JPH01255296A - Manufacture of multilayer interconnection substrate - Google Patents
Manufacture of multilayer interconnection substrateInfo
- Publication number
- JPH01255296A JPH01255296A JP8341488A JP8341488A JPH01255296A JP H01255296 A JPH01255296 A JP H01255296A JP 8341488 A JP8341488 A JP 8341488A JP 8341488 A JP8341488 A JP 8341488A JP H01255296 A JPH01255296 A JP H01255296A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- inner layer
- copper foil
- base material
- layer material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 title description 3
- 239000000463 material Substances 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 15
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 239000011888 foil Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract 1
- 239000002253 acid Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- XXQBEVHPUKOQEO-UHFFFAOYSA-N potassium superoxide Chemical compound [K+].[K+].[O-][O-] XXQBEVHPUKOQEO-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- VPCDQGACGWYTMC-UHFFFAOYSA-N nitrosyl chloride Chemical compound ClN=O VPCDQGACGWYTMC-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、計算機器、通信機器等に用いられる
多層配線基板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a multilayer wiring board used in electrical equipment, computing equipment, communication equipment, etc.
従来、電気機器等に用いられる多ｌ−配＆ｌｔｈ基板の
内ｊ−銅箔は亜塩′５酸す） ＩＩウムや過硫酸力１１
ウムで酸化処理後、樹脂含浸基材を介して外１−材と積
層一体化することによって得られている。Conventionally, the copper foil used in multilayer & lth substrates used in electrical equipment, etc. is made of nitrous chloride (II) and persulfuric acid (11).
After being oxidized with aluminum, the material is laminated and integrated with the outer material via a resin-impregnated base material.
従来の技術で述べたように多層配線基板の内層銅箔を吐
塩素酸ナトＩＩウムで処理すると銅箔の耐酸性、接着性
が低下し、内層銅箔を過信酸カリウムで処理すると銅箔
の半田耐熱性、接着性が低下すると論う問題があった。As described in the conventional technology, when the inner layer copper foil of a multilayer wiring board is treated with sodium chlorate, the acid resistance and adhesion of the copper foil decrease, and when the inner layer copper foil is treated with potassium superoxide, the copper foil deteriorates. There was a problem that solder heat resistance and adhesiveness deteriorated.
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは、内層銅箔の′＃
酸性、接着性、半田耐熱性が向上した多層配線基板の與
遣方法を提供することにある。The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to
An object of the present invention is to provide a method for providing a multilayer wiring board with improved acidity, adhesiveness, and soldering heat resistance.
本発明は内層銅箔を過硫酸力＋１つムと水酸化ナトリウ
ムとの混合溶液で処理温度５０〜５６℃、処理時間１４
０〜２４０秒間で処理後、樹脂含浸基材を介して外層材
と積層一体化することを％徴とする多層配線基板の製造
方法のため上記目的を達成することができたもので、以
下本発明の詳細な説明する。In the present invention, the inner layer copper foil is treated with a mixed solution of persulfuric acid + 1 mm and sodium hydroxide at a temperature of 50 to 56°C and a treatment time of 14
This method of manufacturing a multilayer wiring board is characterized by laminating and integrating the outer layer material through the resin-impregnated base material after processing for 0 to 240 seconds. Detailed description of the invention.
不発明は過硫酸力１１ウムと水酸化ナトリウムとの混合
溶液を特定の処理温度、処理時間でもって処理するもの
で、規定の範囲外では処理語が粗面化しなか−たり、粗
大になり１尚ざるので耐酸性、接着性、半田耐熱性を向
上させることかできな−。The invention involves treating a mixed solution of 11 um persulfate and sodium hydroxide at a specific treatment temperature and treatment time, and if it is outside the specified range, the treated surface may not become rough or may become coarse. However, it is not possible to improve acid resistance, adhesion, and soldering heat resistance.
樹脂含浸基材の樹脂としてはフェノール樹脂、クレゾー
ル樹脂、エポキシ樹脂、不飽和ポリニスデル樹脂、メラ
ミン樹脂、ポリイミド樹脂、ポリフェニレンオキサイド
樹脂、弗化硝脂亭の合成樹脂を用ｂ％該（ν（脂をガラ
ス、アスベスト等の無機繊維やポリエステル、ボ１１ア
ミド、ボ；１ビニルアルコール、ボ１１ウレタン、ポリ
イミド等の有“機合成繊維や、木綿等の天然繊維の織布
、不織布、マット、ネーｊト、寒冷紗、紙等の基材に乾
燥後の樹脂普が４０〜６０重赦％（以下旭に憾と記す）
になるように含な、乾燥してなる厚み０．０１〜１ ｍ
ｍの樹脂含浸基材で所要枚数を介在させるものである。As the resin for the resin-impregnated base material, phenolic resin, cresol resin, epoxy resin, unsaturated polynisder resin, melamine resin, polyimide resin, polyphenylene oxide resin, and synthetic resin of fluorinated nitrate resin are used. Woven fabrics, non-woven fabrics, mats, and nets made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyester, vinyl alcohol, polyurethane, polyimide, and natural fibers such as cotton. , 40-60% resin after drying on base materials such as cheesecloth and paper (hereinafter referred to as "Asahi")
The dry thickness is 0.01 to 1 m.
The required number of resin-impregnated base materials of m are interposed.
外；−材としては銅箔、アルミニウム箔、ニクケル箔等
のような金属箔や片面金属張積層板を用するものである
。積層−法化手段についてはプレス、ロール、ダブルベ
ルト等のような積層手段であればよく、特に限定するも
のではなｈｏなお処理液の濃度につ−ては特に限定する
ものではなＡが液の循環口を３００１！／分以上とし、
揺動回数を第１回目４０−５０回／分 、第２回目２０
−３０回／分にすることが好ましｂｏ
以下本発明を実施例にもとづｈて説明する。As the material, a metal foil such as copper foil, aluminum foil, Nikkel foil, or a single-sided metal-clad laminate is used. The lamination method may be any lamination means such as a press, roll, double belt, etc., and there are no particular limitations on the concentration of the processing solution. 3001 circulation ports! /minute or more,
The number of oscillations was 40-50 times/min for the first time, 20 times for the second time.
-30 times/min is preferable.The present invention will be explained below based on Examples.
実施例
厚さ０．０３５ ｖｘの銅箔を有する厚さ１絹の両面銅
張ガラス布基材エポキシ樹脂内層材を、下記組放の処理
液で５３ ”Ｃにおいて１９０秒間処理した。EXAMPLE A 1-silk double-sided copper-clad glass cloth substrate epoxy resin inner layer material with a copper foil having a thickness of 0.035 vx was treated with the following treatment solution at 53''C for 190 seconds.
過硫酸力１１ウム ｘｓｌ／１水酸化ナトリ
ウム ３０１／１次に内層材の上下に樹脂含有
普４５係の厚さ０．１ｍｌのエポキシ樹脂含浸ガラス布
基材を夫々２枚づつ介して厚さ（１，０３５ｍｍの銅箔
を配設した積層体を成形圧力４０に９／ｄ、ｘ６ｏ℃で
９０分間加熱加圧成形して４油回路配線基板を得た。Persulfate power 11um A 4-oil circuit wiring board was obtained by heat-pressing molding a laminate on which a 1,035 mm copper foil was placed at a molding pressure of 9/d at a molding pressure of 40° C. for 90 minutes at x6° C.
比較例１
実施例の処理液を亜塩素酸ナト１１ウム２ｏｆ／１に変
えた以外は実施例と同様に処理して４油回路配線基板を
得ｔこ。Comparative Example 1 A 4-oil circuit wiring board was obtained in the same manner as in the example except that the treatment liquid in the example was changed to 2 of 1 1/1 sodium chlorite.
比較例２
実施例の処理液を過硫酸カリウム１５ ｆ／ｌに変えた
以外は実施例と同様に処理して４油回路配線基板を得た
。Comparative Example 2 A 4-oil circuit wiring board was obtained in the same manner as in the example except that the treatment liquid in the example was changed to 15 f/l of potassium persulfate.
実施例及び比較例１と２の４油回路配線基板の性窪は第
１表のようである。The characteristics of the four-oil circuit wiring boards of Examples and Comparative Examples 1 and 2 are as shown in Table 1.
本発明は上述した如く構成されてｂる。特許請求の範囲
第１項に記載した構成を有する多層配線基板の製造方法
におｈでは、内層銅箔の耐酸性、半田耐熱性、内層銅箔
の接着性が著るしく向上する効果を有してｂる。The present invention is constructed as described above. The method for manufacturing a multilayer wiring board having the structure described in claim 1 has the effect of significantly improving the acid resistance of the inner layer copper foil, the soldering heat resistance, and the adhesiveness of the inner layer copper foil. Do it.
Claims (1)
混合溶液で処理温度５０〜５６℃、処理時間１４０〜２
４０秒間で処理後、樹脂含浸基材を介して外層材と積層
一体化することを特徴とする多層配線基板の製造方法。(1) Inner layer copper foil is treated with a mixed solution of potassium persulfate and sodium hydroxide at a temperature of 50 to 56°C and a treatment time of 140 to 2
A method for producing a multilayer wiring board, which comprises processing for 40 seconds and then laminating and integrating with an outer layer material via a resin-impregnated base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8341488A JPH01255296A (en) | 1988-04-05 | 1988-04-05 | Manufacture of multilayer interconnection substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8341488A JPH01255296A (en) | 1988-04-05 | 1988-04-05 | Manufacture of multilayer interconnection substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01255296A true JPH01255296A (en) | 1989-10-12 |
Family
ID=13801777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8341488A Pending JPH01255296A (en) | 1988-04-05 | 1988-04-05 | Manufacture of multilayer interconnection substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01255296A (en) |
-
1988
- 1988-04-05 JP JP8341488A patent/JPH01255296A/en active Pending
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