JPH0423830B2 - - Google Patents

Info

Publication number
JPH0423830B2
JPH0423830B2 JP24395883A JP24395883A JPH0423830B2 JP H0423830 B2 JPH0423830 B2 JP H0423830B2 JP 24395883 A JP24395883 A JP 24395883A JP 24395883 A JP24395883 A JP 24395883A JP H0423830 B2 JPH0423830 B2 JP H0423830B2
Authority
JP
Japan
Prior art keywords
chip
liquid
steam
cooling plate
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP24395883A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60136352A (ja
Inventor
Hisashi Nakayama
Shigeki Hirasawa
Tadakatsu Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24395883A priority Critical patent/JPS60136352A/ja
Priority to DE8484114163T priority patent/DE3472501D1/de
Priority to EP19840114163 priority patent/EP0167665B1/en
Publication of JPS60136352A publication Critical patent/JPS60136352A/ja
Publication of JPH0423830B2 publication Critical patent/JPH0423830B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP24395883A 1983-12-26 1983-12-26 集積回路チップの冷却装置 Granted JPS60136352A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP24395883A JPS60136352A (ja) 1983-12-26 1983-12-26 集積回路チップの冷却装置
DE8484114163T DE3472501D1 (en) 1983-12-26 1984-11-23 Apparatus for cooling integrated circuit chips
EP19840114163 EP0167665B1 (en) 1983-12-26 1984-11-23 Apparatus for cooling integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24395883A JPS60136352A (ja) 1983-12-26 1983-12-26 集積回路チップの冷却装置

Publications (2)

Publication Number Publication Date
JPS60136352A JPS60136352A (ja) 1985-07-19
JPH0423830B2 true JPH0423830B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-04-23

Family

ID=17111565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24395883A Granted JPS60136352A (ja) 1983-12-26 1983-12-26 集積回路チップの冷却装置

Country Status (3)

Country Link
EP (1) EP0167665B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS60136352A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3472501D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001393B1 (en) * 1985-04-30 1990-03-09 Fujitsu Ltd Evaporation cooling module for semiconductor device
US4975803A (en) * 1988-12-07 1990-12-04 Sundstrand Corporation Cold plane system for cooling electronic circuit components
DE4121534C2 (de) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Kühlvorrichtung
GB201919289D0 (en) * 2019-12-24 2020-02-05 Iceotope Group Ltd Cooling module
NL2025574B1 (en) * 2020-05-13 2021-11-30 Microsoft Technology Licensing Llc Systems and methods for vapor management in immersion cooling
WO2023135488A2 (en) * 2022-01-15 2023-07-20 Liquidstack Holding B.V. Baffle assembly for use in an immersion cooling system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices

Also Published As

Publication number Publication date
EP0167665A1 (en) 1986-01-15
JPS60136352A (ja) 1985-07-19
DE3472501D1 (en) 1988-08-04
EP0167665B1 (en) 1988-06-29

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