JPH01214126A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH01214126A
JPH01214126A JP4115788A JP4115788A JPH01214126A JP H01214126 A JPH01214126 A JP H01214126A JP 4115788 A JP4115788 A JP 4115788A JP 4115788 A JP4115788 A JP 4115788A JP H01214126 A JPH01214126 A JP H01214126A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
metal
film
wirings
protective film
formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4115788A
Inventor
Yasunobu Okano
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Abstract

PURPOSE: To prevent mobile ions from impregnating into a protective film and metal wirings from corroding by forming the wirings and an insulating layer on a semiconductor substrate, and then covering a whole active region with a metal film.
CONSTITUTION: An element is formed on a semiconductor substrate 1, wirings and an insulating film 2 are formed thereon, a protective film 3 which is covered with the insulating layer except a bonding pad 4 is formed, and the whole active region is covered with a metal film 6. Thus, the metal film is employed as the final protective film of a semiconductor device to prevent mobile ions due to an external contamination. Or, even if metal is generated due to the absorption of moisture, the metal film of the final protective film is reacted, thereby reducing the impregnating speed until arriving at inner metal wirings.
COPYRIGHT: (C)1989,JPO&Japio
JP4115788A 1988-02-23 1988-02-23 Semiconductor device Pending JPH01214126A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4115788A JPH01214126A (en) 1988-02-23 1988-02-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4115788A JPH01214126A (en) 1988-02-23 1988-02-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH01214126A true true JPH01214126A (en) 1989-08-28

Family

ID=12600582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4115788A Pending JPH01214126A (en) 1988-02-23 1988-02-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH01214126A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227314A (en) * 1989-03-22 1993-07-13 At&T Bell Laboratories Method of making metal conductors having a mobile inn getterer therein
US6720656B2 (en) 1998-12-21 2004-04-13 Sharp Kabushiki Kaisha Semiconductor device with analysis prevention feature
US7750485B2 (en) 2005-07-05 2010-07-06 Fujitsu Semiconductor Limited Semiconductor device and method for manufacturing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227314A (en) * 1989-03-22 1993-07-13 At&T Bell Laboratories Method of making metal conductors having a mobile inn getterer therein
US6720656B2 (en) 1998-12-21 2004-04-13 Sharp Kabushiki Kaisha Semiconductor device with analysis prevention feature
US7750485B2 (en) 2005-07-05 2010-07-06 Fujitsu Semiconductor Limited Semiconductor device and method for manufacturing the same
US8076212B2 (en) 2005-07-05 2011-12-13 Fujitsu Semiconductor Limited Semiconductor device and method for manufacturing the same

Similar Documents

Publication Publication Date Title
JPH02246125A (en) Semiconductor device and manufacture thereof
JPH02272737A (en) Projecting electrode structure of semiconductor and formation of projecting electrode
JPH04345064A (en) Semiconductor integrated circuit device and its manufacture
JPH04218918A (en) Semiconductor device and its manufacture
JPS60106150A (en) Radiation proof package
JPS5624969A (en) Semiconductor integrated circuit element
JPH01283839A (en) Semiconductor device
JPH02151032A (en) Semiconductor device
JPS55163877A (en) Semiconductor integrated circuit device
JPS58212177A (en) Insulated gate type transistor and manufacture thereof
JPH02125447A (en) Semiconductor device and manufacture thereof
JPH03227539A (en) Semiconductor device
JPS5228280A (en) Semiconductor device
JPH02194558A (en) Semiconductor device and manufacture thereof
JPH0311666A (en) Semiconductor integrated circuit device
JPS5763831A (en) Semiconductor device
JPH02139893A (en) Luminous element
JPH04324958A (en) Semiconductor device
JPS6379348A (en) Semiconductor device
JPH0244751A (en) Manufacture of semiconductor device and semiconductor device
JPH02246246A (en) Manufacture of semiconductor device
JPS52131484A (en) Semiconductor device
JPH04206651A (en) Semiconductor device
JPS63211648A (en) Resin seal type semiconductor device
JPS57181146A (en) Resin-sealed semiconductor device