JPH0124599B2 - - Google Patents

Info

Publication number
JPH0124599B2
JPH0124599B2 JP59019654A JP1965484A JPH0124599B2 JP H0124599 B2 JPH0124599 B2 JP H0124599B2 JP 59019654 A JP59019654 A JP 59019654A JP 1965484 A JP1965484 A JP 1965484A JP H0124599 B2 JPH0124599 B2 JP H0124599B2
Authority
JP
Japan
Prior art keywords
solder
solder alloy
weight
soldering
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59019654A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60166191A (ja
Inventor
Kenji Asami
Nobuo Kageyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Handa Co Ltd
Original Assignee
Nippon Handa Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Handa Kogyo KK filed Critical Nippon Handa Kogyo KK
Priority to JP1965484A priority Critical patent/JPS60166191A/ja
Publication of JPS60166191A publication Critical patent/JPS60166191A/ja
Publication of JPH0124599B2 publication Critical patent/JPH0124599B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1965484A 1984-02-06 1984-02-06 耐疲労特性にすぐれたはんだ合金 Granted JPS60166191A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1965484A JPS60166191A (ja) 1984-02-06 1984-02-06 耐疲労特性にすぐれたはんだ合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1965484A JPS60166191A (ja) 1984-02-06 1984-02-06 耐疲労特性にすぐれたはんだ合金

Publications (2)

Publication Number Publication Date
JPS60166191A JPS60166191A (ja) 1985-08-29
JPH0124599B2 true JPH0124599B2 (enExample) 1989-05-12

Family

ID=12005229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1965484A Granted JPS60166191A (ja) 1984-02-06 1984-02-06 耐疲労特性にすぐれたはんだ合金

Country Status (1)

Country Link
JP (1) JPS60166191A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011658A (en) * 1989-05-31 1991-04-30 International Business Machines Corporation Copper doped low melt solder for component assembly and rework
US20090310318A1 (en) * 2008-06-16 2009-12-17 Cisco Technology, Inc. Attaching a lead-free component to a printed circuit board under lead-based assembly conditions

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3725144A (en) * 1968-04-16 1973-04-03 Gen Motors Corp Heat treatable creep resistant solder
JPS5436751A (en) * 1977-08-29 1979-03-17 Toshiba Corp Display device

Also Published As

Publication number Publication date
JPS60166191A (ja) 1985-08-29

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