JPH04192421A - Semiconductor device - Google Patents

Abstract

PURPOSE:To protect the end face of a semiconductor element and to improve reliability by covering the element with resin for protecting a pattern of the element to the end face of the element. CONSTITUTION:A pattern 2 is formed on the main surface of a wafer 1 by extending at an interval corresponding to a groove 5. Then, the groove 5 is formed by etching or cutting, and covered with protective resin covering the pattern 2 and also filling the groove 5. Thereafter, the wafer 1 is cut in a dicing step at a broken part, and separated into individual semiconductor elements 4. Thus, the end face of the element can be protected to improve reliability.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a semiconductor device.

[Conventional technology]

FIG. 2 shows a cross-sectional view of a conventional semiconductor device, and (al to (d)) show the manufacturing process thereof.

In the figure, (1) is the wafer, (2) is the pattern formed on the main surface of the wafer, (3) is the protective resin coated on the center of the pattern (2), and (4) is the individual separated pattern. ,
The semiconductor element (4) is sent to the next process, sealed, and assembled into a semiconductor device.

Next, the manufacturing process will be explained.

On the main surface of the wafer (1) shown in FIG. 2(a),
A pattern (2) is formed as shown in bl. Next, in FIG. 2(C), the central part of the pattern (2) is coated with a protective resin (3). Thereafter, the wafer (1) is cut along the broken line shown in FIG. 2(d) in a dicing step, and separated into individual semiconductor elements (4) as shown in FIG. 2(d).

The semiconductor element (4) is sealed and assembled as a semiconductor device through, for example, a die bonnet for fixing the semiconductor element (4) on a substrate, a wire bond for electrically connecting the semiconductor element (4) and external terminals, etc. .

[Invention or problem to be solved]

Conventional semiconductor devices are configured as described above, so
The edges of the semiconductor device are unprotected and therefore e.g.
In dicing, the material forming the pattern (for example, A
7) Peeling and die-cutting are caused by chipping and cracking due to damage to the end face of the semiconductor element, and wires are caused by the material (such as Au wire) connecting the electrode and external terminal coming into contact with the end face of the semiconductor element. There was a problem with Noyoto etc.

This invention was made to solve the above-mentioned problems, and aims to provide a highly reliable semiconductor device that can protect the end face of a semiconductor element.

[Means to solve the problem]

In the semiconductor device according to the present invention, the end face of the semiconductor element is coated with a resin that protects the pattern of the semiconductor element.

[Effect]

In the semiconductor device according to the present invention, the end face of the semiconductor element is protected by the resin, so the reliability of the semiconductor device is improved.

〔Example〕

Hereinafter, one embodiment of the present invention and the drawings will be described.

In FIG. 1, (al to (d) indicate the manufacturing process, and since (1) to (4) are the same as those described in the prior art, detailed explanations will be omitted. ( 5) is a groove formed on the main surface of the wafer (1).

Next, the manufacturing process will be explained.

On the main surface of the wafer (1) shown in FIG. 1(al), the intervals of the grooves (5) are widened, as shown in FIG. 1(b).
A pattern (2) is formed as shown in FIG. Then the first
As shown in Figure (C1), a groove (5) is formed by etching or cutting, and as shown in Figure 1 (d), the pattern (2゛) is filled up to the groove (5) without covering the top. Apply the protective resin (3) as shown below.After this, apply the protective resin (3) to the wafer (
1) is cut along the broken line shown in FIG. 1(d) in the dicing process, and separated into individual semiconductor elements (4) as shown in FIG. 1(e). The semiconductor element (4) is sealed via a die bond, a wire bond, etc., as described in the prior art section, and assembled as a semiconductor device.

In this embodiment, although the groove (5) is shown as U-shaped, the shape of the groove (5) is not limited to this.

In addition, in the above examples, there is no particular mention of the material of the protective resin, or if an insulating resin is used,
It is possible to prevent short circuits caused by contact between the wiring material and the end face of the semiconductor element in the wire pond.

〔Effect of the invention〕

As described above, according to the present invention, the resin that protects the surface of the semiconductor element also protects the end face of the semiconductor element, which can solve various problems in the assembly process, such as peeling of pattern material during dicing, die bonding, etc. It has the effect of reducing damage to the semiconductor element end face in the process, eliminating short-circuits between the connecting material and the semiconductor element end face in the wire pond, and producing a highly reliable semiconductor device.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional semiconductor device. In the figure, (11 is the wafer, (2) is the pattern, and (3) is the wafer.
) is a protective resin, (4) is a semiconductor element, and (5) is a groove. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] 1. A semiconductor device comprising a resin for protecting a surface of a semiconductor element, wherein an end face of the semiconductor element is protected by the resin.