JPS5816339B2 - - Google Patents

Info

Publication number
JPS5816339B2
JPS5816339B2 JP4023675A JP4023675A JPS5816339B2 JP S5816339 B2 JPS5816339 B2 JP S5816339B2 JP 4023675 A JP4023675 A JP 4023675A JP 4023675 A JP4023675 A JP 4023675A JP S5816339 B2 JPS5816339 B2 JP S5816339B2
Authority
JP
Japan
Prior art keywords
reliability
semiconductor
stability
low cost
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4023675A
Other languages
Japanese (ja)
Other versions
JPS51115775A (en
Inventor
Manabu Bonshihara
Tsuneo Shishido
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Priority to JP4023675A priority Critical patent/JPS5816339B2/ja
Publication of JPS51115775A publication Critical patent/JPS51115775A/en
Publication of JPS5816339B2 publication Critical patent/JPS5816339B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:A semiconductor apparatus , which used a lead frame, which can be made with a low cost, also with high reliability and stability.
JP4023675A 1975-04-04 1975-04-04 Expired JPS5816339B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4023675A JPS5816339B2 (en) 1975-04-04 1975-04-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4023675A JPS5816339B2 (en) 1975-04-04 1975-04-04

Publications (2)

Publication Number Publication Date
JPS51115775A JPS51115775A (en) 1976-10-12
JPS5816339B2 true JPS5816339B2 (en) 1983-03-30

Family

ID=12575076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4023675A Expired JPS5816339B2 (en) 1975-04-04 1975-04-04

Country Status (1)

Country Link
JP (1) JPS5816339B2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5510140B2 (en) * 1975-06-24 1980-03-14
JPS57129229U (en) * 1981-02-06 1982-08-12
JPS6259892B2 (en) * 1981-07-24 1987-12-14 Fujitsu Ltd
JPH0410699Y2 (en) * 1982-01-21 1992-03-17
JPH041504B2 (en) * 1986-05-23 1992-01-13 Hitachi Ltd
JPS61258461A (en) * 1986-05-23 1986-11-15 Hitachi Ltd Electronic part
JPS63296346A (en) * 1987-05-28 1988-12-02 Hitachi Cable Ltd Film carrier for semiconductor device
JP4316019B2 (en) * 1996-10-01 2009-08-19 株式会社東芝 Semiconductor device and semiconductor device manufacturing method
CN1134839C (en) * 1997-12-26 2004-01-14 三星航空产业株式会社 Lead frame and method of plating lead frame

Also Published As

Publication number Publication date
JPS51115775A (en) 1976-10-12

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