JPH01270396A - 多層配線基板 - Google Patents
多層配線基板Info
- Publication number
- JPH01270396A JPH01270396A JP9972588A JP9972588A JPH01270396A JP H01270396 A JPH01270396 A JP H01270396A JP 9972588 A JP9972588 A JP 9972588A JP 9972588 A JP9972588 A JP 9972588A JP H01270396 A JPH01270396 A JP H01270396A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- inner layer
- layer material
- base material
- upside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 52
- 239000011347 resin Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 238000005553 drilling Methods 0.000 claims description 9
- 230000010354 integration Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 9
- 239000004744 fabric Substances 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 8
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 230000035515 penetration Effects 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002253 acid Substances 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 239000011888 foil Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000011417 postcuring Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9972588A JPH01270396A (ja) | 1988-04-22 | 1988-04-22 | 多層配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9972588A JPH01270396A (ja) | 1988-04-22 | 1988-04-22 | 多層配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01270396A true JPH01270396A (ja) | 1989-10-27 |
| JPH0557754B2 JPH0557754B2 (enrdf_load_stackoverflow) | 1993-08-24 |
Family
ID=14255048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9972588A Granted JPH01270396A (ja) | 1988-04-22 | 1988-04-22 | 多層配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01270396A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01318288A (ja) * | 1988-06-20 | 1989-12-22 | Matsushita Electric Works Ltd | 多層配線基板 |
| JP2010034142A (ja) * | 2008-07-25 | 2010-02-12 | Sumitomo Bakelite Co Ltd | 多層配線板の製造方法、多層配線板および半導体装置 |
-
1988
- 1988-04-22 JP JP9972588A patent/JPH01270396A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01318288A (ja) * | 1988-06-20 | 1989-12-22 | Matsushita Electric Works Ltd | 多層配線基板 |
| JP2010034142A (ja) * | 2008-07-25 | 2010-02-12 | Sumitomo Bakelite Co Ltd | 多層配線板の製造方法、多層配線板および半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0557754B2 (enrdf_load_stackoverflow) | 1993-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20060210780A1 (en) | Circuit board and production method therefor | |
| JPH07106765A (ja) | 多層化接着シート及びそれを用いた多層配線板の製造法 | |
| JPH01270396A (ja) | 多層配線基板 | |
| JPH0697670A (ja) | 多層プリント配線用基板 | |
| JP2572108B2 (ja) | 多層配線基板 | |
| JPS63199636A (ja) | 積層板 | |
| JPH01270394A (ja) | 多層配線基板 | |
| JP2000049440A (ja) | プリント配線用多層板の製造方法 | |
| JPH0510840B2 (enrdf_load_stackoverflow) | ||
| JPH01318287A (ja) | 多層配線基板 | |
| JPH01270397A (ja) | 多層配線基板 | |
| JPH0770836B2 (ja) | 電気積層板とその製造方法 | |
| JP3237315B2 (ja) | プリプレグ及びこのプリプレグを用いた多層積層板の製造方法 | |
| JP2776202B2 (ja) | 超多層積層板の製造方法 | |
| JPS62295495A (ja) | 多層プリント配線板 | |
| JP2000022330A (ja) | 多層配線基板およびその製造方法 | |
| JP2782734B2 (ja) | 多層プラスチックチップキャリア | |
| JPH021391B2 (enrdf_load_stackoverflow) | ||
| JPH01264811A (ja) | 電気積層板の製造方法 | |
| JPS6287345A (ja) | 金属ベ−ス積層板 | |
| JPH05275855A (ja) | 多層プリント配線板 | |
| JPH01318288A (ja) | 多層配線基板 | |
| JPH0529763A (ja) | 多層銅張積層板の製造方法 | |
| JPH0240234B2 (enrdf_load_stackoverflow) | ||
| JPH06338663A (ja) | リジッドフレックスプリント配線板およびその製造方法 |