JPH01255297A - Manufacture of multilayer interconnection substrate - Google Patents
Manufacture of multilayer interconnection substrateInfo
- Publication number
- JPH01255297A JPH01255297A JP8341588A JP8341588A JPH01255297A JP H01255297 A JPH01255297 A JP H01255297A JP 8341588 A JP8341588 A JP 8341588A JP 8341588 A JP8341588 A JP 8341588A JP H01255297 A JPH01255297 A JP H01255297A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- inner layer
- copper foil
- layer material
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 title description 2
- 239000000463 material Substances 0.000 claims abstract description 21
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000011889 copper foil Substances 0.000 claims abstract description 13
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000460 chlorine Substances 0.000 claims abstract description 7
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 7
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 7
- 239000000057 synthetic resin Substances 0.000 claims abstract description 7
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000011259 mixed solution Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 14
- 239000011347 resin Substances 0.000 abstract description 14
- 239000011888 foil Substances 0.000 abstract description 12
- 239000003822 epoxy resin Substances 0.000 abstract description 7
- 229920000647 polyepoxide Polymers 0.000 abstract description 7
- 239000004744 fabric Substances 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 229920001721 polyimide Polymers 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 239000009719 polyimide resin Substances 0.000 abstract description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 229910001919 chlorite Inorganic materials 0.000 description 4
- 229910052619 chlorite group Inorganic materials 0.000 description 4
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、計算機器、通信機器等に用いられる
多層配線基板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a multilayer wiring board used in electrical equipment, computing equipment, communication equipment, etc.
従来、電気機５等に用いられる多層配線基板の内層銅箔
は亜塩素酸ナトＩＩウムや過硫酸力＋１ウムで酸化処理
後、樹脂含浸基材を有して外層材と墳１１一体化するこ
とによって得られている。Conventionally, the inner layer copper foil of a multilayer wiring board used for electrical equipment 5, etc. is oxidized with sodium II chlorite or persulfate + 1 um, and then integrated with the outer layer material using a resin-impregnated base material. It is obtained by
従来の技術で述べたように多層配線基板の内層鋼箔を亜
塩素酸す） ＩＩウムで処理すると銅箔の耐酸性、接着
性が低下し、内層銅箔を過硫酸力１１ウムで処理すると
銅箔の半田耐熱性、接着性が低下するという問題があっ
た。更にエポキシ樹脂多層配線基板にあっては一般に耐
スミア性が悪すと論う問題がゐ−た。本発明は従来の技
術における上述の問題点に鑑みてなされたもので、その
目的とするところは、内層鋼箔の耐酸性、接着性、半田
耐熱性が同上し史にエポキシ樹脂多層配線基板にあって
は耐スミア性の向上した多層配線基板の製造方法を提供
することにある。As described in the conventional technology, when the inner layer steel foil of a multilayer wiring board is treated with chlorite), the acid resistance and adhesion of the copper foil decreases, and when the inner layer copper foil is treated with 11 um persulfate, the copper foil loses its acid resistance and adhesion. There was a problem in that the soldering heat resistance and adhesiveness of the copper foil deteriorated. Furthermore, epoxy resin multilayer wiring boards generally have a problem of poor smear resistance. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to improve the acid resistance, adhesion, and solder heat resistance of the inner layer steel foil, and to improve the acid resistance, adhesion, and solder heat resistance of the inner layer steel foil, which has been previously used in epoxy resin multilayer wiring boards. Another object of the present invention is to provide a method for manufacturing a multilayer wiring board with improved smear resistance.
本発明は内層銅箔を過硫酸カリウムと水酸化ナトリウム
との混合溶液で処理後、該表面を塩素含有量が０〜０．
０５Ｗｉｔ％（以下屯に俤と記す）の合成樹脂で被覆し
てから、樹脂含浸基材を介して外層材と槓１ｖＩＩ一体
化するこきを特徴とする多層配線基板の′＃漬方法のた
め上記目的を達成することができたもので、以下本発明
の詳細な説明する。In the present invention, after treating the inner layer copper foil with a mixed solution of potassium persulfate and sodium hydroxide, the surface is treated with a chlorine content of 0 to 0.
The method for dipping a multilayer wiring board is described above, which is characterized by coating with a synthetic resin of 0.5 Wit% (hereinafter referred to as "Ton") and then integrating it with the outer layer material through a resin-impregnated base material. The present invention has been achieved and will now be described in detail.
本発明は過硫酸力１１ウムと水酸化ナトリウムとの混合
溶液で内ｊ−銅箔を処理するもので、轄混合溶液以外の
処理液では処理面が粗面化しなかったり、粗大になり過
ぎるので耐酸性、接信性、半田耐熱性を同上させること
はできない。混合溶液の濃度、処理温度、処理時間等に
ついては特に限定するものではない。次いで内層銅箔処
理表面を塩素含有閂がＯ〜ｏ、ｏｓ４の７エノール樹脂
、エポキシ樹脂、不飽和ボ１１エステル樹脂、ボ１１イ
ミド樹脂、弗化樹脂等の合成樹脂で被橿するものである
。In the present invention, copper foil is treated with a mixed solution of 11 um persulfuric acid and sodium hydroxide, and treatment solutions other than the mixed solution do not roughen the treated surface or make it too coarse. It is impossible to improve acid resistance, connectivity, and soldering heat resistance. There are no particular limitations on the concentration of the mixed solution, treatment temperature, treatment time, etc. Next, the treated surface of the inner copper foil is covered with a synthetic resin such as a chlorine-containing bolt O~o, OS4 7 enol resin, epoxy resin, unsaturated Bo-11 ester resin, Bo-11 imide resin, fluorinated resin, etc. .
被検Ｉ−の厚みは好ましくは０．０１〜ｉｆｆが望まし
い。The thickness of the test object I- is preferably 0.01 to iff.
樹脂含浸基材の樹脂としてはフェノール樹脂、クレゾー
ル樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、メラ
ミン樹脂、ポリイミド樹脂、ポリフェニレンオキサイド
樹脂、弗化樹脂等の合成樹脂を用Ａ、該樹脂をガラス、
アスベスト等の無機繊維やポリエステル、ポリアミド、
ポリビニルアルコール、ポリウレタン、ポリイミド等の
有機合成１７Ｎ雄や木綿等の天然繊維の織布、不織布、
マリト、ネー・ト、寒冷紗、紙等の基材に乾燥後の樹脂
量が４０〜６０％になるように含浸、乾燥してなる厚み
０．０１〜１關の樹脂含浸基材で所要枚数を介在させる
ものである。なお樹脂含浸基材の樹脂についても塩素含
有誓を０〜０．ｏｓ％にすることは更に好ましくハこと
である。外層材としては銅箔、アルミニウム箔、ニーｊ
ケル箔等のような金属箔や片面金４張積層板を用いるも
のである。積層一体化手段につ１ハではプレス、ロール
、ダブルベルト等のヨウな積層手段であればよく、特に
限定するものではない。As the resin for the resin-impregnated base material, synthetic resins such as phenol resins, cresol resins, epoxy resins, unsaturated polyester resins, melamine resins, polyimide resins, polyphenylene oxide resins, and fluorinated resins are used.
Inorganic fibers such as asbestos, polyester, polyamide,
Woven fabrics and non-woven fabrics made of organic synthetic 17N male materials such as polyvinyl alcohol, polyurethane, and polyimide, and natural fibers such as cotton;
The required number of sheets is made by impregnating and drying base materials such as marito, net, cheesecloth, and paper so that the amount of resin after drying is 40 to 60%. It is something to intervene. The chlorine content of the resin impregnated base material is also 0 to 0. It is more preferable to set it to os%. Outer layer materials include copper foil, aluminum foil, and aluminum foil.
A metal foil such as Kel foil or a 4-layer gold-clad laminate on one side is used. The laminating and integrating means may be any suitable laminating means such as a press, roll, double belt, etc., and is not particularly limited.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚さ０．０３５ｇｍの鋼箔を有する厚さＩ ＫＭの両面
鋼張ガラス布基材エポキシ樹脂内層材を、下記組成の処
理液で６０゛ＣにおＡて４０秒間処理した。EXAMPLE A double-sided steel-clad glass cloth base epoxy resin inner layer material having a thickness of I KM and having a steel foil having a thickness of 0.035 gm was treated with a treatment solution having the following composition at 60°C and A for 40 seconds.
過硫酸カリウム ６９／１水酸化ナトリ
ウム ３２ｇ／７！１次に内Ｉ軸材の上下に
塩素含を盪ｇ、ｏ１％の硬化剤含有エボやシ樹脂ワニス
を塗布厚がＱ、０５ｆｌになるように塗布、乾燥後、内
層材の上下に樹脂含有量４５ｃＩ）の厚さ０．ＩＩＩＩ
＋のエポキシ樹脂含浸ガラス布基材を夫々２枚づつ介し
て厚さ０．０３５ 屑罵の鋼箔を配役した積層体を成形
圧力４０ｋＱ／ｄ、 １６０℃で９０分間加熱加圧成
形して４ノ一回路配線基板を得た。Potassium persulfate 69/1 Sodium hydroxide 32g/7!1 Next, apply chlorine-containing to the top and bottom of the inner I shaft material, and apply Evo or resin varnish containing O1% hardening agent so that the thickness is Q, 05 fl. After drying, coat the inner layer material with a resin content of 45 cI and a thickness of 0. III
A laminate of 0.035-thick steel foil with two epoxy resin-impregnated glass cloth substrates interposed between each was heated and pressure-molded at a molding pressure of 40 kQ/d at 160°C for 90 minutes. A circuit wiring board was obtained.
比゛較例１
実施例の処理液を亜塩素酸す） ＩＩウム２ｏｆ／１に
変えた以外は実施例と同様に処理して４層回路配線基板
を得た。Comparative Example 1 A four-layer circuit wiring board was obtained by processing in the same manner as in the example except that the treatment solution in the example was changed to 2 of 1 chlorite (chlorite).
比較例２
実施例の処理液を過硫酸カリウム１５９７１ に変え
た以外は実施例と同様に処理して４層回路配線基板を得
た。Comparative Example 2 A four-layer circuit wiring board was obtained in the same manner as in the example except that the treatment liquid in the example was changed to potassium persulfate 15971.
実施例及び比較例１と２の４層回路配線基板の性能は第
１表のようである。The performances of the four-layer circuit wiring boards of Examples and Comparative Examples 1 and 2 are shown in Table 1.
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有する多Ｊ−配線基板の製造方
法においては、内層鋼箔の耐酸性、半田耐熱性、内層鋼
箔の接着性が著るしく向上する効果を有している。The present invention is constructed as described above. The method for manufacturing a multi-J wiring board having the structure described in claim 1 has the effect of significantly improving the acid resistance of the inner layer steel foil, the soldering heat resistance, and the adhesiveness of the inner layer steel foil. are doing.
Claims (1)
の混合溶液で処理後、該表面を塩素含有量が０〜０．０
５重量％の合成樹脂で被覆してから、樹脂含浸基材を介
して外層材と積層一体化することを特徴とする多層配線
基板の製造方法。(1) After treating the inner layer copper foil with a mixed solution of potassium persulfate and sodium hydroxide, the surface is treated with a chlorine content of 0 to 0.0.
A method for producing a multilayer wiring board, which comprises coating the board with 5% by weight of synthetic resin and then laminating and integrating the board with an outer layer material via a resin-impregnated base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8341588A JPH01255297A (en) | 1988-04-05 | 1988-04-05 | Manufacture of multilayer interconnection substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8341588A JPH01255297A (en) | 1988-04-05 | 1988-04-05 | Manufacture of multilayer interconnection substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01255297A true JPH01255297A (en) | 1989-10-12 |
Family
ID=13801806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8341588A Pending JPH01255297A (en) | 1988-04-05 | 1988-04-05 | Manufacture of multilayer interconnection substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01255297A (en) |
-
1988
- 1988-04-05 JP JP8341588A patent/JPH01255297A/en active Pending
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