JPH0121622B2 - - Google Patents
Info
- Publication number
- JPH0121622B2 JPH0121622B2 JP5795484A JP5795484A JPH0121622B2 JP H0121622 B2 JPH0121622 B2 JP H0121622B2 JP 5795484 A JP5795484 A JP 5795484A JP 5795484 A JP5795484 A JP 5795484A JP H0121622 B2 JPH0121622 B2 JP H0121622B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- enclosure
- piston rod
- punching device
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 38
- 238000004080 punching Methods 0.000 claims description 24
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000012528 membrane Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 37
- 239000010408 film Substances 0.000 description 10
- 230000006378 damage Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920006266 Vinyl film Polymers 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59057954A JPS60201622A (ja) | 1984-03-26 | 1984-03-26 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59057954A JPS60201622A (ja) | 1984-03-26 | 1984-03-26 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60201622A JPS60201622A (ja) | 1985-10-12 |
JPH0121622B2 true JPH0121622B2 (US07534539-20090519-C00280.png) | 1989-04-21 |
Family
ID=13070418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59057954A Granted JPS60201622A (ja) | 1984-03-26 | 1984-03-26 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60201622A (US07534539-20090519-C00280.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02134038U (US07534539-20090519-C00280.png) * | 1989-04-12 | 1990-11-07 |
-
1984
- 1984-03-26 JP JP59057954A patent/JPS60201622A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02134038U (US07534539-20090519-C00280.png) * | 1989-04-12 | 1990-11-07 |
Also Published As
Publication number | Publication date |
---|---|
JPS60201622A (ja) | 1985-10-12 |
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