JPS60201622A - 半導体ウエ−ハの保護膜の自動打抜き装置 - Google Patents

半導体ウエ−ハの保護膜の自動打抜き装置

Info

Publication number
JPS60201622A
JPS60201622A JP59057954A JP5795484A JPS60201622A JP S60201622 A JPS60201622 A JP S60201622A JP 59057954 A JP59057954 A JP 59057954A JP 5795484 A JP5795484 A JP 5795484A JP S60201622 A JPS60201622 A JP S60201622A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
cylinder
piston rod
protective film
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59057954A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0121622B2 (enExample
Inventor
Ryoji Wakabayashi
若林　良治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIYOUSAI SEIKI KK
Original Assignee
JIYOUSAI SEIKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIYOUSAI SEIKI KK filed Critical JIYOUSAI SEIKI KK
Priority to JP59057954A priority Critical patent/JPS60201622A/ja
Publication of JPS60201622A publication Critical patent/JPS60201622A/ja
Publication of JPH0121622B2 publication Critical patent/JPH0121622B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P95/00—

Landscapes

  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP59057954A 1984-03-26 1984-03-26 半導体ウエ−ハの保護膜の自動打抜き装置 Granted JPS60201622A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59057954A JPS60201622A (ja) 1984-03-26 1984-03-26 半導体ウエ−ハの保護膜の自動打抜き装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59057954A JPS60201622A (ja) 1984-03-26 1984-03-26 半導体ウエ−ハの保護膜の自動打抜き装置

Publications (2)

Publication Number Publication Date
JPS60201622A true JPS60201622A (ja) 1985-10-12
JPH0121622B2 JPH0121622B2 (enExample) 1989-04-21

Family

ID=13070418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59057954A Granted JPS60201622A (ja) 1984-03-26 1984-03-26 半導体ウエ−ハの保護膜の自動打抜き装置

Country Status (1)

Country Link
JP (1) JPS60201622A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02134038U (enExample) * 1989-04-12 1990-11-07

Also Published As

Publication number Publication date
JPH0121622B2 (enExample) 1989-04-21

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