JPH0119397Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device, and more particularly to a semiconductor device having a semiconductor pellet that can be easily positioned.

Figure 1 shows an example of a resin molded semiconductor device, in which 1 is a heat sink, and a part has holes 1 for mounting.
A is drilled and the semiconductor pellet 2 is fixed to the other part with solder or the like. 3 is a set of three leads, one end of the central lead 3a is fixed to the heat sink 1 near the semiconductor pellet 2, one end of each of the other leads 3b and 3c is positioned near the semiconductor pellet 2, and the leads are connected. They are arranged in parallel on both sides of 3a. 4, 4 are thin metal wires connecting each end of the leads 3b, 3c and the electrodes on the semiconductor pellet 2; 5 is the semiconductor pellet 2;
This is a resin molded part that covers the main parts including.

Here, an example of a semiconductor pellet 2, for example a semiconductor pellet 2 of a thyristor, is shown in FIG. 2.
is a cathode electrode, and 2b is a gate electrode. Then, an anode electrode is formed on the back surface.

A plurality of semiconductor pellets 2 are formed on one wafer at once, and then divided into pellet units for manufacture. Generally, an undivided wafer is pasted onto a sheet, divided into individual pellets by dicing or scribing, and the sheet is stretched to form gaps between the individual pellets to facilitate removal. The semiconductor pellets 2 separated into individual semiconductor pellets 2 are peeled off from the sheet by vacuum suction means and temporarily stored in an alignment tray, or after being peeled off from the sheet, the pellets are positioned and immediately supplied onto a heat sink. are doing.

By the way, since the position of the electrode of the pellet peeled from the sheet is constant, the direction of the pellet in the alignment tray is constant, and the direction of the pellet on the heat sink is also constant.

However, when the pellets are peeled off from the sheet, the sheet bends, peeling off adjacent pellets, and when the pellets rotate, the orientation of the electrodes may change. Therefore, there was a problem that the semiconductor pellet 2 and the lead 3b or 3c could not be connected.

Further, even when all the pellets are once peeled from the sheet and stored, the electrodes of all the pellets must be aligned in the same direction before being supplied onto the heat sink 1, which is a complicated operation.

This invention was proposed in view of the above problems.
Provided is a semiconductor device having a semiconductor pellet that can be positioned without considering the direction of electrodes.

The present invention will be explained below with reference to FIGS. 3 and 4.

Figure 3 shows the present invention as a resin molded semiconductor device.
For example, it is applied to a resin molded thyristor, and in the figure, 6 has a pellet placement part 6a on which a semiconductor pellet 7 is placed, a substrate (heat sink) with holes 6b for mounting, and 8 indicates three pieces. With a set of leads,
They are arranged in parallel, and one end of the central lead 8a is connected to the substrate 6.
electrically connected to the vicinity of the pellet placing section 6a, and one end of the other leads 8b and 8c to the pellet placing section 6a.
It is located near the semiconductor pellet 7 which is placed and fixed on the substrate. Reference numerals 9 and 9 indicate thin metal wires connecting the electrodes of the semiconductor pellet 7 and leads 8b and 8c, and 10 indicates a resin molded portion covering the main portion including the semiconductor pellet 7.

In this semiconductor device, the semiconductor pellet 7 forms an electrode as shown in FIG.

That is, a cathode electrode 7a is formed at the center of the pellet, and a plurality of gate electrodes 7b (four at 90 degree positions in the illustrated example) are formed at equal distances from the intersection of the diagonals of the pellet 7 (the center of the pellet) and at equal angular positions.
is formed.

In the illustrated example, gate electrodes 7b are formed at each corner of the pellets 7, so when the pellets affixed to the sheet in an unseparated state are peeled off from the sheet, adjacent pellets are peeled off at the same time, and the pellets are rotated. Even if the semiconductor pellets 7 are taken out in this state, the position of the electrodes will be constant if the corner portions of the pellets are used as a reference, and the direction of the semiconductor pellets 7 within the alignment tray or on the substrate 6 can be made constant.

Further, manufacturing is facilitated because all pellets can be supplied onto the substrate 6 by simply peeling off and storing all the pellets from the sheet, arranging them using a parts feeder, etc., and positioning the pellets based on the corners of the pellets.

The present invention is not limited to the above embodiments, and can be applied not only to resin-molded semiconductor devices, but also to can-sealed and glass-molded semiconductor devices, and is applicable not only to thyristors but also to transistors. can also be applied.

[Brief explanation of the drawing]

FIG. 1 is a partially transparent plan view showing an example of a conventional semiconductor device, FIG. 2 is a plan view showing an example of a conventional semiconductor pellet, and FIG. 3 is a partially transparent plan view showing an example of a semiconductor device according to the present invention. FIG. 4 is a plan view showing an example of a semiconductor pellet used in the semiconductor device of the present invention. 6...Substrate, 7...Semiconductor pellet, 7b...
Electrode, 8, 8c...external lead, 9...metal thin wire.

Claims (1)

[Scope of utility model registration request] In the case where the electrode of the semiconductor pellet fixed on the substrate and the external lead are connected with a thin metal wire,
A semiconductor device characterized in that a plurality of electrodes of the semiconductor pellet are provided at equal distances from the center of the pellet and at equal angular positions.