JPH01171038U - - Google Patents
Info
- Publication number
- JPH01171038U JPH01171038U JP6853388U JP6853388U JPH01171038U JP H01171038 U JPH01171038 U JP H01171038U JP 6853388 U JP6853388 U JP 6853388U JP 6853388 U JP6853388 U JP 6853388U JP H01171038 U JPH01171038 U JP H01171038U
- Authority
- JP
- Japan
- Prior art keywords
- resin case
- resin
- insulating substrate
- bonded
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ〜ｃはこの考案の一実施例による樹脂
ケースの平面図、正面断面図及び側断面図、第２
図ａ，ｂはゲルのはい上がり及び、収縮応力によ
るエポキシ樹脂と樹脂ケースとの密着不良を概念
的に示した拡大断面図、第３図ａ，ｂは従来の半
導体装置の斜視図及び縦断面図である。
図中、１は金属ベース板、２は樹脂ケース、３
〜７は電極端子、８はエポキシ樹脂、９はシリコ
ン系ゲル、１０は絶縁基板、１１は内部電極端子
、１２は半導体チツプ、１３はアルミワイヤー、
ａはリブ、ｂ，ｅ，ｆはリブ内に設けられた溝、
ｃ，ｄはケース開口部を分割するリブを示す。尚
、図中、同一符号は同一、または相当部分を示す
。
Figures 1a to 1c are a plan view, a front sectional view, and a side sectional view of a resin case according to an embodiment of this invention;
Figures a and b are enlarged cross-sectional views conceptually showing gel creeping and poor adhesion between the epoxy resin and the resin case due to shrinkage stress. Figures a and b are perspective views and longitudinal cross-sections of conventional semiconductor devices. It is a diagram. In the figure, 1 is a metal base plate, 2 is a resin case, 3
7 is an electrode terminal, 8 is an epoxy resin, 9 is a silicon gel, 10 is an insulating substrate, 11 is an internal electrode terminal, 12 is a semiconductor chip, 13 is an aluminum wire,
a is a rib, b, e, f are grooves provided in the rib,
c and d indicate ribs that divide the case opening. In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (1)
基板上に複数の電極端子を接合し、この電極端子
の一部に半導体チツプを搭載し、全体を樹脂ケー
スでおおい、緩衝材としてゲル封止をしその上か
らエポキシ系の樹脂で封止を行ない機械的強度を
樹脂でになうようにした半導体装置において、前
記樹脂ケースの内側に溝を設け、さらに樹脂ケー
スの開口部を分割するリブを設けたことを特徴と
する半導体装置。 An insulating substrate is bonded to a metal base plate, multiple electrode terminals are bonded to this insulating substrate, a semiconductor chip is mounted on a portion of the electrode terminals, the whole is covered with a resin case, and gel-sealed as a cushioning material. In a semiconductor device in which the resin case is sealed with an epoxy resin from above so that the mechanical strength is provided by the resin, a groove is provided inside the resin case, and a rib is further divided into an opening of the resin case. A semiconductor device characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6853388U JPH01171038U (en) | 1988-05-23 | 1988-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6853388U JPH01171038U (en) | 1988-05-23 | 1988-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171038U true JPH01171038U (en) | 1989-12-04 |
Family
ID=31293845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6853388U Pending JPH01171038U (en) | 1988-05-23 | 1988-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171038U (en) |
-
1988
- 1988-05-23 JP JP6853388U patent/JPH01171038U/ja active Pending
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