JPH01248693A - 厚膜回路装置の製造方法 - Google Patents
厚膜回路装置の製造方法Info
- Publication number
- JPH01248693A JPH01248693A JP7689288A JP7689288A JPH01248693A JP H01248693 A JPH01248693 A JP H01248693A JP 7689288 A JP7689288 A JP 7689288A JP 7689288 A JP7689288 A JP 7689288A JP H01248693 A JPH01248693 A JP H01248693A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductive paste
- printed
- wiring conductor
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004020 conductor Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 7
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract description 4
- 238000001035 drying Methods 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 3
- 238000000151 deposition Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7689288A JPH01248693A (ja) | 1988-03-30 | 1988-03-30 | 厚膜回路装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7689288A JPH01248693A (ja) | 1988-03-30 | 1988-03-30 | 厚膜回路装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01248693A true JPH01248693A (ja) | 1989-10-04 |
| JPH0563114B2 JPH0563114B2 (show.php) | 1993-09-09 |
Family
ID=13618294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7689288A Granted JPH01248693A (ja) | 1988-03-30 | 1988-03-30 | 厚膜回路装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01248693A (show.php) |
-
1988
- 1988-03-30 JP JP7689288A patent/JPH01248693A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563114B2 (show.php) | 1993-09-09 |
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