JPH0122742B2 - - Google Patents

Info

Publication number
JPH0122742B2
JPH0122742B2 JP58108837A JP10883783A JPH0122742B2 JP H0122742 B2 JPH0122742 B2 JP H0122742B2 JP 58108837 A JP58108837 A JP 58108837A JP 10883783 A JP10883783 A JP 10883783A JP H0122742 B2 JPH0122742 B2 JP H0122742B2
Authority
JP
Japan
Prior art keywords
liquid
cooling
refrigerant
air
cooling plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58108837A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60761A (ja
Inventor
Kishio Yokochi
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10883783A priority Critical patent/JPS60761A/ja
Publication of JPS60761A publication Critical patent/JPS60761A/ja
Publication of JPH0122742B2 publication Critical patent/JPH0122742B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP10883783A 1983-06-17 1983-06-17 液冷モジユ−ル Granted JPS60761A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10883783A JPS60761A (ja) 1983-06-17 1983-06-17 液冷モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10883783A JPS60761A (ja) 1983-06-17 1983-06-17 液冷モジユ−ル

Publications (2)

Publication Number Publication Date
JPS60761A JPS60761A (ja) 1985-01-05
JPH0122742B2 true JPH0122742B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-04-27

Family

ID=14494814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10883783A Granted JPS60761A (ja) 1983-06-17 1983-06-17 液冷モジユ−ル

Country Status (1)

Country Link
JP (1) JPS60761A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6285448A (ja) * 1985-10-09 1987-04-18 Fujitsu Ltd 半導体装置の冷却構造
JP4637734B2 (ja) * 2005-11-30 2011-02-23 富士通株式会社 電子装置の冷却装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103338A (en) * 1980-12-19 1982-06-26 Hitachi Ltd Boiling cooling device

Also Published As

Publication number Publication date
JPS60761A (ja) 1985-01-05

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