FR2627109B1 - Procede et appareil pour l'etalonnage de systeme de production de motif pour circuit a film epais - Google Patents

Procede et appareil pour l'etalonnage de systeme de production de motif pour circuit a film epais

Info

Publication number
FR2627109B1
FR2627109B1 FR8901429A FR8901429A FR2627109B1 FR 2627109 B1 FR2627109 B1 FR 2627109B1 FR 8901429 A FR8901429 A FR 8901429A FR 8901429 A FR8901429 A FR 8901429A FR 2627109 B1 FR2627109 B1 FR 2627109B1
Authority
FR
France
Prior art keywords
calibration
thick film
production system
film circuit
pattern production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR8901429A
Other languages
English (en)
French (fr)
Other versions
FR2627109A1 (fr
Inventor
Yukari Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Publication of FR2627109A1 publication Critical patent/FR2627109A1/fr
Application granted granted Critical
Publication of FR2627109B1 publication Critical patent/FR2627109B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electronic Switches (AREA)
  • Manufacturing Of Electric Cables (AREA)
FR8901429A 1988-02-05 1989-02-03 Procede et appareil pour l'etalonnage de systeme de production de motif pour circuit a film epais Expired - Lifetime FR2627109B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2549688A JPH01200693A (ja) 1988-02-05 1988-02-05 厚膜回路形成装置を校正する方法及び装置

Publications (2)

Publication Number Publication Date
FR2627109A1 FR2627109A1 (fr) 1989-08-18
FR2627109B1 true FR2627109B1 (fr) 1992-12-04

Family

ID=12167672

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8901429A Expired - Lifetime FR2627109B1 (fr) 1988-02-05 1989-02-03 Procede et appareil pour l'etalonnage de systeme de production de motif pour circuit a film epais

Country Status (4)

Country Link
JP (1) JPH01200693A (enrdf_load_stackoverflow)
CH (1) CH679536A5 (enrdf_load_stackoverflow)
DE (1) DE3903245A1 (enrdf_load_stackoverflow)
FR (1) FR2627109B1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2759999B2 (ja) * 1989-01-13 1998-05-28 松下電器産業株式会社 描画方法及び描画装置
US7524015B2 (en) * 2006-12-20 2009-04-28 Palo Alto Research Center Incorporated Method of printing smooth micro-scale features
CN114798349B (zh) * 2022-03-01 2023-11-10 刘鹏祥 一种自动校准喷涂水性胶流量的方法和系统
CN115972783B (zh) * 2023-02-08 2024-09-20 深圳市银之杰科技股份有限公司 一种用于实物印控管控的一体化装置
CN120302547A (zh) * 2025-06-09 2025-07-11 信丰福昌发电子有限公司 一种毫米波雷达线路板高精度加工方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831448A (enrdf_load_stackoverflow) * 1971-08-12 1973-04-25
JPS58176995A (ja) * 1982-04-09 1983-10-17 松下電器産業株式会社 電子回路板の製造方法
GB2138178A (en) * 1983-04-13 1984-10-17 Ford Motor Co Controlling an adhesive laying machine
JPS60219791A (ja) * 1984-04-16 1985-11-02 松下電器産業株式会社 厚膜回路の形成装置

Also Published As

Publication number Publication date
CH679536A5 (enrdf_load_stackoverflow) 1992-02-28
DE3903245A1 (de) 1989-08-17
JPH01200693A (ja) 1989-08-11
FR2627109A1 (fr) 1989-08-18

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Legal Events

Date Code Title Description
ST Notification of lapse