JPH01168444A - Silicon steel plate base laminated plate - Google Patents
Silicon steel plate base laminated plateInfo
- Publication number
- JPH01168444A JPH01168444A JP5962687A JP5962687A JPH01168444A JP H01168444 A JPH01168444 A JP H01168444A JP 5962687 A JP5962687 A JP 5962687A JP 5962687 A JP5962687 A JP 5962687A JP H01168444 A JPH01168444 A JP H01168444A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- silicon steel
- steel plate
- insulating layer
- coupling agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000976 Electrical steel Inorganic materials 0.000 title claims abstract description 28
- 239000007822 coupling agent Substances 0.000 claims abstract description 15
- 239000011888 foil Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 238000004080 punching Methods 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- 229920001721 polyimide Polymers 0.000 abstract description 2
- 239000009719 polyimide resin Substances 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- -1 aromatic hydroxy compound Chemical class 0.000 abstract 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- GIOZLVMCHDGNNZ-UHFFFAOYSA-N magnesium;oxido-(oxido(dioxo)chromio)oxy-dioxochromium Chemical compound [Mg+2].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O GIOZLVMCHDGNNZ-UHFFFAOYSA-N 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
［技術分野］
本発明は絶縁層の密着性及び打ち抜き加工性に優れる珪
素鋼板ベース積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a silicon steel plate-based laminate having excellent adhesion of an insulating layer and punching workability.
［背景技術］
近年、電子機器の軽量、薄型、高密度化が進み、これに
使用されるトランジスタや集積回路（ＩＣ）あるいは抵
抗やコンデンサ等の電子部品が小型化、高密度化及び高
出力化されて外でいる。これに伴い、これら電子部品の
単位面積あたりの発熱量は着しく高まっており、これら
電子部品を実装するプリント配線板にも優れた耐熱性が
要求されている。このプリント配線板の耐熱性を向上さ
せる手段としてプリント配線板の片面あるいは内部に放
熱性の優れたアルミニウム、銅、鉄等の金属板が使用さ
れている。特に、小型・電子化モータの回転数や位置検
出用のプリント配線板については更にその電磁特性を良
くするために珪素鋼板が使用されている。この珪素鋼板
は電磁特性に優れている反面、耐食性に劣っており、特
に夏季や多湿時には発錆しやす（、この防錆と過電流防
止のために珪素鋼板の表面にリン酸マグネシウム等の防
錆絶縁皮膜が形成されている。この珪素鋼板をプリント
配線板用に積層板に使用する際には、絶縁層の接着性を
高めるために防錆絶縁皮膜をサンドペーパーやサンドブ
ラストなどといった手段で＠離し、その粗化面に絶縁層
が設けられ、この絶縁層に金属箔が積層されているが、
依然として絶縁層の珪素鋼板への密着性が悪く、打ち抜
き加工性に劣ったものであった０例えば、ＰＣＴ（１２
１℃、２４Ｈｒ）で絶縁層が剥離してしまい、又、打ち
抜き加工した場合には端面で絶縁層が０．５１程度剥離
してしまっていた。[Background technology] In recent years, electronic devices have become lighter, thinner, and more dense, and electronic components such as transistors, integrated circuits (ICs), resistors, and capacitors used in these devices have become smaller, denser, and have higher output. being outside. Along with this, the amount of heat generated per unit area of these electronic components is steadily increasing, and printed wiring boards on which these electronic components are mounted are also required to have excellent heat resistance. As a means of improving the heat resistance of this printed wiring board, a metal plate made of aluminum, copper, iron, or the like with excellent heat dissipation properties is used on one side or inside the printed wiring board. In particular, silicon steel plates are used for printed wiring boards for detecting the rotational speed and position of small, electronic motors in order to further improve their electromagnetic characteristics. Although this silicon steel sheet has excellent electromagnetic properties, it has poor corrosion resistance and is prone to rust, especially in summer and high humidity. A rust insulating film is formed.When using this silicon steel plate in a laminated board for printed wiring boards, the rust-preventing insulating film is coated with sandpaper or sandblasting to improve the adhesion of the insulating layer. An insulating layer is provided on the roughened surface, and a metal foil is laminated on this insulating layer.
For example, PCT (12
The insulating layer peeled off at 1° C. for 24 hours, and when punched, the insulating layer peeled off by about 0.51 at the end face.
［発明の目的１
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、電磁特性に優れた珪素鋼板を採用し
て耐熱性を高めた珪素鋼板ベース積層板において、絶縁
層のｆｆｉ着性を高め、打ち抜き加工性を向上させるこ
とにある。[Objective of the Invention 1 The present invention has been made in view of the above circumstances, and its purpose is to provide a silicon steel plate-based laminate with improved heat resistance by employing a silicon steel plate with excellent electromagnetic properties, The objective is to improve the ffi adhesion of the insulating layer and improve the punching workability.
［発明の開示１
本発明の珪素鋼板ベース積層板は、珪素鋼板１の少なく
とも片面にカップリング剤１！２を介して絶縁層３を設
けると共に絶縁層３に金属箔４を積層して成るものであ
り、この構成により上記目的が達成されたものである。[Disclosure 1 of the Invention The silicon steel plate-based laminate of the present invention is formed by providing an insulating layer 3 on at least one side of a silicon steel plate 1 via a coupling agent 1!2, and laminating a metal foil 4 on the insulating layer 3. With this configuration, the above object is achieved.
即ち、カップリング剤層２により絶縁層３と珪素鋼板１
の密着性が向上するものである。That is, the coupling agent layer 2 connects the insulating layer 3 and the silicon steel plate 1.
The adhesion is improved.
以下、本発明を添付の図面に示す実施例に基づいて説明
する６本発明で使用する珪素鋼板１は、表面にリン酸マ
グネシウムや重クロム酸マグネシウムなど無機質や一部
にアクリル、スチレン、酢酸ビニル等の有機物を添加し
た防錆絶縁皮膜５を有する市販の珪素鋼板１の片面の防
錆絶縁皮膜５をサンドペーパーやサンドブラストなどと
いった手段で剥離したものであるにの珪素鋼板１の防錆
絶縁皮ｇＩ５を除去した面にはカップリング剤層２が形
成されている。カップリング剤としては芳香族アミン、
７エ／−ル、ナフトール類などの芳香族オキシ化合物、
活性メチレン化合物など絶縁層３に合わせて通常のもの
が使用される。このカップリング剤層２を介して絶縁層
３が積／Ｉ？！−れている。絶縁層３はエポキシ樹脂、
ポリイミド樹脂などの耐熱性に優れた樹脂が好ましい、
又、絶縁層３として樹脂含浸基材を用いてもよい、この
絶縁層３に金属箔４が積層されている。金属箔４としで
は銅箔、アルミニウム箔、ニッケル箔又はこれらの合金
等、いずれをも採用できる。The present invention will be explained below based on the embodiments shown in the attached drawings.6 The silicon steel plate 1 used in the present invention has a surface containing inorganic materials such as magnesium phosphate and magnesium dichromate, and a portion containing acrylic, styrene, and vinyl acetate. The anti-rust insulating coating of the silicon steel plate 1 is obtained by removing the anti-rust insulating coating 5 on one side of a commercially available silicon steel plate 1 having the anti-rust insulating coating 5 to which an organic substance such as A coupling agent layer 2 is formed on the surface from which gI5 has been removed. As a coupling agent, aromatic amine,
Aromatic oxy compounds such as 7 ethers, naphthols,
Common materials such as active methylene compounds are used for the insulating layer 3. An insulating layer 3 is formed through this coupling agent layer 2. ! -It is. Insulating layer 3 is made of epoxy resin,
Resins with excellent heat resistance such as polyimide resins are preferred.
Further, a resin-impregnated base material may be used as the insulating layer 3, and a metal foil 4 is laminated on this insulating layer 3. As the metal foil 4, copper foil, aluminum foil, nickel foil, or an alloy thereof can be used.
この珪素鋼板ベース積層板Ａは、次のようにして製造さ
れる。珪素鋼板１の片面にカップリング剤を塗布してカ
ップリング剤／１２を形成し、金属箔４の片面に例えば
エポキシ樹脂を塗布して形成した絶縁層３付きの金属Ｍ
４を載置し、このものを−組として複数組み熱盤閤に配
置し、例えば、３０ｋｇ／ａｍ２．１６０℃、２Ｈｒの
条件で加熱加圧して積層一体化させて製造される。This silicon steel plate base laminate A is manufactured as follows. A metal M with an insulating layer 3 formed by applying a coupling agent to one side of a silicon steel plate 1 to form a coupling agent/12 and applying, for example, an epoxy resin to one side of a metal foil 4.
4 is mounted, and a plurality of these sets are arranged on a hot platen, and are laminated and integrated by heating and pressing under conditions of, for example, 30 kg/am2, 160° C., and 2 hours.
この珪素鋼板ベース積層板Ａは、例えば、ＰＣＴ（１２
１℃、２４１１ｒ）にて絶縁層３が剥離しなく、又、打
ち抜き加工した場合には端面で絶縁層３剥離は０゜２ｍ
ｍ以下であった。This silicon steel plate base laminate A is made of, for example, PCT (12
The insulating layer 3 did not peel off at 1°C and 2411r), and when punched, the insulating layer 3 did not peel off at the end face by 0°2m.
m or less.
［発明の効果］
本発明にあっては、珪素鋼板の少なくとも片面にカップ
リング剤層を介して絶縁層を設けると共に絶縁層に金属
箔を積層しているので、珪素鋼板により電磁特性に優れ
、しかもカップリング剤層により絶縁層と珪素鋼板の密
着性が良好となり、打ち抜き性が向上するものである。[Effects of the Invention] In the present invention, an insulating layer is provided on at least one side of the silicon steel plate via a coupling agent layer, and a metal foil is laminated on the insulating layer, so the silicon steel plate has excellent electromagnetic properties. Furthermore, the coupling agent layer improves the adhesion between the insulating layer and the silicon steel plate, improving punching properties.
第１図は本発明の一実施例を示す概略断面図であって、
Ａは珪素鋼板ベース積層板、１は珪素鋼板、２はカップ
リング剤層、３は絶縁層、４は金属箔である。
代理人 弁理士 石 １）艮 七
４・・・金属箔
第１図FIG. 1 is a schematic sectional view showing an embodiment of the present invention,
A is a silicon steel plate base laminate, 1 is a silicon steel plate, 2 is a coupling agent layer, 3 is an insulating layer, and 4 is a metal foil. Agent Patent Attorney Ishi 1) Ai 74...Metal foil Figure 1
Claims (1)
介して絶縁層を設けると共に絶縁層に金属箔を積層して
成る珪素鋼板ベース積層板。(1) A silicon steel plate-based laminate comprising an insulating layer provided on at least one side of a silicon steel plate via a coupling agent layer, and a metal foil laminated on the insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5962687A JPH01168444A (en) | 1987-03-14 | 1987-03-14 | Silicon steel plate base laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5962687A JPH01168444A (en) | 1987-03-14 | 1987-03-14 | Silicon steel plate base laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01168444A true JPH01168444A (en) | 1989-07-03 |
Family
ID=13118632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5962687A Pending JPH01168444A (en) | 1987-03-14 | 1987-03-14 | Silicon steel plate base laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01168444A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005305842A (en) * | 2004-04-22 | 2005-11-04 | Sharp Corp | Composite steel sheet and method for manufacturing the same |
| KR100594299B1 (en) * | 2004-10-29 | 2006-06-30 | 삼성전자주식회사 | Flexible printed circuit, and hard disk drive comprising the same |
-
1987
- 1987-03-14 JP JP5962687A patent/JPH01168444A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005305842A (en) * | 2004-04-22 | 2005-11-04 | Sharp Corp | Composite steel sheet and method for manufacturing the same |
| KR100594299B1 (en) * | 2004-10-29 | 2006-06-30 | 삼성전자주식회사 | Flexible printed circuit, and hard disk drive comprising the same |
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