JPH01200693A - 厚膜回路形成装置を校正する方法及び装置 - Google Patents

厚膜回路形成装置を校正する方法及び装置

Info

Publication number
JPH01200693A
JPH01200693A JP2549688A JP2549688A JPH01200693A JP H01200693 A JPH01200693 A JP H01200693A JP 2549688 A JP2549688 A JP 2549688A JP 2549688 A JP2549688 A JP 2549688A JP H01200693 A JPH01200693 A JP H01200693A
Authority
JP
Japan
Prior art keywords
paste
line width
current
supply pressure
value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2549688A
Other languages
English (en)
Japanese (ja)
Inventor
Yasu Yanagisawa
柳澤　縁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Priority to JP2549688A priority Critical patent/JPH01200693A/ja
Priority to FR8901429A priority patent/FR2627109B1/fr
Priority to DE19893903245 priority patent/DE3903245A1/de
Priority to CH38189A priority patent/CH679536A5/de
Publication of JPH01200693A publication Critical patent/JPH01200693A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electronic Switches (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2549688A 1988-02-05 1988-02-05 厚膜回路形成装置を校正する方法及び装置 Pending JPH01200693A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2549688A JPH01200693A (ja) 1988-02-05 1988-02-05 厚膜回路形成装置を校正する方法及び装置
FR8901429A FR2627109B1 (fr) 1988-02-05 1989-02-03 Procede et appareil pour l'etalonnage de systeme de production de motif pour circuit a film epais
DE19893903245 DE3903245A1 (de) 1988-02-05 1989-02-03 Verfahren und geraet zur kalibrierung von herstellungssystemen fuer dickfilm-schaltkreismuster
CH38189A CH679536A5 (enrdf_load_stackoverflow) 1988-02-05 1989-02-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2549688A JPH01200693A (ja) 1988-02-05 1988-02-05 厚膜回路形成装置を校正する方法及び装置

Publications (1)

Publication Number Publication Date
JPH01200693A true JPH01200693A (ja) 1989-08-11

Family

ID=12167672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2549688A Pending JPH01200693A (ja) 1988-02-05 1988-02-05 厚膜回路形成装置を校正する方法及び装置

Country Status (4)

Country Link
JP (1) JPH01200693A (enrdf_load_stackoverflow)
CH (1) CH679536A5 (enrdf_load_stackoverflow)
DE (1) DE3903245A1 (enrdf_load_stackoverflow)
FR (1) FR2627109B1 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02187096A (ja) * 1989-01-13 1990-07-23 Matsushita Electric Ind Co Ltd 描画方法及び描画装置
JP2008160105A (ja) * 2006-12-20 2008-07-10 Palo Alto Research Center Inc 滑らかなマイクロスケールの形状の印刷方法
CN114798349A (zh) * 2022-03-01 2022-07-29 刘鹏祥 一种自动校准喷涂水性胶流量的方法和系统
CN115972783A (zh) * 2023-02-08 2023-04-18 深圳市银之杰科技股份有限公司 一种用于实物印控管控的一体化装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120302547A (zh) * 2025-06-09 2025-07-11 信丰福昌发电子有限公司 一种毫米波雷达线路板高精度加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831448A (enrdf_load_stackoverflow) * 1971-08-12 1973-04-25
JPS58176995A (ja) * 1982-04-09 1983-10-17 松下電器産業株式会社 電子回路板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138178A (en) * 1983-04-13 1984-10-17 Ford Motor Co Controlling an adhesive laying machine
JPS60219791A (ja) * 1984-04-16 1985-11-02 松下電器産業株式会社 厚膜回路の形成装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831448A (enrdf_load_stackoverflow) * 1971-08-12 1973-04-25
JPS58176995A (ja) * 1982-04-09 1983-10-17 松下電器産業株式会社 電子回路板の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02187096A (ja) * 1989-01-13 1990-07-23 Matsushita Electric Ind Co Ltd 描画方法及び描画装置
JP2008160105A (ja) * 2006-12-20 2008-07-10 Palo Alto Research Center Inc 滑らかなマイクロスケールの形状の印刷方法
CN114798349A (zh) * 2022-03-01 2022-07-29 刘鹏祥 一种自动校准喷涂水性胶流量的方法和系统
CN114798349B (zh) * 2022-03-01 2023-11-10 刘鹏祥 一种自动校准喷涂水性胶流量的方法和系统
CN115972783A (zh) * 2023-02-08 2023-04-18 深圳市银之杰科技股份有限公司 一种用于实物印控管控的一体化装置

Also Published As

Publication number Publication date
CH679536A5 (enrdf_load_stackoverflow) 1992-02-28
FR2627109B1 (fr) 1992-12-04
DE3903245A1 (de) 1989-08-17
FR2627109A1 (fr) 1989-08-18

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