JPH0119256B2 - - Google Patents

Info

Publication number
JPH0119256B2
JPH0119256B2 JP56155466A JP15546681A JPH0119256B2 JP H0119256 B2 JPH0119256 B2 JP H0119256B2 JP 56155466 A JP56155466 A JP 56155466A JP 15546681 A JP15546681 A JP 15546681A JP H0119256 B2 JPH0119256 B2 JP H0119256B2
Authority
JP
Japan
Prior art keywords
layer
stencil layer
stencil
substrate
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56155466A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5856423A (ja
Inventor
Mineo Ueki
Yoshiaki Mimura
Fumihiko Yanagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP56155466A priority Critical patent/JPS5856423A/ja
Publication of JPS5856423A publication Critical patent/JPS5856423A/ja
Publication of JPH0119256B2 publication Critical patent/JPH0119256B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P50/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP56155466A 1981-09-30 1981-09-30 パタ−ン形成法 Granted JPS5856423A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56155466A JPS5856423A (ja) 1981-09-30 1981-09-30 パタ−ン形成法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56155466A JPS5856423A (ja) 1981-09-30 1981-09-30 パタ−ン形成法

Publications (2)

Publication Number Publication Date
JPS5856423A JPS5856423A (ja) 1983-04-04
JPH0119256B2 true JPH0119256B2 (enExample) 1989-04-11

Family

ID=15606662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56155466A Granted JPS5856423A (ja) 1981-09-30 1981-09-30 パタ−ン形成法

Country Status (1)

Country Link
JP (1) JPS5856423A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2690975B2 (ja) * 1988-11-11 1997-12-17 株式会社日立製作所 フォトレジストの除去方法および装置
US6634235B2 (en) 2000-11-30 2003-10-21 Alps Electric Co., Ltd. Load sensor with strain-sensing elements
JP2017098304A (ja) * 2015-11-18 2017-06-01 京セラ株式会社 圧電デバイス、センサ装置および発電装置

Also Published As

Publication number Publication date
JPS5856423A (ja) 1983-04-04

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