JPH0131299B2 - - Google Patents

Info

Publication number
JPH0131299B2
JPH0131299B2 JP58187429A JP18742983A JPH0131299B2 JP H0131299 B2 JPH0131299 B2 JP H0131299B2 JP 58187429 A JP58187429 A JP 58187429A JP 18742983 A JP18742983 A JP 18742983A JP H0131299 B2 JPH0131299 B2 JP H0131299B2
Authority
JP
Japan
Prior art keywords
ceramic substrate
adhesive layer
heat sink
silicon
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58187429A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6079757A (ja
Inventor
Ryoichi Ito
Yukio Shimazaki
Satoru Ogiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Hitachi Ltd
Original Assignee
Hitachi Cable Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd, Hitachi Ltd filed Critical Hitachi Cable Ltd
Priority to JP18742983A priority Critical patent/JPS6079757A/ja
Publication of JPS6079757A publication Critical patent/JPS6079757A/ja
Publication of JPH0131299B2 publication Critical patent/JPH0131299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP18742983A 1983-10-06 1983-10-06 セラミツク基板パツケ−ジ Granted JPS6079757A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18742983A JPS6079757A (ja) 1983-10-06 1983-10-06 セラミツク基板パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18742983A JPS6079757A (ja) 1983-10-06 1983-10-06 セラミツク基板パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6079757A JPS6079757A (ja) 1985-05-07
JPH0131299B2 true JPH0131299B2 (enrdf_load_stackoverflow) 1989-06-26

Family

ID=16205898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18742983A Granted JPS6079757A (ja) 1983-10-06 1983-10-06 セラミツク基板パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6079757A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0543483Y2 (enrdf_load_stackoverflow) * 1987-10-12 1993-11-02
JPH07297560A (ja) * 1994-04-28 1995-11-10 Hitachi Ltd 多層プリント配線基板およびその実装構造体
WO2018033992A1 (ja) * 2016-08-18 2018-02-22 デンカ株式会社 熱伝導性グリース用組成物、熱伝導性グリース及び放熱部材

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54106173A (en) * 1978-02-08 1979-08-20 Nec Corp Semiconductor device
JPS562349A (en) * 1979-06-21 1981-01-12 Toshiba Silicone Co Ltd Molded rubber article for heat dissipation
JPS5944152B2 (ja) * 1979-07-04 1984-10-26 セイコーインスツルメンツ株式会社 気密チヤンバ
JPS5656272U (enrdf_load_stackoverflow) * 1979-10-04 1981-05-15
JPS57168247U (enrdf_load_stackoverflow) * 1981-04-17 1982-10-23
JPS5821446A (ja) * 1981-07-29 1983-02-08 Hitachi Cable Ltd 熱伝導性絶縁シ−トの製造方法

Also Published As

Publication number Publication date
JPS6079757A (ja) 1985-05-07

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