JPH0121622B2 - - Google Patents
Info
- Publication number
- JPH0121622B2 JPH0121622B2 JP5795484A JP5795484A JPH0121622B2 JP H0121622 B2 JPH0121622 B2 JP H0121622B2 JP 5795484 A JP5795484 A JP 5795484A JP 5795484 A JP5795484 A JP 5795484A JP H0121622 B2 JPH0121622 B2 JP H0121622B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- enclosure
- piston rod
- punching device
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P95/00—
Landscapes
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59057954A JPS60201622A (ja) | 1984-03-26 | 1984-03-26 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59057954A JPS60201622A (ja) | 1984-03-26 | 1984-03-26 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60201622A JPS60201622A (ja) | 1985-10-12 |
| JPH0121622B2 true JPH0121622B2 (enExample) | 1989-04-21 |
Family
ID=13070418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59057954A Granted JPS60201622A (ja) | 1984-03-26 | 1984-03-26 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60201622A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02134038U (enExample) * | 1989-04-12 | 1990-11-07 |
-
1984
- 1984-03-26 JP JP59057954A patent/JPS60201622A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02134038U (enExample) * | 1989-04-12 | 1990-11-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60201622A (ja) | 1985-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6043458A (en) | Pneumatic rotatable hand held pickup tool | |
| KR970706110A (ko) | 재료의 치수조절 및 처리조작을 위한 진공 고정장치 및 방법(vacuum fixture and method for dimensioning and manipulating materials) | |
| US7557904B2 (en) | Wafer holding mechanism | |
| US8186254B2 (en) | Sheet cutting device and cutting method | |
| US7696014B2 (en) | Method for breaking adhesive film mounted on back of wafer | |
| US8109185B2 (en) | Method for cutting protective tape of semiconductor wafer and protective tape cutting device | |
| JP2008227470A (ja) | ウエーハの分割方法およびレーザー加工装置 | |
| KR20160097132A (ko) | 절삭 장치 | |
| JP2019016691A (ja) | 除去装置および除去方法 | |
| KR100414890B1 (ko) | 웨이퍼 절삭 장치 | |
| CN117564486A (zh) | 全自动晶圆激光打标设备 | |
| KR102863303B1 (ko) | 박리 장치 | |
| JPH0121622B2 (enExample) | ||
| JP5009561B2 (ja) | 切断装置 | |
| JP2005251986A (ja) | ウエーハの分離検出方法および分離検出装置 | |
| TWI408726B (zh) | Sheet attachment and attachment method | |
| JP2019016692A (ja) | 除去装置および除去方法 | |
| JPH0572356U (ja) | 光センサーによるセットアップ機構 | |
| WO1998052212A1 (en) | Pick and place cutting head that separates chip scale packages from a multi-layered film strip | |
| CN114523210A (zh) | 晶圆保护膜旋转切除装置及其切除方法 | |
| JPH09155794A (ja) | 自動裁断機の裁断制御装置 | |
| JP3200651B2 (ja) | 溶接ガンの電極チップ切削確認方法及びその装置 | |
| JP4163429B2 (ja) | 穿孔装置 | |
| JPH07254577A (ja) | 半導体ウエハのブレーキング方法および装置 | |
| JP2007059802A (ja) | ウエーハの加工方法およびウエーハの加工方法に用いる粘着テープ |