JPS60166191A - 耐疲労特性にすぐれたはんだ合金 - Google Patents
耐疲労特性にすぐれたはんだ合金Info
- Publication number
- JPS60166191A JPS60166191A JP1965484A JP1965484A JPS60166191A JP S60166191 A JPS60166191 A JP S60166191A JP 1965484 A JP1965484 A JP 1965484A JP 1965484 A JP1965484 A JP 1965484A JP S60166191 A JPS60166191 A JP S60166191A
- Authority
- JP
- Japan
- Prior art keywords
- solder alloy
- solder
- alloy
- soldering
- fatigue resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 55
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 38
- 239000000956 alloy Substances 0.000 title claims abstract description 38
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052709 silver Inorganic materials 0.000 abstract description 11
- 239000004332 silver Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 6
- 230000006866 deterioration Effects 0.000 abstract description 2
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 230000003252 repetitive effect Effects 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 12
- 238000012360 testing method Methods 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910009038 Sn—P Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1965484A JPS60166191A (ja) | 1984-02-06 | 1984-02-06 | 耐疲労特性にすぐれたはんだ合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1965484A JPS60166191A (ja) | 1984-02-06 | 1984-02-06 | 耐疲労特性にすぐれたはんだ合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60166191A true JPS60166191A (ja) | 1985-08-29 |
| JPH0124599B2 JPH0124599B2 (enExample) | 1989-05-12 |
Family
ID=12005229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1965484A Granted JPS60166191A (ja) | 1984-02-06 | 1984-02-06 | 耐疲労特性にすぐれたはんだ合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60166191A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5011658A (en) * | 1989-05-31 | 1991-04-30 | International Business Machines Corporation | Copper doped low melt solder for component assembly and rework |
| US20090310318A1 (en) * | 2008-06-16 | 2009-12-17 | Cisco Technology, Inc. | Attaching a lead-free component to a printed circuit board under lead-based assembly conditions |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3725144A (en) * | 1968-04-16 | 1973-04-03 | Gen Motors Corp | Heat treatable creep resistant solder |
| JPS5436751A (en) * | 1977-08-29 | 1979-03-17 | Toshiba Corp | Display device |
-
1984
- 1984-02-06 JP JP1965484A patent/JPS60166191A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3725144A (en) * | 1968-04-16 | 1973-04-03 | Gen Motors Corp | Heat treatable creep resistant solder |
| JPS5436751A (en) * | 1977-08-29 | 1979-03-17 | Toshiba Corp | Display device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5011658A (en) * | 1989-05-31 | 1991-04-30 | International Business Machines Corporation | Copper doped low melt solder for component assembly and rework |
| US20090310318A1 (en) * | 2008-06-16 | 2009-12-17 | Cisco Technology, Inc. | Attaching a lead-free component to a printed circuit board under lead-based assembly conditions |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0124599B2 (enExample) | 1989-05-12 |
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