JPH0130302B2 - - Google Patents

Info

Publication number
JPH0130302B2
JPH0130302B2 JP55093255A JP9325580A JPH0130302B2 JP H0130302 B2 JPH0130302 B2 JP H0130302B2 JP 55093255 A JP55093255 A JP 55093255A JP 9325580 A JP9325580 A JP 9325580A JP H0130302 B2 JPH0130302 B2 JP H0130302B2
Authority
JP
Japan
Prior art keywords
guide rail
lead frame
soldering
terminals
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55093255A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5718330A (en
Inventor
Kazuo Numajiri
Juji Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP9325580A priority Critical patent/JPS5718330A/ja
Publication of JPS5718330A publication Critical patent/JPS5718330A/ja
Publication of JPH0130302B2 publication Critical patent/JPH0130302B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9325580A 1980-07-10 1980-07-10 Method of and apparatus for soldering semiconductor device Granted JPS5718330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9325580A JPS5718330A (en) 1980-07-10 1980-07-10 Method of and apparatus for soldering semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9325580A JPS5718330A (en) 1980-07-10 1980-07-10 Method of and apparatus for soldering semiconductor device

Publications (2)

Publication Number Publication Date
JPS5718330A JPS5718330A (en) 1982-01-30
JPH0130302B2 true JPH0130302B2 (en, 2012) 1989-06-19

Family

ID=14077385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9325580A Granted JPS5718330A (en) 1980-07-10 1980-07-10 Method of and apparatus for soldering semiconductor device

Country Status (1)

Country Link
JP (1) JPS5718330A (en, 2012)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128051A (en) * 1981-02-02 1982-08-09 Hitachi Ltd Soldering method and apparatus for semiconductor product
JPS58158993A (ja) * 1982-03-17 1983-09-21 株式会社日立製作所 電子部品の半田処理方法および装置
JP2604454B2 (ja) * 1988-12-23 1997-04-30 信越化学工業株式会社 シングルモード型光ファイバープリフォームの製造方法
JP2539093B2 (ja) * 1990-10-25 1996-10-02 三菱マテリアル株式会社 リ―ドフレ―ムとその製造方法及び半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039063A (en, 2012) * 1973-08-08 1975-04-10
JPS5065173A (en, 2012) * 1973-10-09 1975-06-02
JPS5322365A (en) * 1976-08-13 1978-03-01 Hitachi Ltd Resin mold type semiconductor device and its production
JPS5439228A (en) * 1977-09-02 1979-03-26 Hitachi Ltd Evaporation type combustion device

Also Published As

Publication number Publication date
JPS5718330A (en) 1982-01-30

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