JPS5856423A - パタ−ン形成法 - Google Patents

パタ−ン形成法

Info

Publication number
JPS5856423A
JPS5856423A JP56155466A JP15546681A JPS5856423A JP S5856423 A JPS5856423 A JP S5856423A JP 56155466 A JP56155466 A JP 56155466A JP 15546681 A JP15546681 A JP 15546681A JP S5856423 A JPS5856423 A JP S5856423A
Authority
JP
Japan
Prior art keywords
layer
stencil layer
stencil
substrate
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56155466A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0119256B2 (enExample
Inventor
Mineo Ueki
植木 峰雄
Yoshiaki Mimura
三村 義昭
Fumihiko Yanagawa
柳川 文彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP56155466A priority Critical patent/JPS5856423A/ja
Publication of JPS5856423A publication Critical patent/JPS5856423A/ja
Publication of JPH0119256B2 publication Critical patent/JPH0119256B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P50/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143Masks therefor

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP56155466A 1981-09-30 1981-09-30 パタ−ン形成法 Granted JPS5856423A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56155466A JPS5856423A (ja) 1981-09-30 1981-09-30 パタ−ン形成法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56155466A JPS5856423A (ja) 1981-09-30 1981-09-30 パタ−ン形成法

Publications (2)

Publication Number Publication Date
JPS5856423A true JPS5856423A (ja) 1983-04-04
JPH0119256B2 JPH0119256B2 (enExample) 1989-04-11

Family

ID=15606662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56155466A Granted JPS5856423A (ja) 1981-09-30 1981-09-30 パタ−ン形成法

Country Status (1)

Country Link
JP (1) JPS5856423A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02130553A (ja) * 1988-11-11 1990-05-18 Hitachi Ltd フォトレジストの除去方法および装置
US6634235B2 (en) 2000-11-30 2003-10-21 Alps Electric Co., Ltd. Load sensor with strain-sensing elements
JP2017098304A (ja) * 2015-11-18 2017-06-01 京セラ株式会社 圧電デバイス、センサ装置および発電装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02130553A (ja) * 1988-11-11 1990-05-18 Hitachi Ltd フォトレジストの除去方法および装置
US6634235B2 (en) 2000-11-30 2003-10-21 Alps Electric Co., Ltd. Load sensor with strain-sensing elements
JP2017098304A (ja) * 2015-11-18 2017-06-01 京セラ株式会社 圧電デバイス、センサ装置および発電装置

Also Published As

Publication number Publication date
JPH0119256B2 (enExample) 1989-04-11

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