JPS63262860A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To prevent the permeation of moisture, to stabilize the performance of a device and to improve reliability by forming a metallic molded form onto the surface of a semiconductor chip. CONSTITUTION:Semiconductor chips 2 loaded onto a substrate 1 are coated directly with surface protective resin layers 3, metallic molded-form layers 4 molded so as to include the resin layers 3 are fast stuck, and a resin layer 5 is applied so as to coat the whole hybrid integrated circuit device. Accordingly, the permeation of moisture is prevented by the layer 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device, and more particularly to the structure of a protective coating for a hybrid integrated circuit device.

[Conventional technology]

``Conventionally, the structure of the protective coating for this type of hybrid integrated circuit was to cover it with multiple layers of resin, or to cover it with a metal molded body as the outermost layer.

[Problem that the invention seeks to solve]

The former covering structure in the conventional hybrid integrated circuit device described above has a structure in which a protective coating is made of resin as a coating layer, so moisture and other substances generally penetrate, resulting in poor reliability and low cost and high performance hybrid integrated circuit devices. The disadvantage is that an integrated circuit device cannot be realized.

In addition, in the latter case, where the outermost layer is covered with a metal molded body, the metal molded body is large, and the cover is covered with enough gaps to accommodate the different shapes and heights of the various components built into the hybrid integrated circuit device. It is necessary to process the metal molded body so that the shape of the metal body becomes more complex, and the more complicated the shape, the more difficult it is to realize a high-performance hybrid integrated circuit device at a low cost.

An object of the present invention is to provide a hybrid integrated circuit device that is highly reliable and inexpensive by preventing penetration of moisture and the like.

[Means for solving problems]

The present invention provides a hybrid integrated circuit device in which a plurality of semiconductor chips are mounted on a substrate on which a circuit is formed. This hybrid integrated circuit device is characterized by having a metal molded body that covers the hybrid integrated circuit device, and a resin layer that covers the entire hybrid integrated circuit device.

(Example〕 Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view showing the structure of an embodiment of the present invention.

In FIG. 1, a semiconductor chip 2 mounted on a substrate 1
Each of these is individually directly coated with a surface protection resin layer 3. Resin layer 3 refers to a resin that can be applied directly to the surface of a generally high-purity semiconductor, such as by eliminating ionic impurities that degrade the characteristics of semiconductors, and is used to prevent mechanical stress on semiconductor chips and connecting wires. Made of resins with properties that do not cause damage, such as

Further, a metal molded body layer 4 molded to include the resin layer 3 is brought into close contact with the resin layer 3, and a resin layer 5 is further applied so as to cover the entire hybrid integrated circuit device. The metal molded layer 4 is provided with a notch in the part that contacts the conductor so as not to short-circuit the conductor of the substrate 1, or an insulating film such as an oxide film is formed on the circuit conductor of the substrate 1 as in a commonly used structure. Needless to say, it is necessary to cover it with something.

In the hybrid integrated circuit configured in this way, moisture is prevented from penetrating by the metal molded body layer 4, and moisture does not penetrate into the chip 2 through the resin layer 3 on the semiconductor chip 2, achieving stable long-term reliability. is possible.

〔Effect of the invention〕

As explained above, the present invention includes a surface protection resin layer that directly covers a plurality of semiconductor chips mounted on a substrate, a metal molded body layer that covers the surface protection resin layer, and a resin that further covers the entire hybrid integrated circuit device. Since the metal molded body layer has a metal molded body layer, it is possible to prevent penetration of moisture and the like into the semiconductor chip, and the reliability of the chip can be maintained for a long period of time. Furthermore, since the metal molded body layer does not directly cover the chip, but covers the resin layer that covers the chip in advance, its shape can be simplified, and a high-performance hybrid integrated circuit device can be realized at low cost. This has the effect of

[Brief explanation of drawings]

FIG. 1 is a sectional view of a hybrid integrated circuit device which is an embodiment of the present invention. 1...Substrate 2...Semiconductor chip 3
...Surface protection resin layer 4...Metal molded body layer 5.
・Resin layer

Claims (1)

[Claims] (1) In a hybrid integrated circuit device in which a plurality of semiconductor chips are mounted on a substrate on which a circuit is formed, a surface protection resin layer that directly covers each semiconductor chip separately, and a resin layer for each surface protection resin layer. 1. A hybrid integrated circuit device comprising: a metal molded body covering the hybrid integrated circuit device; and a resin layer covering the entire hybrid integrated circuit device.