JPH01206638A - テープボンダにおけるリード検出装置 - Google Patents

テープボンダにおけるリード検出装置

Info

Publication number
JPH01206638A
JPH01206638A JP3159588A JP3159588A JPH01206638A JP H01206638 A JPH01206638 A JP H01206638A JP 3159588 A JP3159588 A JP 3159588A JP 3159588 A JP3159588 A JP 3159588A JP H01206638 A JPH01206638 A JP H01206638A
Authority
JP
Japan
Prior art keywords
lead
camera
bond
reflector
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3159588A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0568100B2 (enExample
Inventor
Hisao Ishida
久雄 石田
Akihiro Nishimura
明浩 西村
Kimiharu Sato
公治 佐藤
Akio Bando
板東　昭雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP3159588A priority Critical patent/JPH01206638A/ja
Publication of JPH01206638A publication Critical patent/JPH01206638A/ja
Publication of JPH0568100B2 publication Critical patent/JPH0568100B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP3159588A 1988-02-13 1988-02-13 テープボンダにおけるリード検出装置 Granted JPH01206638A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3159588A JPH01206638A (ja) 1988-02-13 1988-02-13 テープボンダにおけるリード検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3159588A JPH01206638A (ja) 1988-02-13 1988-02-13 テープボンダにおけるリード検出装置

Publications (2)

Publication Number Publication Date
JPH01206638A true JPH01206638A (ja) 1989-08-18
JPH0568100B2 JPH0568100B2 (enExample) 1993-09-28

Family

ID=12335549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3159588A Granted JPH01206638A (ja) 1988-02-13 1988-02-13 テープボンダにおけるリード検出装置

Country Status (1)

Country Link
JP (1) JPH01206638A (enExample)

Also Published As

Publication number Publication date
JPH0568100B2 (enExample) 1993-09-28

Similar Documents

Publication Publication Date Title
US6196445B1 (en) Method for positioning the bond head in a wire bonding machine
JP7029900B2 (ja) ダイボンディング装置および半導体装置の製造方法
US4887758A (en) Apparatus for connecting external leads
JPH01206638A (ja) テープボンダにおけるリード検出装置
JP3451189B2 (ja) チップ認識装置およびこれを備えたチップ実装装置
JP3986196B2 (ja) 光半導体装置の製造方法
JP2000164626A (ja) 部品のボンディング方法および装置
CN101165707B (zh) 用于电子器件模式识别的图像捕获
JPS6148703A (ja) 部品自動搭載装置における保持位置確認装置
JP4077553B2 (ja) 電子部品装着方法および電子部品装着装置
KR940007536B1 (ko) 범프 부착방법
JPH05104380A (ja) 加工位置合わせ方法
JP2769200B2 (ja) ボンディング方法および装置
JP3252344B2 (ja) チップ位置決め装置
JPH0393244A (ja) ボンディング装置
JP2701174B2 (ja) バンプ付け方法
JPH01227445A (ja) バンプ付け方法
JPH02199900A (ja) 電子部品実装装置
JPH10256278A (ja) テープ搬送機構を有する装置
JPS5911637A (ja) ワイヤ−ボンデイング装置
JPH0752740B2 (ja) ボンディング方法
JPH0467783B2 (enExample)
JPS6139530A (ja) インナ−リ−ドボンダ−
JPS58161333A (ja) 半導体製造装置
JPS60144941A (ja) ワイヤボンデイング装置

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees