JPH01230285A - スルーホール回路基板 - Google Patents

スルーホール回路基板

Info

Publication number
JPH01230285A
JPH01230285A JP63000623A JP62388A JPH01230285A JP H01230285 A JPH01230285 A JP H01230285A JP 63000623 A JP63000623 A JP 63000623A JP 62388 A JP62388 A JP 62388A JP H01230285 A JPH01230285 A JP H01230285A
Authority
JP
Japan
Prior art keywords
hole
solder
circuit board
laminate
grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63000623A
Other languages
English (en)
Japanese (ja)
Other versions
JPH059955B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Tetsuya Hashimoto
哲也 橋本
Makoto Deguchi
良 出口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP63000623A priority Critical patent/JPH01230285A/ja
Publication of JPH01230285A publication Critical patent/JPH01230285A/ja
Publication of JPH059955B2 publication Critical patent/JPH059955B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacture Of Motors, Generators (AREA)
JP63000623A 1987-11-26 1988-01-07 スルーホール回路基板 Granted JPH01230285A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63000623A JPH01230285A (ja) 1987-11-26 1988-01-07 スルーホール回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP29612187 1987-11-26
JP62-296121 1987-11-26
JP63000623A JPH01230285A (ja) 1987-11-26 1988-01-07 スルーホール回路基板

Publications (2)

Publication Number Publication Date
JPH01230285A true JPH01230285A (ja) 1989-09-13
JPH059955B2 JPH059955B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-02-08

Family

ID=26333640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63000623A Granted JPH01230285A (ja) 1987-11-26 1988-01-07 スルーホール回路基板

Country Status (1)

Country Link
JP (1) JPH01230285A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004303956A (ja) * 2003-03-31 2004-10-28 Sekisui Chem Co Ltd プリント基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004303956A (ja) * 2003-03-31 2004-10-28 Sekisui Chem Co Ltd プリント基板の製造方法

Also Published As

Publication number Publication date
JPH059955B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-02-08

Similar Documents

Publication Publication Date Title
JP4923336B2 (ja) 回路基板及び該回路基板を用いた電子機器
JP4747707B2 (ja) 多層配線基板及び基板製造方法
TWI430728B (zh) 製造具有焊料膏連接之電路化基板的方法
JP2007329213A (ja) 部品内蔵配線板、部品内蔵配線板の製造方法。
JP2007073866A (ja) 部品内蔵配線板
JP2011193008A (ja) 回路基板に実装される表面実装部品及び該回路基板の実装方法並びに該回路基板を用いた電子機器
JP2013191620A (ja) 部品内蔵基板の製造方法および部品内蔵基板
JPH01230285A (ja) スルーホール回路基板
JP2542794B2 (ja) 配線板の製造方法
JP5130666B2 (ja) 部品内蔵配線板
JP4905338B2 (ja) 部品内蔵プリント配線基板の製造方法
JPH0318041A (ja) 電気的接合部
JP2743110B2 (ja) 多層配線板の製造方法
JPS63309390A (ja) はんだペ−スト
JPH06302952A (ja) スルーホール回路基板の製造法
JPH01106496A (ja) スルーホール回路基板の製造法
JP2000236166A (ja) バイアホール部の接続構造及び配線基板
JP2014195124A (ja) 部品内蔵配線板の製造方法
JPH01138788A (ja) スルーホール回路基板およびその製造方法
JPH0417994A (ja) はんだ組成物
JPH0415987A (ja) スルーホール回路基板およびその製造方法
JP5526818B2 (ja) プリント配線板
JP2003198138A (ja) プリント配線基板の製造方法
KR101172174B1 (ko) 인쇄회로기판 및 그의 제조 방법
JPH02125491A (ja) 電気的接合部およびその製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term