JPH0132655B2 - - Google Patents

Info

Publication number
JPH0132655B2
JPH0132655B2 JP402782A JP402782A JPH0132655B2 JP H0132655 B2 JPH0132655 B2 JP H0132655B2 JP 402782 A JP402782 A JP 402782A JP 402782 A JP402782 A JP 402782A JP H0132655 B2 JPH0132655 B2 JP H0132655B2
Authority
JP
Japan
Prior art keywords
wire
tool
lead
bonding
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP402782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58122742A (ja
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57004027A priority Critical patent/JPS58122742A/ja
Publication of JPS58122742A publication Critical patent/JPS58122742A/ja
Publication of JPH0132655B2 publication Critical patent/JPH0132655B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP57004027A 1982-01-16 1982-01-16 ワイヤボンデイング方法 Granted JPS58122742A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57004027A JPS58122742A (ja) 1982-01-16 1982-01-16 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57004027A JPS58122742A (ja) 1982-01-16 1982-01-16 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS58122742A JPS58122742A (ja) 1983-07-21
JPH0132655B2 true JPH0132655B2 (enExample) 1989-07-10

Family

ID=11573474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57004027A Granted JPS58122742A (ja) 1982-01-16 1982-01-16 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS58122742A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020208850A1 (ja) * 2019-04-09 2020-10-15 株式会社カイジョー 絶縁被覆線の接合方法、接続構造、絶縁被覆線の剥離方法及びボンディング装置

Also Published As

Publication number Publication date
JPS58122742A (ja) 1983-07-21

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