JPH0134309Y2 - - Google Patents
Info
- Publication number
- JPH0134309Y2 JPH0134309Y2 JP1985080729U JP8072985U JPH0134309Y2 JP H0134309 Y2 JPH0134309 Y2 JP H0134309Y2 JP 1985080729 U JP1985080729 U JP 1985080729U JP 8072985 U JP8072985 U JP 8072985U JP H0134309 Y2 JPH0134309 Y2 JP H0134309Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- wall
- partition wall
- planting
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005192 partition Methods 0.000 claims description 30
- 238000000926 separation method Methods 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 11
- 239000011295 pitch Substances 0.000 claims description 11
- 230000002950 deficient Effects 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 1
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 1
- 102100027340 Slit homolog 2 protein Human genes 0.000 description 1
- 101710133576 Slit homolog 2 protein Proteins 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connecting Device With Holders (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985080729U JPH0134309Y2 (en, 2012) | 1985-05-29 | 1985-05-29 | |
| US06/868,047 US4690646A (en) | 1985-05-29 | 1986-05-29 | IC package connector with contacts of high density |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985080729U JPH0134309Y2 (en, 2012) | 1985-05-29 | 1985-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61194976U JPS61194976U (en, 2012) | 1986-12-04 |
| JPH0134309Y2 true JPH0134309Y2 (en, 2012) | 1989-10-18 |
Family
ID=13726460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985080729U Expired JPH0134309Y2 (en, 2012) | 1985-05-29 | 1985-05-29 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4690646A (en, 2012) |
| JP (1) | JPH0134309Y2 (en, 2012) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0672907B2 (ja) * | 1988-07-15 | 1994-09-14 | 安藤電気株式会社 | 測定用端子に対するｉｃの接触・離し機構 |
| US5055972A (en) * | 1990-01-23 | 1991-10-08 | Kel Corporation | Chip carrier socket |
| US5252079A (en) * | 1992-02-10 | 1993-10-12 | Amp Incorporated | Method of manufacture of a contact guide |
| US5588847A (en) * | 1995-04-13 | 1996-12-31 | Tate; John O. | Chip carrier mounting system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4166665A (en) * | 1976-12-27 | 1979-09-04 | Cutchaw John M | Liquid cooled connector for large scale integrated circuit packages |
-
1985
- 1985-05-29 JP JP1985080729U patent/JPH0134309Y2/ja not_active Expired
-
1986
- 1986-05-29 US US06/868,047 patent/US4690646A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61194976U (en, 2012) | 1986-12-04 |
| US4690646A (en) | 1987-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2554301B2 (ja) | カードエッヂコネクタ装置 | |
| US5012924A (en) | Carriers for integrated circuits and the like | |
| JPS61116783A (ja) | 格子配列形ｉｃパツケ−ジ用ソケツト | |
| JPH0134309Y2 (en, 2012) | ||
| JPS61278159A (ja) | Ｉｃパツケ−ジ用キヤリア | |
| US4093330A (en) | Circuit chip receptacle | |
| JPH0217430Y2 (en, 2012) | ||
| JPS63296252A (ja) | 樹脂封止型半導体装置 | |
| JPS6281739A (ja) | Ｉｃパツケ−ジ | |
| JPH0642345Y2 (ja) | 半導体装置 | |
| JP2759637B2 (ja) | Ｉｃソケット | |
| JPH0211790Y2 (en, 2012) | ||
| JP2734419B2 (ja) | Ｉｃソケット | |
| KR950002717Y1 (ko) | 반도체 패키지 포장용 트레이 | |
| JPH0211789Y2 (en, 2012) | ||
| JP2635219B2 (ja) | Ｉｃソケット | |
| EP0426306B1 (en) | IC socket | |
| KR200169136Y1 (ko) | 메터리얼 볼 그리드 어레이 패키지 보트(Material ball grid array package boat) | |
| JPH0128816Y2 (en, 2012) | ||
| JPS58142554A (ja) | リ−ドフレ−ム | |
| JPH0128815Y2 (en, 2012) | ||
| JPS5833672B2 (ja) | 端子ブロツク | |
| JPH0348863Y2 (en, 2012) | ||
| JPH0625959Y2 (ja) | 半導体装置 | |
| JPH04284660A (ja) | 半導体装置 |