JPH0134353Y2 - - Google Patents
Info
- Publication number
- JPH0134353Y2 JPH0134353Y2 JP15763680U JP15763680U JPH0134353Y2 JP H0134353 Y2 JPH0134353 Y2 JP H0134353Y2 JP 15763680 U JP15763680 U JP 15763680U JP 15763680 U JP15763680 U JP 15763680U JP H0134353 Y2 JPH0134353 Y2 JP H0134353Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- transistor
- flat plate
- heat sink
- bottom edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15763680U JPH0134353Y2 (US07488766-20090210-C00029.png) | 1980-11-04 | 1980-11-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15763680U JPH0134353Y2 (US07488766-20090210-C00029.png) | 1980-11-04 | 1980-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5780847U JPS5780847U (US07488766-20090210-C00029.png) | 1982-05-19 |
| JPH0134353Y2 true JPH0134353Y2 (US07488766-20090210-C00029.png) | 1989-10-19 |
Family
ID=29516741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15763680U Expired JPH0134353Y2 (US07488766-20090210-C00029.png) | 1980-11-04 | 1980-11-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0134353Y2 (US07488766-20090210-C00029.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0510395Y2 (US07488766-20090210-C00029.png) * | 1986-09-09 | 1993-03-15 | ||
| JP2012231043A (ja) * | 2011-04-27 | 2012-11-22 | Lsi Cooler Co Ltd | ヒートシンク |
-
1980
- 1980-11-04 JP JP15763680U patent/JPH0134353Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5780847U (US07488766-20090210-C00029.png) | 1982-05-19 |
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