JPH01301029A - 基板バックアップ装置 - Google Patents
基板バックアップ装置Info
- Publication number
- JPH01301029A JPH01301029A JP1089115A JP8911589A JPH01301029A JP H01301029 A JPH01301029 A JP H01301029A JP 1089115 A JP1089115 A JP 1089115A JP 8911589 A JP8911589 A JP 8911589A JP H01301029 A JPH01301029 A JP H01301029A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- backup
- holes
- size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 69
- 239000011248 coating agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/03—Stationary work or tool supports
- B23Q1/032—Stationary work or tool supports characterised by properties of the support surface
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1089115A JPH01301029A (ja) | 1989-04-07 | 1989-04-07 | 基板バックアップ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1089115A JPH01301029A (ja) | 1989-04-07 | 1989-04-07 | 基板バックアップ装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57139613A Division JPS5929492A (ja) | 1982-08-10 | 1982-08-10 | 電子部品自動装着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01301029A true JPH01301029A (ja) | 1989-12-05 |
| JPH0440133B2 JPH0440133B2 (enrdf_load_stackoverflow) | 1992-07-01 |
Family
ID=13961896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1089115A Granted JPH01301029A (ja) | 1989-04-07 | 1989-04-07 | 基板バックアップ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01301029A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015009169A (ja) * | 2013-06-26 | 2015-01-19 | パナソニック株式会社 | プラズマ処理装置、および、プラズマ処理方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55179081U (enrdf_load_stackoverflow) * | 1979-06-11 | 1980-12-23 | ||
| JPS56114600U (enrdf_load_stackoverflow) * | 1980-02-05 | 1981-09-03 | ||
| JPS57104574U (enrdf_load_stackoverflow) * | 1980-12-17 | 1982-06-28 |
-
1989
- 1989-04-07 JP JP1089115A patent/JPH01301029A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55179081U (enrdf_load_stackoverflow) * | 1979-06-11 | 1980-12-23 | ||
| JPS56114600U (enrdf_load_stackoverflow) * | 1980-02-05 | 1981-09-03 | ||
| JPS57104574U (enrdf_load_stackoverflow) * | 1980-12-17 | 1982-06-28 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015009169A (ja) * | 2013-06-26 | 2015-01-19 | パナソニック株式会社 | プラズマ処理装置、および、プラズマ処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0440133B2 (enrdf_load_stackoverflow) | 1992-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2016199207A1 (ja) | 印刷装置及び対基板作業装置 | |
| JPH0377679B2 (enrdf_load_stackoverflow) | ||
| JP7366146B2 (ja) | 基板支持ピン設置用治具、基板支持ピン設置方法 | |
| JPH02187166A (ja) | 液体付着装置及び方法 | |
| JP2009135215A (ja) | 基板位置決め装置及び基板位置決め方法 | |
| JP2811900B2 (ja) | 基板の位置決め装置 | |
| JPH01301029A (ja) | 基板バックアップ装置 | |
| JP2000124690A (ja) | マウンタの基板セット装置およびバックアップピン切替方法 | |
| JP2006186077A (ja) | プリント基板支持装置 | |
| JP4718225B2 (ja) | 印刷装置 | |
| JPH03213223A (ja) | 工作物支持装置 | |
| JP2707752B2 (ja) | スクリーン印刷装置における基板の支持装置 | |
| JPH01262700A (ja) | 基板位置決め装置 | |
| JP3758932B2 (ja) | マウンタの基板セット装置及びバックアップピン切替え方法 | |
| JP3718912B2 (ja) | 電子部品実装装置における基板下受けピンのセット方法 | |
| JPH04269900A (ja) | チップ配列モジュール及び複数のチップを回路基板に配置する方法 | |
| JP2637994B2 (ja) | スクリーン印刷機 | |
| JPH08279695A (ja) | プリント基板支持装置 | |
| JP2025064048A (ja) | 基板支持装置および基板処理装置 | |
| JPH11274800A (ja) | 基板保持固定装置 | |
| JPH01146400A (ja) | 基板サポート装置 | |
| JPH07153816A (ja) | 基板移載方法および装置 | |
| JPH0652197U (ja) | 基板支持装置 | |
| JPH0528100U (ja) | 基板バツクアツプ装置 | |
| CN111670612B (zh) | 用于模板印刷机的边缘锁定组装件 |