DE3472501D1 - Apparatus for cooling integrated circuit chips - Google Patents

Apparatus for cooling integrated circuit chips

Info

Publication number
DE3472501D1
DE3472501D1 DE8484114163T DE3472501T DE3472501D1 DE 3472501 D1 DE3472501 D1 DE 3472501D1 DE 8484114163 T DE8484114163 T DE 8484114163T DE 3472501 T DE3472501 T DE 3472501T DE 3472501 D1 DE3472501 D1 DE 3472501D1
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit chips
cooling integrated
cooling
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484114163T
Other languages
English (en)
Inventor
Wataru Nakayama
Shigeki Hirasawa
Tadakatsu Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3472501D1 publication Critical patent/DE3472501D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8484114163T 1983-12-26 1984-11-23 Apparatus for cooling integrated circuit chips Expired DE3472501D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24395883A JPS60136352A (ja) 1983-12-26 1983-12-26 集積回路チップの冷却装置

Publications (1)

Publication Number Publication Date
DE3472501D1 true DE3472501D1 (en) 1988-08-04

Family

ID=17111565

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484114163T Expired DE3472501D1 (en) 1983-12-26 1984-11-23 Apparatus for cooling integrated circuit chips

Country Status (3)

Country Link
EP (1) EP0167665B1 (de)
JP (1) JPS60136352A (de)
DE (1) DE3472501D1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001393B1 (en) * 1985-04-30 1990-03-09 Fujitsu Ltd Evaporation cooling module for semiconductor device
US4975803A (en) * 1988-12-07 1990-12-04 Sundstrand Corporation Cold plane system for cooling electronic circuit components
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
NL2025574B1 (en) * 2020-05-13 2021-11-30 Microsoft Technology Licensing Llc Systems and methods for vapor management in immersion cooling
WO2023135488A2 (en) * 2022-01-15 2023-07-20 Liquidstack Holding B.V. Baffle assembly for use in an immersion cooling system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices

Also Published As

Publication number Publication date
EP0167665A1 (de) 1986-01-15
EP0167665B1 (de) 1988-06-29
JPS60136352A (ja) 1985-07-19
JPH0423830B2 (de) 1992-04-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee