JPH0132364Y2 - - Google Patents
Info
- Publication number
- JPH0132364Y2 JPH0132364Y2 JP1985030456U JP3045685U JPH0132364Y2 JP H0132364 Y2 JPH0132364 Y2 JP H0132364Y2 JP 1985030456 U JP1985030456 U JP 1985030456U JP 3045685 U JP3045685 U JP 3045685U JP H0132364 Y2 JPH0132364 Y2 JP H0132364Y2
- Authority
- JP
- Japan
- Prior art keywords
- crystallized glass
- gold
- eutectic solder
- substrate
- terminal portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985030456U JPH0132364Y2 (enEXAMPLES) | 1985-03-04 | 1985-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985030456U JPH0132364Y2 (enEXAMPLES) | 1985-03-04 | 1985-03-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61146958U JPS61146958U (enEXAMPLES) | 1986-09-10 |
| JPH0132364Y2 true JPH0132364Y2 (enEXAMPLES) | 1989-10-03 |
Family
ID=30530170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985030456U Expired JPH0132364Y2 (enEXAMPLES) | 1985-03-04 | 1985-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0132364Y2 (enEXAMPLES) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4234367A (en) * | 1979-03-23 | 1980-11-18 | International Business Machines Corporation | Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors |
| JPS60170286A (ja) * | 1984-02-14 | 1985-09-03 | 富士通株式会社 | ガラスセラミツク基板の製造方法 |
| JPS60198763A (ja) * | 1984-03-22 | 1985-10-08 | Nec Corp | ピン付基板およびその製造方法 |
| JPS60198760A (ja) * | 1984-03-22 | 1985-10-08 | Nec Corp | ろう付け方法 |
-
1985
- 1985-03-04 JP JP1985030456U patent/JPH0132364Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61146958U (enEXAMPLES) | 1986-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4827082A (en) | Ceramic package | |
| JP2572823B2 (ja) | セラミック接合体 | |
| JPH0132364Y2 (enEXAMPLES) | ||
| JP2517024B2 (ja) | セラミックパッケ―ジとその製造方法 | |
| JP2735708B2 (ja) | セラミック配線基板 | |
| JP2813073B2 (ja) | 半導体素子収納用パッケージ | |
| JP2813072B2 (ja) | 半導体素子収納用パッケージ | |
| JP2501278B2 (ja) | 半導体パッケ―ジ | |
| JP2813074B2 (ja) | 半導体素子収納用パッケージ | |
| JP3450167B2 (ja) | 半導体素子収納用パッケージ | |
| JP2601313B2 (ja) | 半導体素子収納用パッケージ | |
| JP2710893B2 (ja) | リード付き電子部品 | |
| JP3638294B2 (ja) | セラミックス基板と金属端子との接合体の製造方法及びその接合体を容器とする半導体装置の製造方法 | |
| JPH01149378A (ja) | セラミック基体のリード取り付け構造 | |
| KR100264644B1 (ko) | 모듈 패키지 | |
| JPS638621B2 (enEXAMPLES) | ||
| JP2866962B2 (ja) | 半導体素子収納用パッケージの製造方法 | |
| JPH0272696A (ja) | セラミックス回路基板 | |
| JPH0477467B2 (enEXAMPLES) | ||
| JPH0545064B2 (enEXAMPLES) | ||
| JPS60136390A (ja) | セラミツクモジユ−ル | |
| JPS60113450A (ja) | 外部リ−ド端子の接合構造 | |
| JPH04266052A (ja) | 半導体素子収納用パッケージ | |
| JPH04168751A (ja) | 半導体素子収納用パッケージ | |
| JP2002353359A (ja) | 電子部品収納用容器 |