JPH0129794Y2 - - Google Patents
Info
- Publication number
- JPH0129794Y2 JPH0129794Y2 JP3827284U JP3827284U JPH0129794Y2 JP H0129794 Y2 JPH0129794 Y2 JP H0129794Y2 JP 3827284 U JP3827284 U JP 3827284U JP 3827284 U JP3827284 U JP 3827284U JP H0129794 Y2 JPH0129794 Y2 JP H0129794Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component
- rotating shaft
- leads
- support base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3827284U JPS60151671U (ja) | 1984-03-16 | 1984-03-16 | 電子部品予備半田付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3827284U JPS60151671U (ja) | 1984-03-16 | 1984-03-16 | 電子部品予備半田付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60151671U JPS60151671U (ja) | 1985-10-08 |
| JPH0129794Y2 true JPH0129794Y2 (es) | 1989-09-11 |
Family
ID=30545118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3827284U Granted JPS60151671U (ja) | 1984-03-16 | 1984-03-16 | 電子部品予備半田付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60151671U (es) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0344376Y2 (es) * | 1988-08-01 | 1991-09-18 | ||
| WO2010103861A1 (ja) * | 2009-03-13 | 2010-09-16 | 株式会社村田製作所 | 電子部品の半田付け方法及び装置 |
-
1984
- 1984-03-16 JP JP3827284U patent/JPS60151671U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60151671U (ja) | 1985-10-08 |
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