IT1180736B - Dispositivo a circuito ibrido - Google Patents
Dispositivo a circuito ibridoInfo
- Publication number
- IT1180736B IT1180736B IT8547722A IT4772285A IT1180736B IT 1180736 B IT1180736 B IT 1180736B IT 8547722 A IT8547722 A IT 8547722A IT 4772285 A IT4772285 A IT 4772285A IT 1180736 B IT1180736 B IT 1180736B
- Authority
- IT
- Italy
- Prior art keywords
- circuit device
- hybrid circuit
- hybrid
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/30—Time-delay networks
- H03H7/32—Time-delay networks with lumped inductance and capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984027082U JPS60141154U (ja) | 1984-02-27 | 1984-02-27 | 混成回路 |
JP1984027081U JPS60141153U (ja) | 1984-02-27 | 1984-02-27 | 混成回路 |
JP1984027083U JPS60141155U (ja) | 1984-02-27 | 1984-02-27 | 混成回路 |
Publications (3)
Publication Number | Publication Date |
---|---|
IT8547722A0 IT8547722A0 (it) | 1985-02-25 |
IT8547722A1 IT8547722A1 (it) | 1986-08-25 |
IT1180736B true IT1180736B (it) | 1987-09-23 |
Family
ID=27285655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8547722A IT1180736B (it) | 1984-02-27 | 1985-02-25 | Dispositivo a circuito ibrido |
Country Status (2)
Country | Link |
---|---|
US (1) | US4656442A (it) |
IT (1) | IT1180736B (it) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4743868A (en) * | 1985-04-03 | 1988-05-10 | Nippondenso Co., Ltd. | High frequency filter for electric instruments |
JPS63129652A (ja) * | 1986-11-20 | 1988-06-02 | Toshiba Corp | 半導体装置 |
US4763223A (en) * | 1986-12-05 | 1988-08-09 | Babcock Display Products, Inc. | Non-soldered lead apparatus |
JPH01112681A (ja) * | 1987-07-31 | 1989-05-01 | Toshiba Corp | ハイブリッド化プリント基板 |
US4791075A (en) * | 1987-10-05 | 1988-12-13 | Motorola, Inc. | Process for making a hermetic low cost pin grid array package |
JPH0620731A (ja) * | 1992-07-01 | 1994-01-28 | Mitsubishi Electric Corp | リード、集積回路装置の組立方法、集積回路装置、導電路提供用リードおよび導電路提供方法 |
US6079332A (en) * | 1996-11-01 | 2000-06-27 | The Ensign-Bickford Company | Shock-resistant electronic circuit assembly |
US6311621B1 (en) | 1996-11-01 | 2001-11-06 | The Ensign-Bickford Company | Shock-resistant electronic circuit assembly |
US7723993B2 (en) * | 2002-09-05 | 2010-05-25 | Midtronics, Inc. | Electronic battery tester configured to predict a load test result based on open circuit voltage, temperature, cranking size rating, and a dynamic parameter |
CN106298713A (zh) * | 2015-06-09 | 2017-01-04 | 台达电子工业股份有限公司 | 一种垂直连接的功率模块及其堆叠连接的引脚 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2607821A (en) * | 1949-02-05 | 1952-08-19 | Erie Resistor Corp | Electric circuit assembly |
US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
CA970882A (en) * | 1972-06-09 | 1975-07-08 | Kenneth J. Moyle | Semiconductor device packaging |
DE3021289A1 (de) * | 1980-06-06 | 1981-12-17 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Elektrischer baustein in schichtschaltungstechnik |
US4423468A (en) * | 1980-10-01 | 1983-12-27 | Motorola, Inc. | Dual electronic component assembly |
US4506238A (en) * | 1981-12-14 | 1985-03-19 | Toko, Inc. | Hybrid circuit device |
US4521828A (en) * | 1982-12-23 | 1985-06-04 | At&T Technologies, Inc. | Component module for piggyback mounting on a circuit package having dual-in-line leads |
-
1985
- 1985-02-13 US US06/701,211 patent/US4656442A/en not_active Expired - Fee Related
- 1985-02-25 IT IT8547722A patent/IT1180736B/it active
Also Published As
Publication number | Publication date |
---|---|
IT8547722A1 (it) | 1986-08-25 |
IT8547722A0 (it) | 1985-02-25 |
US4656442A (en) | 1987-04-07 |
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