JPH0119397Y2 - - Google Patents
Info
- Publication number
- JPH0119397Y2 JPH0119397Y2 JP1982044487U JP4448782U JPH0119397Y2 JP H0119397 Y2 JPH0119397 Y2 JP H0119397Y2 JP 1982044487 U JP1982044487 U JP 1982044487U JP 4448782 U JP4448782 U JP 4448782U JP H0119397 Y2 JPH0119397 Y2 JP H0119397Y2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- semiconductor
- pellets
- sheet
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/90—
-
- H10W72/5449—
-
- H10W72/926—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982044487U JPS58147248U (ja) | 1982-03-29 | 1982-03-29 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982044487U JPS58147248U (ja) | 1982-03-29 | 1982-03-29 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58147248U JPS58147248U (ja) | 1983-10-03 |
| JPH0119397Y2 true JPH0119397Y2 (OSRAM) | 1989-06-05 |
Family
ID=30055543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982044487U Granted JPS58147248U (ja) | 1982-03-29 | 1982-03-29 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58147248U (OSRAM) |
-
1982
- 1982-03-29 JP JP1982044487U patent/JPS58147248U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58147248U (ja) | 1983-10-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5936249U (ja) | 少くとも1つの集積回路デバイスのためのフラツト・パツケ−ジ | |
| JPS5992556A (ja) | 半導体装置 | |
| JP2501953B2 (ja) | 半導体装置 | |
| JPH0119397Y2 (OSRAM) | ||
| JPH03101128A (ja) | 半導体チップの製造方法 | |
| JP2682200B2 (ja) | 半導体装置 | |
| JPH04142073A (ja) | 半導体装置 | |
| JPH0364934A (ja) | 樹脂封止型半導体装置 | |
| JPS5844593Y2 (ja) | ビ−ム・リ−ド型半導体装置 | |
| JPS6120051U (ja) | 半導体装置の外囲器 | |
| JPS6041728Y2 (ja) | 半導体装置 | |
| JPH08306744A (ja) | 電子部品 | |
| JPH0720924Y2 (ja) | 半導体装置 | |
| JPH0338837Y2 (OSRAM) | ||
| KR20010087444A (ko) | 적층형 비엘피 패키지 및 제조방법 | |
| JPS63248155A (ja) | 半導体装置 | |
| JPS5853159U (ja) | 非晶質半導体装置 | |
| JPH0521902Y2 (OSRAM) | ||
| JPH0513624A (ja) | 半導体装置 | |
| JPH11307483A (ja) | 半導体装置の製法および半導体装置 | |
| JPS6157542U (OSRAM) | ||
| JPH03196648A (ja) | 半導体装置用パッケージ | |
| JPS6228431U (OSRAM) | ||
| TW200810061A (en) | Semiconductor package and substrate thereof | |
| JPH0358451A (ja) | ピングリッドアレイ型パッケージ |