JPH0129441B2 - - Google Patents

Info

Publication number
JPH0129441B2
JPH0129441B2 JP58249337A JP24933783A JPH0129441B2 JP H0129441 B2 JPH0129441 B2 JP H0129441B2 JP 58249337 A JP58249337 A JP 58249337A JP 24933783 A JP24933783 A JP 24933783A JP H0129441 B2 JPH0129441 B2 JP H0129441B2
Authority
JP
Japan
Prior art keywords
inductance
semiconductor chip
frequency
electrodes
internal matching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58249337A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60140738A (ja
Inventor
Kyoichi Ishii
Hiromoto Yamawaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58249337A priority Critical patent/JPS60140738A/ja
Publication of JPS60140738A publication Critical patent/JPS60140738A/ja
Publication of JPH0129441B2 publication Critical patent/JPH0129441B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Microwave Amplifiers (AREA)
JP58249337A 1983-12-27 1983-12-27 高周波高出力トランジスタ Granted JPS60140738A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58249337A JPS60140738A (ja) 1983-12-27 1983-12-27 高周波高出力トランジスタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58249337A JPS60140738A (ja) 1983-12-27 1983-12-27 高周波高出力トランジスタ

Publications (2)

Publication Number Publication Date
JPS60140738A JPS60140738A (ja) 1985-07-25
JPH0129441B2 true JPH0129441B2 (cs) 1989-06-12

Family

ID=17191514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58249337A Granted JPS60140738A (ja) 1983-12-27 1983-12-27 高周波高出力トランジスタ

Country Status (1)

Country Link
JP (1) JPS60140738A (cs)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443662A (en) * 1977-09-14 1979-04-06 Nec Corp Transistor amplifier
JPS5763847A (en) * 1980-10-04 1982-04-17 Mitsubishi Electric Corp Transistor circut

Also Published As

Publication number Publication date
JPS60140738A (ja) 1985-07-25

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