JPH01204460A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPH01204460A JPH01204460A JP63027516A JP2751688A JPH01204460A JP H01204460 A JPH01204460 A JP H01204460A JP 63027516 A JP63027516 A JP 63027516A JP 2751688 A JP2751688 A JP 2751688A JP H01204460 A JPH01204460 A JP H01204460A
- Authority
- JP
- Japan
- Prior art keywords
- tab
- lead
- recess
- suspension lead
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 21
- 239000000725 suspension Substances 0.000 claims description 29
- 230000009545 invasion Effects 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は主に樹脂封止型半導体装置用リードフレームに
係り、耐湿性に優れた半導体装置を提供するための半導
体装置用リードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention mainly relates to a lead frame for a resin-sealed semiconductor device, and more particularly, to a lead frame for a semiconductor device for providing a semiconductor device with excellent moisture resistance.
従来の樹脂封止型半導体装置は一般に、第７図に示すよ
うにタブ２上に固定された半導体素子１と、この半導体
素子とボンデングワイヤ５により接続されたリード４と
を、樹脂封止型材料６で封止して形成したパッケージか
ら構成されている。Conventional resin-sealed semiconductor devices generally include a semiconductor element 1 fixed on a tab 2 and leads 4 connected to this semiconductor element by bonding wires 5, as shown in FIG. It consists of a package sealed with mold material 6.
タブはタブ吊りリード３により、リードフレーム外枠と
接続されているが、パッケージの樹脂封止後、タブ吊り
リードと外枠を切断するため、タブ吊りリードの反タブ
側はパッケージ外端に直接露出している。このため、パ
ッケージの耐湿信頼性試験などを行うと、タブ吊りリー
ド露出部９のリードとレジン間のすき間から水分がパッ
ケージ内部に侵入し、Ａｆｌ配線などを腐食させるなど
して、信頼性を低下させる原因になっている。このタブ
吊りリードからの水分の侵入を防止する従来技術として
、タブ吊りリードに折曲部を設け、パッケージ外端部か
らタブまでのタブ吊りリードの有効長さを長くして、す
なわち、水分の侵入経路を長くして耐湿性の向上を図っ
た構造のものが、特開昭６１−５５５７号に開示されて
いる。また、タブ吊りリードの板厚方向に凹凸を設けた
構造のものが特開昭６１−１２８５５１号に開示されて
いる。The tab is connected to the lead frame outer frame by the tab suspension lead 3, but after the package is sealed with resin, the tab suspension lead and the outer frame are cut, so the side opposite to the tab of the tab suspension lead is connected directly to the outer edge of the package. exposed. For this reason, when a moisture resistance reliability test of the package is performed, moisture enters the package through the gap between the leads and the resin in the tab hanging lead exposed portion 9, corrodes the Afl wiring, etc., and reduces reliability. It is the cause of this. As a conventional technique to prevent moisture from entering from the tab suspension lead, the tab suspension lead is provided with a bent part to increase the effective length of the tab suspension lead from the outer edge of the package to the tab. JP-A No. 61-5557 discloses a structure in which the penetration route is lengthened to improve moisture resistance. Furthermore, Japanese Patent Laid-Open No. 128551/1983 discloses a tab suspension lead having a structure in which unevenness is provided in the thickness direction.
上記従来技術は、折曲部の寸法がタブ吊りリード幅ａの
数倍の長さが必要であるため、タブ端とパッケージ外端
までの距離すが短かい第８図に示すようなパッケージに
対しては製作が円環である。In the above conventional technology, the length of the bent part needs to be several times the tab suspension lead width a, so the distance between the tab end and the outer edge of the package is short, as shown in Fig. 8. On the other hand, production is circular.
また、後者の従来技術では、リードにつけた凹凸によっ
て水分の侵入経路を長くできるが、構造の制約から、大
幅な侵入経路長の増加は期待できない欠点がある。この
ため、タブ端とパッケージ外端部との寸法が小さくなら
ざるを得ない半導体装置において耐湿パッケージ構造の
開発が期待されていた。In addition, in the latter conventional technique, the moisture intrusion path can be lengthened by the unevenness provided on the lead, but there is a drawback that a significant increase in the intrusion path length cannot be expected due to structural limitations. Therefore, the development of a moisture-resistant package structure has been expected for semiconductor devices in which the dimensions between the tab end and the outer end of the package must be reduced.
゛ 本発明の目的は、耐湿性に優れたパッケージ構造用
のリードフレーム構造を開発することにある。゛ An object of the present invention is to develop a lead frame structure for a package structure with excellent moisture resistance.
上記目的は、タブの一部を切除し、その切除部よりタブ
吊りリードを出すことにより達成される。The above object is achieved by cutting out a part of the tab and extending the tab suspension lead from the cut out part.
さらに、タブ吊りリード部と半導体素子が重なる部分の
タブ吊りリード表面をタブ表面より低くなるようタブ吊
りリードに段差を設ければ、上記目的をより確実に達成
できる。とりわけ、タブコーナ部を切除し、切除により
形成された辺より、タブ吊りリードを引き出すことが好
ましい。また、切除により形成された辺の一部に凹部を
設け、凹部よりタブ吊りリードを引き出すことも好適で
ある。また、これらの各構成の組合せも有効である。Further, the above object can be achieved more reliably by providing a step on the tab suspension lead so that the surface of the tab suspension lead where the tab suspension lead portion overlaps with the semiconductor element is lower than the tab surface. In particular, it is preferable to cut out the tab corner portion and pull out the tab hanging lead from the edge formed by the cutting. It is also preferable to provide a recessed portion in a part of the side formed by cutting, and to draw out the tab suspension lead from the recessed portion. Furthermore, a combination of these configurations is also effective.
また半導体素子と重なり部分のタブ吊りリードの表面を
タブ表面よりも低くなるようタブ吊りリードに段差を設
けることも有効である。It is also effective to provide a step on the tab suspension lead so that the surface of the tab suspension lead in the portion overlapping with the semiconductor element is lower than the tab surface.
上記構造を採用することにより、タブ吊りリードの長さ
を長くとれる。さらに、半導体素子とタブ吊νリードが
重なる部分には段差を設ければ、その部分は封止樹脂で
充填される。このため、タブ吊りリードつけ根部からパ
ッケージ外端部までが水分の侵入経路となるため、従来
構造のものに比し、上記侵入経路が長くとれ、従って、
耐湿性が向上する。切除部の長さはかなり自由に選択で
きるため、耐湿性の観点から必要なタブ吊りリード長さ
を容易に確保できる。By adopting the above structure, the length of the tab suspension lead can be increased. Further, if a step is provided in the portion where the semiconductor element and the tab-suspended ν lead overlap, that portion is filled with the sealing resin. Therefore, the path for moisture to enter from the base of the tab hanging lead to the outer edge of the package is longer than that of conventional structures.
Improves moisture resistance. Since the length of the cutout part can be selected fairly freely, it is possible to easily secure the necessary length of the tab hanging lead from the viewpoint of moisture resistance.
以下、本発明の実施例を第１図〜第３図により説明する
。Embodiments of the present invention will be described below with reference to FIGS. 1 to 3.
第１図は本発明の実施例であり、タブの短辺側に凹部７
を設け、凹部内よりタブ吊りリード３を出している。第
２図は別の実施例であり、タブコーナ部からタブ吊りリ
ードが出ている構造のものに対する実施例である。タブ
のコーナ部を切除し、切除部８より、タブ吊りリードを
取り出す構造である。第３図では、切除した辺にさらに
凹部７を設け、凹部よりタブ吊りリードを出している。FIG. 1 shows an embodiment of the present invention, in which a recess 7 is formed on the short side of the tab.
is provided, and a tab suspension lead 3 is brought out from inside the recess. FIG. 2 shows another embodiment, and is an embodiment for a structure in which tab suspension leads protrude from tab corner portions. The corner part of the tab is cut out, and the tab suspension lead is taken out from the cutout part 8. In FIG. 3, a recess 7 is further provided on the cut side, and a tab suspension lead is extended from the recess.
第４図は別の実施例であり、一つのリードフレームにお
いて、上記第１図、第２図の方法を同時に実施した構造
のものである。FIG. 4 shows another embodiment, which has a structure in which the methods shown in FIGS. 1 and 2 are simultaneously carried out in one lead frame.
上記第１図〜第４図の実施例において、半導体素子１と
重なるタブ吊りリードの部分にはタブ部と段差Ｃを設け
ることにより、本発明の効果をさらに高めることができ
る。段差Ｃを設けることによりタブ吊りリード表面と素
子との間隙に封止樹脂が十分充填され水分侵入経路が長
くとれる。第５図はタブ吊りリードの折曲により段差を
形成したものである。第６図はタブ吊りリードの厚みを
変えることにより５段差を設けた構造のものである。す
なわち、タブ吊りリードと素子の重なり部のタブ吊りリ
ードの板厚を薄くして段差Ｃを設けたものである。板厚
を薄くする方法としては、プレス加工でもよいし、エツ
チング加工でもよい。In the embodiments shown in FIGS. 1 to 4, the effects of the present invention can be further enhanced by providing a tab portion and a step C in the portion of the tab suspension lead that overlaps with the semiconductor element 1. By providing the step C, the gap between the tab suspension lead surface and the element is sufficiently filled with the sealing resin, and a long moisture intrusion path is provided. FIG. 5 shows a step formed by bending the tab suspension lead. FIG. 6 shows a structure in which five steps are provided by changing the thickness of the tab suspension lead. That is, a step C is provided by reducing the thickness of the tab suspension lead at the overlapped portion of the tab suspension lead and the element. The method for reducing the plate thickness may be press working or etching.
上記段差は５０〜１５０μｍ程度とするのが望ましい。It is desirable that the step difference be approximately 50 to 150 μm.
本実施例によれば、いずれもタブ吊りリードが長くとれ
、従って、水分の侵入経路も長くとれるため、耐湿性の
優れたパッケージを提供することができる。本発明は、
特に、タブ端あるいはチップ端とパッケージ外端部の寸
法が小さいパッケージ構造に対して効果がある。According to this embodiment, the tab hanging lead can be long, and therefore the path for moisture to enter can be long, so that a package with excellent moisture resistance can be provided. The present invention
This is particularly effective for package structures in which the dimensions of the tab end or chip end and the outer end of the package are small.
第１図〜第４図はそれぞれ本発明の実施例を示す半導体
装置用リードフレーム要部の平面図、第５図、第６図は
それぞれ本発明の実施例を示す半導体装置用リードフレ
ーム要部の断面図、第７図は樹脂封止半導体パッケージ
の平面図、第８図は半導体装置用リードフレーム要部の
平面図である。
１・・・半導体素子、２・・・タブ、３・・・タブ吊り
リード。
４・・・リード、５・・・ボンデングワイヤ、６・・・
樹脂。
７・・・凹部、８・・・切除部、９・・・タブ吊りリー
ド露出部、１０・・・半導体素子とタブ吊りリードの重
なり３− タブ吊りリード
も ３ ロ
８４図
、為ち る 図
冷″７０1 to 4 are plan views of main parts of lead frames for semiconductor devices showing embodiments of the present invention, and FIGS. 5 and 6 are plan views of main parts of lead frames for semiconductor devices showing embodiments of the invention, respectively. FIG. 7 is a plan view of a resin-sealed semiconductor package, and FIG. 8 is a plan view of a main part of a lead frame for a semiconductor device. 1... Semiconductor element, 2... Tab, 3... Tab suspension lead. 4... Lead, 5... Bonding wire, 6...
resin. 7... Recessed part, 8... Cutout part, 9... Tab hanging lead exposed part, 10... Overlapping of semiconductor element and tab hanging lead 3- Tab hanging lead also 3. cold 70
Claims (1)
めのタブ吊りリードを備える半導体リードフレームにお
いて、タブの長、短辺の一部に凹部を設け、その凹部よ
りタブ吊りリードを引き出したことを特徴とする半導体
装置用リードフレーム。1. In a semiconductor lead frame equipped with a tab on which a semiconductor element is mounted and a tab suspension lead for supporting this tab, a recess is provided in part of the long and short sides of the tab, and the tab suspension lead is pulled out from the recess. A lead frame for semiconductor devices characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63027516A JPH01204460A (en) | 1988-02-10 | 1988-02-10 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63027516A JPH01204460A (en) | 1988-02-10 | 1988-02-10 | Lead frame for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01204460A true JPH01204460A (en) | 1989-08-17 |
Family
ID=12223291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63027516A Pending JPH01204460A (en) | 1988-02-10 | 1988-02-10 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01204460A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015012235A (en) * | 2013-07-01 | 2015-01-19 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| JP2018190875A (en) * | 2017-05-10 | 2018-11-29 | ローム株式会社 | Semiconductor device |
-
1988
- 1988-02-10 JP JP63027516A patent/JPH01204460A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015012235A (en) * | 2013-07-01 | 2015-01-19 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| JP2018190875A (en) * | 2017-05-10 | 2018-11-29 | ローム株式会社 | Semiconductor device |
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