JPH0129979Y2 - - Google Patents

Info

Publication number
JPH0129979Y2
JPH0129979Y2 JP1984027083U JP2708384U JPH0129979Y2 JP H0129979 Y2 JPH0129979 Y2 JP H0129979Y2 JP 1984027083 U JP1984027083 U JP 1984027083U JP 2708384 U JP2708384 U JP 2708384U JP H0129979 Y2 JPH0129979 Y2 JP H0129979Y2
Authority
JP
Japan
Prior art keywords
circuit
terminal
board
flat package
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984027083U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60141155U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984027083U priority Critical patent/JPS60141155U/ja
Priority to US06/701,211 priority patent/US4656442A/en
Priority to IT8547722A priority patent/IT1180736B/it
Publication of JPS60141155U publication Critical patent/JPS60141155U/ja
Application granted granted Critical
Publication of JPH0129979Y2 publication Critical patent/JPH0129979Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1984027083U 1984-02-27 1984-02-27 混成回路 Granted JPS60141155U (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1984027083U JPS60141155U (ja) 1984-02-27 1984-02-27 混成回路
US06/701,211 US4656442A (en) 1984-02-27 1985-02-13 Hybrid circuit device
IT8547722A IT1180736B (it) 1984-02-27 1985-02-25 Dispositivo a circuito ibrido

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984027083U JPS60141155U (ja) 1984-02-27 1984-02-27 混成回路

Publications (2)

Publication Number Publication Date
JPS60141155U JPS60141155U (ja) 1985-09-18
JPH0129979Y2 true JPH0129979Y2 (US07902200-20110308-C00004.png) 1989-09-12

Family

ID=30523699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984027083U Granted JPS60141155U (ja) 1984-02-27 1984-02-27 混成回路

Country Status (1)

Country Link
JP (1) JPS60141155U (US07902200-20110308-C00004.png)

Also Published As

Publication number Publication date
JPS60141155U (ja) 1985-09-18

Similar Documents

Publication Publication Date Title
JP4400965B2 (ja) 積層化半導体パッケージ及びその製造方法
US4506238A (en) Hybrid circuit device
US6028352A (en) IC stack utilizing secondary leadframes
JPS63206166A (ja) 大電力パワ−モジユ−ル
JP2002512431A (ja) 単純化したマイクロエレクトロニクス・コネクターおよび製造方法
JPH0129979Y2 (US07902200-20110308-C00004.png)
US4656442A (en) Hybrid circuit device
JPH11135571A (ja) ボールグリッドアレイ半導体パッケージ
US4628597A (en) Method of making an electrical connector
US6424025B1 (en) Cross grid array package structure and method of manufacture
JPH0130786Y2 (US07902200-20110308-C00004.png)
JPH025491Y2 (US07902200-20110308-C00004.png)
JPH0393257A (ja) 樹脂封止型半導体装置
KR100253393B1 (ko) 반도체 패키지
JPH0473298B2 (US07902200-20110308-C00004.png)
JPS6233345Y2 (US07902200-20110308-C00004.png)
JPS61128550A (ja) 半導体装置
CA1175957A (en) Integrated circuit package
JPS6314470Y2 (US07902200-20110308-C00004.png)
JPS59189662A (ja) 樹脂封止型半導体装置
JPH05136327A (ja) 半導体パツケージ
JPS5889953U (ja) 混成回路
KR900008256Y1 (ko) 평면 부착형 다연결 인덕터
JPS62249464A (ja) 半導体パツケ−ジ
JPH0536886A (ja) 半導体装置とその製造方法