device for a packaged semiconductor circuit.

(Prior Art) In recent years, with the progress and development of semiconductor technology, most electronic circuits have come to be packaged using integrated circuits such as thin films and thick films. Such packaged semiconductor circuits are usually TO-5
It is enclosed in a package or a dip-shaped package, and connections to external circuits are made through pins protruding from the package. Specifically, these pins are inserted into, for example, through holes in a printed board and soldered.

By the way, elements such as MOS type ICs and semiconductor laser diodes may be destroyed by high voltages caused by space charges, overcurrents caused by electromagnetic waves, and the like. Therefore, when soldering a semiconductor circuit containing such components to a printed circuit board, it is recommended to solder quickly to minimize damage or to wrap conductor wires between the pins. ,
After soldering is completed, methods such as removing this conductor are used. However, with soldering, it is inconvenient to attach and detach the element when it is destroyed, and the operation when soldering to the printed board is also complicated.

(Purpose of the invention) The present invention was made in view of the above points, and its purpose is to create a semiconductor that is easy to attach and detach, and that can reliably protect elements in the circuit from electrostatic damage. The purpose is to realize a circuit protection device.

(Structure of the invention) The present invention achieves the above object by providing a plurality of connection pins for connection with an external socket on a semiconductor circuit package, and connecting these pins and the semiconductor circuit in the package at predetermined positions on the package. The device is characterized in that a spring conductor is provided to enable a short circuit between the pin and the conductor portion, and the contact between the pin and the conductor portion is broken by inserting the package into an external socket.

(Embodiments) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a mechanical configuration diagram showing an embodiment of the present invention. In the figure, 1 is a packaged semiconductor circuit, 2 is a substrate on which the semiconductor circuit 1 is attached, and 3 is a pin for connecting the semiconductor circuit 1 to an external circuit. Although the figure shows a case where there are two pins, the number of pins is not limited to this, and any number of pins may be used. Further, the shapes of the package and the substrate 2 are not limited to those shown in the figures, and may be any shape.

4 is a conductor having spring properties (elasticity) attached so that one end thereof comes into contact with one of the pins 3. The other end of the spring conductor 4 is connected to a predetermined conductor portion of the semiconductor circuit 1. As the material of the spring conductor 4, for example, phosphor bronze is used. The operation of the device configured as described above will be explained as follows.

The spring conductor 4 normally short-circuits the conductor portion of the semiconductor circuit 1 and the pin 3 as shown in the figure. Such short circuits occur when static electricity or electromagnetic waves are applied during this time, causing damage to internal elements (e.g.
This test shall be performed between terminals where the MOSFET may be destroyed. In other words, if there is a risk of electrostatic damage to internal elements when a high-voltage electric field is applied,
Such points are short-circuited in advance using the spring conductor 4. If this is done, a high-voltage electric field will not be applied, so that the internal elements, and therefore the semiconductor circuit 1, will be protected.

FIG. 2 is a diagram showing the semiconductor package shown in FIG. 1 attached to a printed board. 1st
Components that are the same as those in the figures are indicated by the same numbers. 1
1 is a printed board, and 12 is a socket attached to the printed board 11. The socket 12 is fixed to the printed board 11 by soldering a pin 13 provided at its bottom to the printed board 11. 14 is solder. A pin holder 15 is electrically connected to the socket pin 13 and is provided inside the socket.

The semiconductor circuit 1 is inserted into the thus constructed socket 12 via the pins 3. Pin 3 is
The semiconductor circuit 1 is held by a pin holder 15 within the socket 12, thereby connecting the semiconductor circuit 1 to an electric circuit (not shown) configured on the printed board 11. When the semiconductor package is inserted into the socket 12, the spring conductor 4, which was previously in contact with the pin 3, is forced outwardly into the socket 12. As a result, the contact between the predetermined conductor portion of the semiconductor circuit 1 and the pin 3 is broken. However, instead, an electric circuit configured on the printed board 11 is connected to the short-circuited portion of the spring conductor 4, so that a high-voltage electric field is no longer directly applied to that portion. On the other hand, even though the semiconductor circuit 1 is incorporated into a part of the electric circuit, it is inconvenient that the conductor part and the pin 3 are short-circuited. Therefore, when the semiconductor circuit 1 is encapsulated in the socket 12, the spring conductor 4 must be removed from the pin 3. Advantageously, according to the device shown, the spring conductor 4 cannot come into contact with the pin 3 due to the physical constraints of the socket 12.

In the above description, a case has been described in which a semiconductor circuit is attached to a printed board, but the present invention is not limited to this, and can be applied to all cases in which a semiconductor circuit and other electric circuits are connected. FIG. 3 is a mechanical configuration diagram showing another embodiment of the present invention. The figure shows a state in which a laser diode as a semiconductor circuit is connected to a socket. In the figure, 21 is a housing, 22 is a circuit case, 23 is a laser diode, 24 is a socket in which the laser diode 23 is sealed, 25 is a socket terminal of the socket 24, and 26 is a board.
Laser diode 23 is connected to an external electrical circuit via socket terminal 25. Although not shown in the figure, an electric circuit (for example, a driving circuit for the laser diode 23) is enclosed in the substrate 26, and this electric circuit and the socket terminal 25 are connected.

27 is a lens that focuses the light emitted from the laser diode 23, 28 is a lens case, and 29 is a lens 27.
30 is a repulsion spring for absorbing the play of the lens case 28, 31 is a ground spring for bringing the case of the laser diode 23 to ground potential (the potential of the circuit case 22),
32 is a board holding screw for holding down the board 26, 33 is a cover, and 34 is a rubber button.

A spring conductor 35 similar to that shown in FIG. 1 is attached to the laser diode 23 (in FIG. 3, the spring conductor 35 and the laser diode 23 are shown integrally in black). ).

In the device configured in this manner, when the laser diode 23 is not inserted into the socket 24, the spring conductor 35 is connected to the laser diode 2.
A predetermined conductor portion of 3 and the pin portion are short-circuited to protect the laser diode 23 from the case where a high electric field is applied. When this laser diode 23 is inserted into the socket 24, the spring conductor 35 is physically unable to make contact with the pin of the laser diode 23, and the contact is broken. Instead, an external electric circuit is connected via the socket terminal 25 to the portion that was previously protected by the spring conductor 35, so that a high voltage electric field is no longer applied directly to the laser diode 23, and the laser Diode 23 is protected. The circumstances during this time are similar to those shown in FIG.

The above-mentioned spring conductor is not necessarily limited to the shape shown in the figure; any spring conductor may be used as long as the contact between the predetermined conductor part of the semiconductor circuit and the pin is broken when the semiconductor circuit is inserted into the socket. It may have a similar structure. Further, the contact with the pin does not have to be limited to one, and may be structured to contact with multiple pins at the same time. It may also be configured such that it is short-circuited.

(Effects of the invention) As explained in detail above, according to the invention,
Normally, the conductor part of the semiconductor circuit and the pin of the semiconductor circuit are short-circuited, and the contact between the conductor part and the pin is broken when the semiconductor circuit is inserted into the socket, thereby making it easy to attach and detach. It is possible to realize a semiconductor circuit protection device that can reliably protect elements in the circuit from electrostatic damage and the like.

[Brief explanation of the drawing]

Figure 1 is a mechanical configuration diagram showing one embodiment of the present invention, Figure 2 is a diagram showing the semiconductor package shown in Figure 1 attached to a printed board, and Figure 3 is another embodiment of the present invention. FIG. 1...Semiconductor circuit, 2...Substrate, 3, 13...
Pin, 4, 35... Spring conductor, 11... Printed board, 12, 24... Socket, 14... Solder, 15... Pin holder, 21... Housing, 22...
...Circuit case, 23...Laser diode, 25
...Socket terminal, 26 ... Board, 27 ... Lens, 28 ... Lens case, 29 ... Lens fixing screw, 30 ... Repulsion spring, 31 ... Earth spring,
32... Board holding screw, 33... Cover, 34
...Rubber bumps.

Claims (1)

[Scope of utility model registration request] A semiconductor circuit package is provided with a plurality of connection pins for connection to an external socket, and a spring conductor is provided at a predetermined position on the package to enable short-circuiting between these pins and a conductor portion of the semiconductor circuit within the package. A protection device for a semiconductor circuit, characterized in that the contact between the pin and the conductor portion is broken by inserting the package into an external socket.