JP2008160105A - 滑らかなマイクロスケールの形状の印刷方法 - Google Patents
滑らかなマイクロスケールの形状の印刷方法 Download PDFInfo
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- JP2008160105A JP2008160105A JP2007321888A JP2007321888A JP2008160105A JP 2008160105 A JP2008160105 A JP 2008160105A JP 2007321888 A JP2007321888 A JP 2007321888A JP 2007321888 A JP2007321888 A JP 2007321888A JP 2008160105 A JP2008160105 A JP 2008160105A
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- 238000007639 printing Methods 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 86
- 230000008569 process Effects 0.000 claims description 23
- 238000003860 storage Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 22
- 239000011295 pitch Substances 0.000 description 15
- 239000001993 wax Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 10
- 230000008859 change Effects 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 239000012071 phase Substances 0.000 description 9
- 239000012782 phase change material Substances 0.000 description 9
- 230000007480 spreading Effects 0.000 description 8
- 238000003892 spreading Methods 0.000 description 8
- 238000000059 patterning Methods 0.000 description 7
- 238000007711 solidification Methods 0.000 description 7
- 230000008023 solidification Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000004581 coalescence Methods 0.000 description 6
- 230000005684 electric field Effects 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000009736 wetting Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000008014 freezing Effects 0.000 description 3
- 238000007710 freezing Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000006399 behavior Effects 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000006194 liquid suspension Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ink Jet (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
【解決手段】印刷処理方向と各プリントヘッド上に1つ又はそれ以上のエゼクタを備えた1つ又はそれ以上のプリントヘッドとを有する印刷システムを用いて、基板上に印刷スポットで滑らかなマイクロスケール形状を形成する方法であって、前記印刷スポットの半径を決定し、試験パターンを生成し、前記印刷システムで前記試験パターンを印刷し、前記印刷された試験パターンを、液滴の拡がり及びラインの滑らかさに関して分析するステップを含む。
【選択図】図1
Description
により求められ、ここで、Taは雰囲気温度、Tfは融解温度、αとkは各々、溶融した液滴の熱拡散率と熱伝導率であり、ksは基板の熱伝導率、Lは融解潜熱、cは溶融液滴の比熱である。
によって与えられる。基板上に拡がる液滴の動力学は、ウェーバー数Weとオーネゾルゲ(Ohnesorge)数Zに主として支配され、
ここで、μは粘度、ρは密度、σは表面張力、Vは衝突速度、及びaは液滴の半径である。
に等しい距離だけ移動させる(308)。N=100か否かついての判定が行われる(310)。否の場合は、Nは1つずつ増やされて、噴射工程が繰り返される(312)。否でない場合は、Kが1つずつ増やされる(312)。K=M−1か否かについて、更なる判定が行われる(314)。否の場合は、Nが1に設定され、工程が繰り返される。否でない場合は、工程は終了する。M、N及びKに関係する特定の値は、この例で提示したものとは異なってもよいことに留意されたい。
に等しい距離だけ移動させる(408)。N=50か否かについての判定が行われる(410)。否の場合は、Nは1つずつ増やされて、噴射工程が繰り返される(412)。否でない場合は、基板120を、まず開始点まで移動させ(414)、次に処理方向に対して垂直に、
に等しい距離を移動させる(416)。もう一度、1つの液滴が、全エゼクタから基板120上に噴射される(418)。N=50であるか否かについての判定が行われる(420)。否の場合は、Nが1ずつ増やされて、基板120を再び移動させる(422)。否でない場合は、Kが1ずつ増やされ(424)、K=M−1か否かについての判定が行われる(426)。否の場合は、工程が繰り返される。そうでない場合は、工程は終了する。M、N及びKに関係する特定の値は、この例で提示したものとは異なってもよいことに留意されたい。
104:熱源
108:リザーバ
109:圧盤
112:液滴供給源
113:マーク
116:液滴
120:基板
121:空間
122:電界
123:温度制御回路
124:制御回路
128:駆動回路
130:カメラ
450:スポット
452:ライン
Claims (4)
- 印刷処理方向と各プリントヘッド上に1つ又はそれ以上のエゼクタを備えた1つ又はそれ以上のプリントヘッドとを有する印刷システムを用いて、基板上に印刷スポットで滑らかなマイクロスケール形状を形成する方法であって、
前記印刷スポットの半径を決定し、
試験パターンを生成し、
前記印刷システムで前記試験パターンを印刷し、
前記印刷された試験パターンを、液滴の拡がり及びラインの滑らかさに関して分析するステップ、
を含むことを特徴とする方法。 - 前記印刷された試験パターンを分析するステップが、前記試験パターンの既知の位置について、
(a)ライン幅を表す性能指数を計算し、
(b)粗さを表す性能指数値を計算し、
(c)最適なライン幅と粗さが達成されたか否かを判定し、
(d)前記粗さが許容できなければ、前記基板をポストベークするステップ、
を含むことを特徴とする請求項1に記載の方法。 - データ処理装置上で実行可能であり、且つ、印刷処理方向と各プリントヘッド上に1つ又はそれ以上のエゼクタを備えた1つ又はそれ以上のプリントヘッドとを有する印刷システムを用いて基板上に印刷スポットで滑らかなマイクロスケール形状を形成するために使用可能な、1組のプログラム命令を格納する記憶媒体であって、
スポット配置ピッチと前記印刷スポットの半径とを決定するための命令と、
試験パターンを生成するための命令と、
前記印刷システムで前記試験パターンを印刷するための命令と、
前記印刷された試験パターンを、液滴の拡がり及びラインの滑らかさに関して分析するための命令と、
を含むことを特徴とする記憶媒体。 - 前記印刷システムが、多数のプリントヘッドを有することを特徴とする請求項3に記載の記憶媒体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/642,146 US7524015B2 (en) | 2006-12-20 | 2006-12-20 | Method of printing smooth micro-scale features |
US11/642,146 | 2006-12-20 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008160105A true JP2008160105A (ja) | 2008-07-10 |
JP2008160105A5 JP2008160105A5 (ja) | 2011-01-27 |
JP4748606B2 JP4748606B2 (ja) | 2011-08-17 |
Family
ID=39146883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007321888A Expired - Fee Related JP4748606B2 (ja) | 2006-12-20 | 2007-12-13 | 滑らかなマイクロスケールの形状の印刷方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7524015B2 (ja) |
EP (1) | EP1937045B1 (ja) |
JP (1) | JP4748606B2 (ja) |
CN (1) | CN101204890B (ja) |
DE (1) | DE602007010891D1 (ja) |
TW (1) | TWI397360B (ja) |
Cited By (2)
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---|---|---|---|---|
JP2020536227A (ja) * | 2017-09-05 | 2020-12-10 | アレイジェット リミテッドArrayjet Limited | 印刷されたマイクロアレイを作成するための方法及びデバイス |
WO2023058227A1 (ja) * | 2021-10-08 | 2023-04-13 | 株式会社Fuji | 配線形成方法、および情報処理装置 |
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---|---|---|---|---|
US8968985B2 (en) * | 2007-03-30 | 2015-03-03 | Palo Alto Research Center Incorporated | Method and system for patterning a mask layer |
US8551556B2 (en) * | 2007-11-20 | 2013-10-08 | Palo Alto Research Center Incorporated | Method for obtaining controlled sidewall profile in print-patterned structures |
US8251476B2 (en) | 2010-02-03 | 2012-08-28 | Xerox Corporation | Ink drop position correction in the process direction based on ink drop position history |
US8262190B2 (en) | 2010-05-14 | 2012-09-11 | Xerox Corporation | Method and system for measuring and compensating for process direction artifacts in an optical imaging system in an inkjet printer |
US8721026B2 (en) | 2010-05-17 | 2014-05-13 | Xerox Corporation | Method for identifying and verifying dash structures as candidates for test patterns and replacement patterns in an inkjet printer |
CN102186309B (zh) * | 2011-03-22 | 2013-03-20 | 鞍山市正发电路有限公司 | 激光直接成像全印刷电路 |
US20140060144A1 (en) * | 2012-08-30 | 2014-03-06 | Illnois Tool Works Inc. | Method and apparatus for calibrating dispensed deposits |
US8840223B2 (en) | 2012-11-19 | 2014-09-23 | Xerox Corporation | Compensation for alignment errors in an optical sensor |
US8764149B1 (en) | 2013-01-17 | 2014-07-01 | Xerox Corporation | System and method for process direction registration of inkjets in a printer operating with a high speed image receiving surface |
US9144818B2 (en) | 2013-03-13 | 2015-09-29 | Illinois Tool Works Inc. | Method and apparatus for dispensing a viscous material on a substrate |
US9374905B2 (en) | 2013-09-30 | 2016-06-21 | Illinois Tool Works Inc. | Method and apparatus for automatically adjusting dispensing units of a dispenser |
US9357686B2 (en) | 2013-11-14 | 2016-05-31 | Illinois Tool Works Inc. | Dispensing apparatus having substrate inverter system and clamping system, and method for dispensing a viscous material on a substrate |
US9662675B2 (en) | 2014-07-31 | 2017-05-30 | Illinois Tool Works Inc. | External inverter system for variable substrate thickness and method for rotating a substrate |
US11108918B2 (en) | 2017-01-17 | 2021-08-31 | Hewlett-Packard Development Company, L.P. | Assessing print quality using intensity histograms and perimeter lengths |
KR20220110861A (ko) | 2019-02-14 | 2022-08-09 | 오르보테크 엘티디. | 고밀도 도체를 갖는 pcb 제품을 제조하기 위한 방법 및 장치 |
TWI746320B (zh) | 2020-12-18 | 2021-11-11 | 財團法人工業技術研究院 | 產生及更新定位分布圖的方法及其系統 |
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2006
- 2006-12-20 US US11/642,146 patent/US7524015B2/en active Active
-
2007
- 2007-12-13 JP JP2007321888A patent/JP4748606B2/ja not_active Expired - Fee Related
- 2007-12-17 DE DE602007010891T patent/DE602007010891D1/de active Active
- 2007-12-17 EP EP07123357A patent/EP1937045B1/en not_active Ceased
- 2007-12-18 TW TW096148355A patent/TWI397360B/zh not_active IP Right Cessation
- 2007-12-19 CN CN2007101603044A patent/CN101204890B/zh not_active Expired - Fee Related
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JPH01200693A (ja) * | 1988-02-05 | 1989-08-11 | Juki Corp | 厚膜回路形成装置を校正する方法及び装置 |
JPH0210884A (ja) * | 1988-06-29 | 1990-01-16 | Matsushita Electric Ind Co Ltd | 厚膜描画方法 |
JPH0240993A (ja) * | 1988-07-30 | 1990-02-09 | Juki Corp | 回路形成装置における描画ピッチ設定装置 |
JP2003305829A (ja) * | 2002-04-17 | 2003-10-28 | Noritsu Koki Co Ltd | 画像形成装置 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020536227A (ja) * | 2017-09-05 | 2020-12-10 | アレイジェット リミテッドArrayjet Limited | 印刷されたマイクロアレイを作成するための方法及びデバイス |
JP7005850B2 (ja) | 2017-09-05 | 2022-01-24 | アレイジェット リミテッド | 印刷されたマイクロアレイを作成するための方法及びデバイス |
WO2023058227A1 (ja) * | 2021-10-08 | 2023-04-13 | 株式会社Fuji | 配線形成方法、および情報処理装置 |
Also Published As
Publication number | Publication date |
---|---|
US7524015B2 (en) | 2009-04-28 |
TWI397360B (zh) | 2013-05-21 |
JP4748606B2 (ja) | 2011-08-17 |
DE602007010891D1 (de) | 2011-01-13 |
CN101204890B (zh) | 2011-11-23 |
CN101204890A (zh) | 2008-06-25 |
EP1937045A1 (en) | 2008-06-25 |
US20080150989A1 (en) | 2008-06-26 |
TW200908835A (en) | 2009-02-16 |
EP1937045B1 (en) | 2010-12-01 |
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