JPS60179046U - Semiconductor circuit protection device - Google Patents
Semiconductor circuit protection deviceInfo
- Publication number
- JPS60179046U JPS60179046U JP6819284U JP6819284U JPS60179046U JP S60179046 U JPS60179046 U JP S60179046U JP 6819284 U JP6819284 U JP 6819284U JP 6819284 U JP6819284 U JP 6819284U JP S60179046 U JPS60179046 U JP S60179046U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor circuit
- protection device
- package
- circuit protection
- conductor portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す機械的構成図、第２図
は第１図に示す半導体パッケージをプリント板に取り付
けた状態を示す図、第３図は本考案の他の実施例を示す
機械的構成図である。
１・・・半導体回路、２・・・基板、３，１３・・・ピ
ン、４．３５・・・バネ性導体、１１・・・プリント板
、１２．２４・・・ソケット、１４・・・ハンダ、１５
・・・ピンホルダ、２１・・・筐体、２２・・・回路ケ
ース、２３・・・レーザダイオード、２５・・・ソケッ
ト端子、２６・・・基板、２７・・・レンズ、２８・・
・レンズケース、２９・・・レンズ固定ネジ、３０・・
・反発バネ、３１・・・アースバネ、３２・・・基板押
さえネジ、３３・・・カバー、３４・・・ゴムブツシュ
。Figure 1 is a mechanical configuration diagram showing one embodiment of the present invention, Figure 2 is a diagram showing the semiconductor package shown in Figure 1 attached to a printed board, and Figure 3 is another embodiment of the present invention. FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor circuit, 2... Board, 3, 13... Pin, 4.35... Spring conductor, 11... Printed board, 12.24... Socket, 14... Solder, 15
... Pin holder, 21 ... Housing, 22 ... Circuit case, 23 ... Laser diode, 25 ... Socket terminal, 26 ... Board, 27 ... Lens, 28 ...
・Lens case, 29... Lens fixing screw, 30...
- Repulsion spring, 31... Earth spring, 32... Board holding screw, 33... Cover, 34... Rubber bush.
Claims (1)
の複数個の接続用ピンを設け、該パッケージの所定の位
置にこれらピンとパッケージ内半導体回路の導体部分と
を短絡可納能にするためのバネ性導体を設け、ピンと導
体部分との接触はパッケージを外部ソケットに挿入する
ことにより断たれるように構成したことを特徴とする半
導体回路の保護装置。A semiconductor circuit package is provided with a plurality of connection pins for connection to an external socket, and a spring conductor is provided at a predetermined position of the package to enable short-circuiting between these pins and a conductor portion of the semiconductor circuit within the package. A protection device for a semiconductor circuit, characterized in that the contact between the pin and the conductor portion is broken by inserting the package into an external socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6819284U JPS60179046U (en) | 1984-05-09 | 1984-05-09 | Semiconductor circuit protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6819284U JPS60179046U (en) | 1984-05-09 | 1984-05-09 | Semiconductor circuit protection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60179046U true JPS60179046U (en) | 1985-11-28 |
| JPH0135483Y2 JPH0135483Y2 (en) | 1989-10-30 |
Family
ID=30602721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6819284U Granted JPS60179046U (en) | 1984-05-09 | 1984-05-09 | Semiconductor circuit protection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60179046U (en) |
-
1984
- 1984-05-09 JP JP6819284U patent/JPS60179046U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0135483Y2 (en) | 1989-10-30 |
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