JPH10326967A - Manufacture of multilayered printed wiring board - Google Patents
Manufacture of multilayered printed wiring boardInfo
- Publication number
- JPH10326967A JPH10326967A JP9135463A JP13546397A JPH10326967A JP H10326967 A JPH10326967 A JP H10326967A JP 9135463 A JP9135463 A JP 9135463A JP 13546397 A JP13546397 A JP 13546397A JP H10326967 A JPH10326967 A JP H10326967A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- layer
- plate
- hole
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、多層のプリント配
線板の製造法に関する。この方法で製造したプリント配
線板は、ＩＣカード等の薄型の電子機器に組み込んで使
用するのに適したものである。The present invention relates to a method for manufacturing a multilayer printed wiring board. The printed wiring board manufactured by this method is suitable for being incorporated into a thin electronic device such as an IC card.
【０００２】[0002]
【従来の技術】ＩＣカード等の非常に薄型の電子機器に
用いる片面プリント配線板は、図３に示すように、絶縁
層１の片面に回路２を形成し、絶縁層１のみを貫通する
穴を設けたものである。この穴は、ＩＣを収容して固定
するＩＣ収容穴３と、ＩＣと回路２をワイヤボンディン
グにより接続する接続穴４とがある。いずれの穴もその
底面は、回路２の裏面側が露出して形成されたものであ
る。従来、このようなプリント配線板は、ポリイミドフ
ィルムを絶縁層とし、長尺の当該ポリイミドフィルム上
に所定の回路を一列に配列したＴＡＢテープとして巻物
の状態で供給されている。ＴＡＢテープの両側部には供
給装置による送り出し用のスプロケット穴が配列されて
おり、順次送り出されるＴＡＢテープを所定長さごとに
裁断して個々のプリント配線板とする。2. Description of the Related Art As shown in FIG. 3, a single-sided printed wiring board used for an extremely thin electronic device such as an IC card has a circuit 2 formed on one side of an insulating layer 1 and a hole penetrating only the insulating layer 1. Is provided. The holes include an IC housing hole 3 for housing and fixing the IC, and a connection hole 4 for connecting the IC and the circuit 2 by wire bonding. The bottom surface of each hole is formed by exposing the back side of the circuit 2. Conventionally, such a printed wiring board is supplied in the form of a roll as a TAB tape having a polyimide film as an insulating layer and predetermined circuits arranged in a row on the long polyimide film. Sprocket holes for feeding by the supply device are arranged on both sides of the TAB tape, and the sequentially fed TAB tape is cut into predetermined lengths to form individual printed wiring boards.
【０００３】上記ＴＡＢテープの製造法として、例えば
次の（１）や（２）の技術が実用化されている。 （１）長尺の所定幅のポリイミドフィルム上に、キャス
ト法、スパッタ法、めっき法、ＴＰＩ法等により銅の薄
層を形成した銅張り積層板を準備する。次に、銅の薄層
をエッチングして、ポリイミドフィルム上に所定の回路
を一列に配列して形成する。そして、ポリイミドフィル
ムの所定箇所を薬液により溶解除去して、ＩＣ収容穴
３、接続穴４、スプロケット穴を形成する。 （２）長尺の所定幅のポリイミドフィルムの所定箇所
に、金型による打抜き加工で、ＩＣ収容穴３、接続穴
４、スプロケット穴を形成する。次に、前記穴あけ加工
をしたポリイミドフィルムの片面に熱硬化型接着剤を塗
布してその面に銅箔を重ね、連続的な加熱加圧成形によ
り両者を一体化した銅張り積層板を準備する。そして、
銅箔をエッチングして、ポリイミドフィルム上に所定の
回路を一列に配列して形成する。ここで、穴あけ加工を
した後にポリイミドフィルムに熱硬化型接着剤を塗布す
るのは、塗布した熱硬化型接着剤に粘着性が残っている
からである。穴あけ加工より前に熱硬化型接着剤を塗布
して粘着性が残っているポリイミドフィルムは、実質上
穴あけに供することができない。As a method for producing the above TAB tape, for example, the following techniques (1) and (2) have been put to practical use. (1) A copper-clad laminate having a thin copper layer formed on a long polyimide film having a predetermined width by a casting method, a sputtering method, a plating method, a TPI method or the like is prepared. Next, a thin layer of copper is etched to form predetermined circuits in a line on the polyimide film. Then, a predetermined portion of the polyimide film is dissolved and removed with a chemical solution to form an IC housing hole 3, a connection hole 4, and a sprocket hole. (2) The IC housing hole 3, the connection hole 4, and the sprocket hole are formed at predetermined positions of a long polyimide film having a predetermined width by punching using a die. Next, a thermosetting adhesive is applied to one surface of the perforated polyimide film, a copper foil is laminated on the surface, and a copper-clad laminate is prepared by integrating the two by continuous heat and pressure molding. . And
The copper foil is etched to form predetermined circuits arranged in a line on the polyimide film. Here, the reason why the thermosetting adhesive is applied to the polyimide film after the perforation processing is performed is that the applied thermosetting adhesive has tackiness remaining. A polyimide film which remains to be tacky by applying a thermosetting adhesive before the drilling process cannot be substantially subjected to drilling.
【０００４】また、ノートブックパソコンや携帯電話等
の電子機器には、絶縁層にＩＣ収容穴を設けた両面プリ
ント配線板や多層プリント配線板が使用される。両面プ
リント配線板は、絶縁層の両面に回路を形成したもので
あり、多層プリント配線板は、表面及び内層に回路を形
成したものである。これらの電子機器では、一般に大型
のＩＣがプリント配線板に実装されるため、プリント配
線板には機械的な強度が必要とされ、その絶縁層には、
ポリイミド等のフィルム基材ではなく、ガラス繊維の織
布や不織布基材にエポキシ樹脂やポリイミド等を含浸し
たＦＲＰ材が一般に使用される。これらプリント配線板
の絶縁層にＩＣ収容穴を設けるために、例えば次の
（３）や（４）の技術が実用化されている。 （３）プリント配線板の絶縁層をルーターにより所定の
深さだけ削ってＩＣ収容穴を形成する方法。 （４）事前に打抜き加工やルーター加工によりＩＣ収容
穴を形成した絶縁層とプリント配線板を、前記ＩＣ収容
穴と同形状に穴あけ加工した樹脂流動性の非常に低いプ
リプレグ（一般にノーフロープリプレグと呼ばれる）を
介して加熱加圧により一体化する方法。[0004] Further, a double-sided printed wiring board or a multilayer printed wiring board having an IC accommodation hole in an insulating layer is used for an electronic device such as a notebook personal computer or a mobile phone. The double-sided printed wiring board has circuits formed on both sides of an insulating layer, and the multilayer printed wiring board has circuits formed on the surface and inner layers. In these electronic devices, a large-sized IC is generally mounted on a printed wiring board, so that the printed wiring board needs to have mechanical strength.
An FRP material obtained by impregnating a glass fiber woven or nonwoven fabric substrate with an epoxy resin, polyimide, or the like is generally used instead of a film substrate such as polyimide. For example, the following techniques (3) and (4) have been put to practical use in order to provide IC accommodation holes in the insulating layer of these printed wiring boards. (3) A method in which an insulating layer of a printed wiring board is cut to a predetermined depth by a router to form an IC receiving hole. (4) A prepreg having a very low resin flowability (generally, a no-flow prepreg) in which an insulating layer and a printed wiring board in which an IC housing hole is formed by punching or router processing in advance is formed in the same shape as the IC housing hole. (Referred to as “integration”).
【０００５】[0005]
【発明が解決しようとする課題】上記（１）（２）のよ
うに、絶縁層の片面に回路を有し、絶縁層に、ＩＣを収
容して固定するＩＣ収容穴と、ＩＣと回路をワイヤボン
ディングにより接続する接続穴を設けたプリント配線板
は、回路を一列に配列した長尺のＴＡＢテープで供給さ
れる。このようなＴＡＢテープは、回路を一列に配列し
ていることに起因して、回路形成工程や穴あけ工程の作
業効率が低い。１枚のワーク（絶縁層）上に縦方向・横
方向とも回路を複数個配列して形成するプリント配線板
の製造法は、作業効率のよい方法であるが、このような
製造法に用いる汎用の製造設備は、前記ＴＡＢテープの
製造には用いることができない。また、上記（２）の技
術では、銅箔の一体化時に絶縁層の穴底面（銅箔の裏
面）に熱硬化型接着剤がしみ出ることがあり、好ましく
ない。As described in (1) and (2) above, there is a circuit on one side of the insulating layer, and the insulating layer has an IC receiving hole for receiving and fixing the IC, and an IC and a circuit. A printed wiring board provided with connection holes connected by wire bonding is supplied by a long TAB tape in which circuits are arranged in a line. Such a TAB tape has a low work efficiency in a circuit forming step and a drilling step due to the arrangement of circuits in a line. A method of manufacturing a printed wiring board in which a plurality of circuits are arranged on one work (insulating layer) both vertically and horizontally is a method with high work efficiency. Cannot be used for the production of the TAB tape. Further, the technique (2) is not preferable because the thermosetting adhesive may exude to the bottom surface of the hole of the insulating layer (the back surface of the copper foil) when the copper foil is integrated.
【０００６】また、上記（３）の技術では、絶縁層を反
対側の回路面まで厚さ方向に非常に精度良く切削する必
要がある。切削しすぎて必要な回路がなくならないよ
う、回路を構成する金属箔として厚さの厚いもの（例え
ば７０μｍ厚みの銅箔）を使用しなければならない等の
制限もある。そして、切削後、露出した回路面（絶縁層
と接着していた面）に残留している絶縁層形成樹脂を薬
品で溶かし除去した上でないとメッキを行なえない。上
記（４）の技術では、ＩＣ収容穴と同形状に穴あけ加工
したノーフロープリプレグを準備しなければない。さら
に、ノーフロープリプレグを使用して一体化を行なって
もＩＣ収容穴への樹脂のしみ出しを十分に抑えることは
できない。そして、本来の絶縁層とは別にノーフロープ
リプレグを使用して一体化を行なうため、薄型化が困難
になる。In the technique (3), it is necessary to cut the insulating layer very accurately in the thickness direction up to the circuit surface on the opposite side. There is also a restriction that a thick metal foil (for example, a copper foil having a thickness of 70 μm) must be used as a metal foil constituting the circuit so that the necessary circuit is not lost due to excessive cutting. Then, after cutting, plating cannot be performed unless the insulating layer forming resin remaining on the exposed circuit surface (the surface adhered to the insulating layer) is dissolved and removed with a chemical. In the above technique (4), it is necessary to prepare a no-flow prepreg drilled in the same shape as the IC housing hole. Furthermore, even if integration is performed using a no-flow prepreg, it is not possible to sufficiently suppress the exudation of resin into the IC housing hole. Since the integration is performed using a no-flow prepreg separately from the original insulating layer, it is difficult to reduce the thickness.
【０００７】本発明が解決しようとする課題は、絶縁層
の表面と内層に回路を有しＩＣ収容等のために絶縁層に
当該絶縁層だけを貫通する穴を設けた多層プリント配線
板を、汎用のプリント配線板製造設備を使用して製造で
きるようにすることである。また、穴あけに加工精度を
必要とする切削を使用せず、また、多層化のためにプリ
プレグを使用せず絶縁層の穴底面への樹脂のしみ出しを
防止することである。The problem to be solved by the present invention is to provide a multilayer printed wiring board having a circuit on the surface and the inner layer of an insulating layer and having a hole through the insulating layer only in the insulating layer for accommodating IC or the like. The purpose is to enable production using general-purpose printed wiring board production equipment. Another object of the present invention is to prevent exudation of resin to the bottom surface of the insulating layer without using cutting that requires processing accuracy for drilling and without using a prepreg for multilayering.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するため
に本発明に係る多層プリント配線板の製造法は、基本的
には、次の（１）〜（３）の工程を経る。 （１）加熱硬化後においても再加熱により接着性を有す
る加熱硬化した熱硬化性樹脂Ａの層を、樹脂絶縁層の両
面に形成した板状体を用意する。 （２）この板状体にＩＣ収容穴となる貫通穴をあけた
後、両面の熱硬化性樹脂Ａの層に回路形成のための金属
箔を重ねて加熱加圧成形により一体化し、金属箔張り積
層板とする。そして、金属箔をエッチングして所定の回
路に加工し、貫通穴の片側を金属箔でふさいだプリント
配線板を得る。 （３）上記プリント配線板の貫通穴開放側の面に、片面
金属箔張り板（所定位置に貫通穴をあけてある）の金属
箔のない側の面を、互いの貫通穴の位置を合せて重ね、
加熱加圧成形により一体化する。尚、加熱加圧成形に先
立ち、前記片面金属箔張り板の金属箔のない側の面に
は、加熱硬化後においても再加熱により接着性を有する
加熱硬化した熱硬化性樹脂Ａの層を設けておく。上記
（２）や（３）の工程の加熱加圧成形において、熱硬化
性樹脂Ａの層は既に硬化しているので流動することはな
く、前記貫通穴の内側への樹脂のしみ出しは殆どない。
しかも、熱硬化性樹脂Ａの層は、加熱硬化後においても
再加熱により接着性が出てくるので、これと当接した相
手部材との一体化を、十分な強度をもって実現すること
ができる。上記（３）の工程の後に、表面の金属箔をエ
ッチングして回路加工し、多層プリント配線板とする。Means for Solving the Problems In order to solve the above problems, a method of manufacturing a multilayer printed wiring board according to the present invention basically includes the following steps (1) to (3). (1) A plate-like body is prepared in which a layer of a thermosetting resin A, which is adhesively cured by reheating even after heating and curing, is formed on both surfaces of a resin insulating layer. (2) After forming a through hole serving as an IC accommodation hole in this plate-like body, a metal foil for forming a circuit is laminated on the thermosetting resin A layer on both sides, and integrated by heating and pressing to form a metal foil. It will be a laminated board. Then, the metal foil is etched and processed into a predetermined circuit, and a printed wiring board is obtained in which one side of the through hole is covered with the metal foil. (3) The surface of the single-sided metal foil-clad board (having a through hole at a predetermined position) where there is no metal foil is aligned with the surface of the printed wiring board on the side where the through hole is open, and the position of the through hole. Over and over,
Integrated by heat and pressure molding. Prior to the heat and pressure molding, a layer of a heat-cured thermosetting resin A having an adhesive property by reheating even after heat-curing is provided on the surface of the one-sided metal foil-clad board without the metal foil. Keep it. In the heat and pressure molding in the steps (2) and (3), the layer of the thermosetting resin A has already hardened, so it does not flow, and almost no resin seeps into the inside of the through hole. Absent.
In addition, since the layer of the thermosetting resin A exhibits adhesiveness due to reheating even after the heat curing, integration with the mating member in contact with the layer can be realized with sufficient strength. After the above step (3), the metal foil on the surface is etched and circuit-processed to obtain a multilayer printed wiring board.
【０００９】上記の発明では、（１）の工程で、熱硬化
性樹脂Ａの層を樹脂絶縁層の両面に形成した板状体を用
意している。これに代えて、（１ａ）同様の熱硬化性樹
脂Ａの層のみからなる板状体を用意し、それ以降の工程
を進めてもよい。すなわち、この板状体にＩＣ収容穴と
なる貫通穴をあけた後、その両面に回路形成のための金
属箔を重ねて加熱加圧成形により一体化し、金属箔張り
積層板とする。そして、金属箔をエッチングして所定の
回路に加工し、貫通穴の片側を金属箔でふさいだプリン
ト配線板を得る。以下、上記（３）と同様の工程を経る
方法である。また、（１）の工程に代えて、（１ｂ）樹
脂絶縁層の片面に上記と同様の熱硬化性樹脂Ａの層を形
成し、もう一方の面には金属箔を一体化した板状体を板
状体を用意し、それ以降の工程を進めてもよい。すなわ
ち、この板状体にＩＣ収容穴となる貫通穴をあけた後、
熱硬化性樹脂Ａの層側に回路形成のための金属箔を重ね
て加熱加圧成形により一体化し、金属箔張り積層板とす
る。そして、金属箔をエッチングして所定の回路に加工
し、貫通穴の片側を金属箔でふさいだプリント配線板を
得る。以下、上記（３）と同様の工程を経る方法であ
る。In the above invention, a plate-like body in which the layer of the thermosetting resin A is formed on both sides of the resin insulating layer in the step (1) is prepared. Instead of this, a plate-like body composed only of the same thermosetting resin A layer as in (1a) may be prepared, and the subsequent steps may be performed. That is, after a through-hole serving as an IC receiving hole is formed in this plate-like body, metal foils for forming a circuit are laminated on both sides thereof and integrated by heating and pressing to obtain a metal foil-clad laminate. Then, the metal foil is etched and processed into a predetermined circuit, and a printed wiring board is obtained in which one side of the through hole is covered with the metal foil. Hereinafter, a method through the same step as the above (3) is described. Further, instead of the step (1), (1b) a plate-like body in which a layer of the same thermosetting resin A is formed on one surface of the resin insulating layer and a metal foil is integrated on the other surface May be prepared in the form of a plate, and the subsequent steps may be performed. That is, after making a through hole which becomes an IC accommodation hole in this plate-like body,
A metal foil for forming a circuit is overlaid on the layer side of the thermosetting resin A and integrated by heating and pressing to obtain a metal foil-clad laminate. Then, the metal foil is etched and processed into a predetermined circuit, and a printed wiring board is obtained in which one side of the through hole is covered with the metal foil. Hereinafter, a method through the same step as the above (3) is described.
【００１０】さらに、上記の発明では、（３）の工程に
おいて、片面に熱硬化性樹脂Ａの層を設けた片面金属箔
張り板（所定位置に貫通穴をあけてある）を多層成形に
用いている。これに代えて、（３ａ）熱硬化性樹脂Ａの
層を樹脂絶縁層の両面に形成した板状体又は熱硬化性樹
脂Ａの層のみからなる板状体と金属箔を多層成形に用い
てもよい。Further, in the above invention, in the step (3), a single-sided metal foil-clad board provided with a layer of a thermosetting resin A on one side (a through-hole is formed at a predetermined position) is used for multilayer molding. ing. Instead of this, (3a) a plate-like body in which layers of thermosetting resin A are formed on both surfaces of a resin insulating layer or a plate-like body consisting only of layers of thermosetting resin A and a metal foil are used for multilayer molding. Is also good.
【００１１】[0011]
【発明の実施の形態】本発明を実施するに当たり、上記
（１）加熱硬化後においても再加熱により接着性を有す
る加熱硬化した熱硬化性樹脂Ａの層を、樹脂絶縁層の両
面に形成した板状体を用意する工程は、具体的には、次
の（ａ）〜（ｃ）の工程の中から適宜選択することがで
きる。 （ａ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して、片面
に熱硬化性樹脂Ａの層を有する離型フィルムを準備す
る。そして、シート状基材に熱硬化性樹脂を含浸乾燥し
て得たプリプレグの両面に、前記離型フィルムの熱硬化
性樹脂Ａの層側をそれぞれ重ねて、加熱加圧成形により
一体化して、両面に熱硬化性樹脂Ａの層を有する板状体
とする工程である。 （ｂ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを、シート状基材に熱硬化性樹脂を含
浸乾燥して得たプリプレグの両面に塗布乾燥して、両面
に熱硬化性樹脂Ａの層を有するプリプレグを準備する。
そして、当該プリプレグを加熱加圧成形して両面に熱硬
化性樹脂Ａの層を有する板状体とする工程である。 （ｃ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを、シート状基材に熱硬化性樹脂を含
浸乾燥し加熱加圧して得た板状体に塗布乾燥して、両面
に熱硬化性樹脂Ａの層を有する板状体とする工程であ
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS In carrying out the present invention, a layer of thermosetting resin A, which is heat-cured and has adhesive properties by reheating even after the above-mentioned heat curing, is formed on both surfaces of a resin insulating layer. Specifically, the step of preparing the plate-shaped body can be appropriately selected from the following steps (a) to (c). (A) Even after heating and curing, a thermosetting resin A having adhesiveness is applied to a release film by reheating and dried to prepare a release film having a layer of the thermosetting resin A on one surface. Then, on both surfaces of the prepreg obtained by impregnating and drying the sheet-shaped base material with the thermosetting resin, the layer side of the thermosetting resin A of the release film is respectively overlapped, and integrated by heat and pressure molding, This is a step of forming a plate having a thermosetting resin A layer on both surfaces. (B) A thermosetting resin A having adhesiveness due to reheating even after heat curing is applied to both sides of a prepreg obtained by impregnating and drying a thermosetting resin on a sheet-like substrate, and dried on both sides. A prepreg having a layer of the curable resin A is prepared.
Then, the prepreg is heated and pressed to form a plate having a layer of thermosetting resin A on both surfaces. (C) A thermosetting resin A having adhesiveness due to reheating even after heat curing is applied to a sheet obtained by impregnating and drying a thermosetting resin in a sheet-like base material, heating and pressing, and drying. This is a step of forming a plate having a thermosetting resin A layer on both surfaces.
【００１２】上記（１）の工程を、（１ｂ）樹脂絶縁層
の片面に加熱硬化後においても再加熱により接着性を有
する加熱硬化した熱硬化性樹脂Ａの層を有し、もう一方
の面に金属箔を一体化した板状体を用意する工程に置換
えた製造法では、具体的には、（１ｂ）の工程を、次の
（ａ）〜（ｂ）の工程の中から適宜選択することができ
る。 （ａ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して、片面
に熱硬化性樹脂Ａの層を有する離型フィルムを準備す
る。そして、シート状基材に熱硬化性樹脂を含浸乾燥し
て得たプリプレグの一方の面に、前記離型フィルムの熱
硬化性樹脂Ａの層側を重ね、前記プリプレグの他方の面
には金属箔を重ねて、これらを加熱加圧成形により一体
化して板状体とする工程である。 （ｂ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを、シート状基材に熱硬化性樹脂を含
浸乾燥して得たプリプレグに塗布乾燥して、片面に熱硬
化性樹脂Ａの層を有するプリプレグを準備する。そし
て、当該プリプレグの熱硬化性樹脂Ａの層を有しない側
に金属箔を重ね、加熱加圧成形により一体化して板状体
とする工程である。In the step (1), the step of (1b) includes, on one side of the resin insulating layer, a layer of the thermosetting resin A which is heat-cured and has an adhesive property by reheating even after the heat-curing; Specifically, in the manufacturing method in which the step of preparing a plate-like body in which a metal foil is integrated is specifically selected, the step (1b) is appropriately selected from the following steps (a) and (b). be able to. (A) Even after heating and curing, a thermosetting resin A having adhesiveness is applied to a release film by reheating and dried to prepare a release film having a layer of the thermosetting resin A on one surface. Then, the layer side of the thermosetting resin A of the release film is overlapped on one surface of the prepreg obtained by impregnating and drying the sheet-shaped base material with the thermosetting resin, and the other surface of the prepreg is coated with metal. This is a step of stacking foils and integrating them by heating and pressing to form a plate-like body. (B) A thermosetting resin A having adhesiveness due to reheating even after heat curing is applied to a prepreg obtained by impregnating and drying a thermosetting resin on a sheet-like base material, and is dried by drying. A prepreg having a resin A layer is prepared. Then, this is a step of laminating a metal foil on the side of the prepreg having no layer of the thermosetting resin A and integrating it by heating and pressing to form a plate-like body.
【００１３】上記の各製造法において、（３）の工程で
は、以下の（ａ）〜（ｃ）のいずれかの方法により製造
された片面金属箔張り板を使用することができる。 （ａ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して、片面
に熱硬化性樹脂Ａの層を有する離型フィルムを準備する
する。次に、シート状基材に熱硬化性樹脂を含浸乾燥し
て得たプリプレグの一方の面に、前記離型フィルムの熱
硬化性樹脂Ａの層側を重ね、前記プリプレグの他方の面
には金属箔を重ねて、加熱加圧成形により一体化して板
状体とする。そして、離型フィルムを剥がして又は剥が
さずに、上記板状体の所定位置に貫通穴をあける方法。 （ｂ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを、シート状基材に熱硬化性樹脂を含
浸乾燥して得たプリプレグに塗布乾燥して、片面に熱硬
化性樹脂Ａの層を有するプリプレグを準備する。次に、
前記プリプレグの熱硬化性樹脂Ａの層を有しない側に金
属箔を重ね、加熱加圧成形により一体化して板状体とす
る。そして、前記板状体の所定位置に貫通穴をあける方
法。 （ｃ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して粘着性
がなくなる程度まで加熱硬化させ、片面に熱硬化性樹脂
Ａの層を有する離型フィルムを準備する。次に、前記離
型フィルムの熱硬化性樹脂Ａの層側に金属箔を重ねて加
熱加圧成形により一体化して板状体とする。そして、離
型フィルムを剥がして又は剥がさずに、前記板状体の所
定位置に貫通穴をあける方法。In each of the above manufacturing methods, in the step (3), a single-sided metal foil clad plate manufactured by any of the following methods (a) to (c) can be used. (A) Even after heating and curing, a thermosetting resin A having adhesiveness is applied to a release film by reheating and dried to prepare a release film having a layer of the thermosetting resin A on one surface. Next, on one surface of the prepreg obtained by impregnating and drying the sheet-like base material with the thermosetting resin, the layer side of the thermosetting resin A of the release film is overlapped, and the other surface of the prepreg is The metal foils are stacked and integrated by heating and pressing to form a plate. Then, a method of making a through hole at a predetermined position of the plate-like body with or without peeling the release film. (B) A thermosetting resin A having adhesiveness due to reheating even after heat curing is applied to a prepreg obtained by impregnating and drying a thermosetting resin on a sheet-like base material, and is dried by drying. A prepreg having a resin A layer is prepared. next,
A metal foil is laminated on the side of the prepreg that does not have the layer of the thermosetting resin A, and integrated by heating and pressing to form a plate. Then, a method of making a through hole at a predetermined position of the plate-like body. (C) Even after heating and curing, the thermosetting resin A having adhesiveness is applied to the release film by reheating and dried and heat-cured until the tackiness is eliminated, and the layer of the thermosetting resin A is provided on one surface. Prepare a release film. Next, a metal foil is overlaid on the layer of the thermosetting resin A of the release film and integrated by heating and pressing to form a plate-like body. Then, a through-hole is formed in a predetermined position of the plate-like body by peeling or not peeling the release film.
【００１４】上記（３）の工程を、（３ａ）プリント配
線板の貫通穴開放側の面に、板状体（所定位置に貫通穴
をあけてあり、両面に加熱硬化後においても再加熱によ
り接着性を有する加熱硬化した熱硬化性樹脂Ａの層を有
する）を、互いの貫通穴の位置を合せて重ね、さらに、
板状体の表面に金属箔を重ねて加熱加圧成形により一体
化する工程に置換えた方法では、（３ａ）の工程で使用
する板状体として、以下の（ａ）〜（ｃ）のいずれかの
方法により製造されたものを使用することができる。 （ａ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して、片面
に熱硬化性樹脂Ａの層を有する離型フィルムを準備す
る。次に、シート状基材に熱硬化性樹脂を含浸乾燥して
得たプリプレグの両面に、前記離型フィルムの熱硬化性
樹脂Ａの層側を重ね、加熱加圧成形により一体化して板
状体とする。そして、離型フィルムを剥がして又は剥が
さずに、上記板状体の所定位置に貫通穴をあける方法。 （ｂ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを、シート状基材に熱硬化性樹脂を含
浸乾燥して得たプリプレグの両面に塗布乾燥して、両面
に熱硬化性樹脂Ａの層を有するプリプレグを準備する。
次に、前記プリプレグを加熱加圧成形して両面に熱硬化
性樹脂Ａの層を有する板状体とする。そして、前記板状
体の所定位置に貫通穴をあける方法。 （ｃ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して粘着性
がなくなる程度まで加熱硬化させ、片面に熱硬化性樹脂
Ａの層を有する離型フィルムを準備する。そして、離型
フィルムを剥がして又は剥がさずに、前記板状体の所定
位置に貫通穴をあける方法。The above-mentioned step (3) is performed by (3a) forming a plate-like body (a through hole is formed at a predetermined position on the surface of the printed wiring board on the open side of the through hole, Having a layer of heat-cured thermosetting resin A having adhesive properties), aligning the positions of the through holes with each other,
In the method in which the metal foil is superposed on the surface of the plate-like body and replaced by a step of integrating by heating and pressing, the plate-like body used in the step (3a) may be any of the following (a) to (c): What was manufactured by said method can be used. (A) Even after heating and curing, a thermosetting resin A having adhesiveness is applied to a release film by reheating and dried to prepare a release film having a layer of the thermosetting resin A on one surface. Next, on both sides of the prepreg obtained by impregnating and drying the sheet-shaped base material with the thermosetting resin, the layer side of the thermosetting resin A of the release film is laminated, and integrated by heating and pressing to form a plate-like shape. Body. Then, a method of making a through hole at a predetermined position of the plate-like body with or without peeling the release film. (B) A thermosetting resin A having adhesiveness due to reheating even after heat curing is applied to both sides of a prepreg obtained by impregnating and drying a thermosetting resin on a sheet-like substrate, and dried on both sides. A prepreg having a layer of the curable resin A is prepared.
Next, the prepreg is heated and pressed to form a plate having a layer of thermosetting resin A on both surfaces. Then, a method of making a through hole at a predetermined position of the plate-like body. (C) Even after heating and curing, the thermosetting resin A having adhesiveness is applied to the release film by reheating and dried and heat-cured until the tackiness is eliminated, and the layer of the thermosetting resin A is provided on one surface. Prepare a release film. Then, a through-hole is formed in a predetermined position of the plate-like body by peeling or not peeling the release film.
【００１５】上記の発明の実施の形態の各製造法におい
て、加熱加圧成形は、通常の積層板成形プレスを使用し
て実施することができ、１ｍ×１ｍや１ｍ×１．２ｍの
寸法のもの、あるいはそれ以上の寸法のものまで実施可
能である。板状体や離型フィルムに設けた熱硬化性樹脂
Ａの層は硬化しているので粘着性がなく、これらに貫通
穴をあける作業を支障なく実施することができる。しか
し、熱硬化性樹脂Ａの層は、再加熱により接着性を有す
るので、板状体や離型フィルムの熱硬化性樹脂Ａの層側
に、金属箔やプリント配線板を加熱加圧成形により十分
な接着力で一体化することができる。このとき、熱硬化
性樹脂Ａの層側は流動しないので、貫通穴の底面（すな
わち、金属箔の裏面）や貫通穴の壁面に熱硬化性樹脂Ａ
がしみ出して付着することはない。本発明に係る方法に
よれば、長尺のテープではなく、通常のプリント配線板
のワークサイズで製造作業を進めることができ、回路を
１枚のワーク（絶縁層）上に縦方向・横方向とも複数個
配列して形成するプリント配線板の製造が、汎用の設備
を使用して可能となる。In each of the manufacturing methods according to the above-mentioned embodiments of the present invention, the heat and pressure forming can be carried out by using an ordinary laminated plate forming press, and a size of 1 m × 1 m or 1 m × 1.2 m can be obtained. , Or even larger dimensions. Since the layer of the thermosetting resin A provided on the plate-like body or the release film is cured, it has no tackiness, and the operation of forming a through-hole in these can be performed without any trouble. However, since the layer of the thermosetting resin A has adhesiveness by reheating, a metal foil or a printed wiring board is formed on the layer side of the thermosetting resin A of the plate-like body or the release film by heating and pressing. It can be integrated with a sufficient adhesive force. At this time, since the layer side of the thermosetting resin A does not flow, the thermosetting resin A is formed on the bottom surface of the through hole (that is, the back surface of the metal foil) or the wall surface of the through hole.
It does not exude and adhere. ADVANTAGE OF THE INVENTION According to the method concerning this invention, a manufacturing operation can be advanced by the work size of a normal printed wiring board rather than a long tape, and a circuit is vertically and horizontally mounted on one work (insulating layer). It is possible to manufacture printed wiring boards formed by arranging a plurality of printed wiring boards using general-purpose equipment.
【００１６】熱硬化性樹脂Ａは、例えば、ゴム変性熱硬
化性樹脂組成物であり、具体的には、エポキシ樹脂、エ
ポキシ樹脂と反応性を有するゴム成分、硬化剤を必須成
分とするものを使用することができる。ゴム成分は、エ
ポキシ変性アクリルゴムが、加熱による変色防止の観点
から好ましい。本発明に係る製造法の実施において、貫
通穴あけ加工には、プリント配線板の外形加工に用いる
ルータ加工機やＮＣパンチ加工機を利用することができ
る。高価な専用の打抜き金型を準備しなくても済むの
で、金型製作の日数を考慮しなくてもよく、また、製造
コスト面でも有利になる。The thermosetting resin A is, for example, a rubber-modified thermosetting resin composition. Specifically, an epoxy resin, a rubber component having a reactivity with the epoxy resin, and a hardening agent as an essential component are used. Can be used. The rubber component is preferably an epoxy-modified acrylic rubber from the viewpoint of preventing discoloration due to heating. In the implementation of the manufacturing method according to the present invention, a through hole drilling process can use a router machine or an NC punch machine used for processing the outer shape of a printed wiring board. Since it is not necessary to prepare an expensive dedicated punching die, it is not necessary to consider the number of days for manufacturing the die, which is advantageous in terms of manufacturing cost.
【００１７】プリプレグのためのシート状基材には、ガ
ラス繊維やアラミド繊維で構成した織布、不織布を使用
することができる。このシート状基材の厚さが板状体の
ＩＣ収容穴の深さに関係してくる。シート状基材の厚さ
やプリプレグの重ね枚数を適宜選択することにより、Ｉ
Ｃ収容穴の深さ設定を簡単に行なうことができる。プリ
ント配線板の絶縁層を熱硬化性樹脂を含浸したシート状
基材で構成する製造法では、ポリイミドフィルムを絶縁
層とするプリント配線板では不十分であった強度を確保
することができる。シート状基材に含浸する熱硬化性樹
脂は、ポリイミド、フェノール樹脂、シアネート樹脂、
シアン酸エステル樹脂、エポキシ樹脂、不飽和ポリエス
テルなどを使用することができる。回路を形成する金属
箔は、銅箔、アルミニウム箔、ニッケル箔等、導電性の
良好な金属箔を用いることができ、適宜の厚さを選択す
る。As the sheet-like base material for the prepreg, a woven or non-woven fabric made of glass fiber or aramid fiber can be used. The thickness of the sheet-like substrate is related to the depth of the IC receiving hole of the plate-like body. By appropriately selecting the thickness of the sheet-shaped substrate and the number of prepregs to be stacked,
It is possible to easily set the depth of the C accommodation hole. In a manufacturing method in which an insulating layer of a printed wiring board is formed of a sheet-like base material impregnated with a thermosetting resin, strength that was insufficient with a printed wiring board using a polyimide film as an insulating layer can be secured. The thermosetting resin impregnating the sheet-like base material is polyimide, phenol resin, cyanate resin,
Cyanate ester resins, epoxy resins, unsaturated polyesters and the like can be used. As a metal foil for forming a circuit, a metal foil having good conductivity such as a copper foil, an aluminum foil, and a nickel foil can be used, and an appropriate thickness is selected.
【００１８】プリント配線板に高い放熱性が要求される
場合には、プリプレグの替わりに絶縁処理をした金属板
を準備し、この片面に熱硬化性樹脂Ａの層を形成して用
いることができる。熱硬化性樹脂Ａの層を形成した金属
板に所定の穴あけ加工をして穴壁面の絶縁処理をしてか
ら、熱硬化性樹脂Ａの層に金属箔を加熱加圧成形により
一体化する。金属板は、銅、アルミニウム、鉄などから
なるものである。When high heat radiation is required for the printed wiring board, an insulated metal plate is prepared in place of the prepreg, and a layer of the thermosetting resin A can be formed on one side of the metal plate for use. . The metal plate on which the layer of the thermosetting resin A is formed is subjected to a predetermined drilling process to insulate the wall surface of the hole, and then a metal foil is integrated with the layer of the thermosetting resin A by heat and pressure molding. The metal plate is made of copper, aluminum, iron, or the like.
【００１９】[0019]
実施例１（請求項４に相当） （１ｂ）の工程 熱硬化性樹脂Ａとして、エポキシ樹脂（ビスフェノール
Ａ型エポキシ樹脂）１０重量部、ゴム成分（エポキシ変
性アクリルゴム）８０重量部、硬化剤（ノボラック型フ
ェノール樹脂）１０重量部、硬化促進剤（イミダゾー
ル）１重量部を配合したワニスＡを調整した。このワニ
スＡをポリプロピレンからなる離型フィルムに塗布し、
１５０℃で２分間乾燥して、片面に熱硬化性樹脂Ａの層
を有する離型フィルムを準備した。この際、乾燥後の熱
硬化性樹脂Ａの層の厚みが５０μｍとなるよう塗布量を
調整した。ガラス織布にエポキシ樹脂を含浸乾燥したＦ
Ｒ−４グレードのプリプレグ（１ｍ×１ｍ，０．１mm
厚）１枚の片面に前記離型フィルムの熱硬化性樹脂Ａの
層側を重ね、また、前記プリプレグの他面に金属箔（１
８μｍ厚の電解銅箔）を重ね、これをステンレス製の鏡
面板に挟み、圧力２０kgf／cm2、熱盤最高温度１４０℃
で１０分間加熱加圧成形した。成形した板状体は、片面
に熱硬化性樹脂Ａの層を有しており、その表面は硬化し
て粘着性はなかった。 （２ｂ）の工程 離型フィルムを剥がした上記板状体にルーター加工機で
ＩＣ収容穴となる貫通穴をあけた後、熱硬化性樹脂Ａの
層側に金属箔（１８μｍ厚の電解銅箔）を重ね、これを
ステンレス製の鏡面板に挟んで圧力８０kgf／cm2、熱盤
最高温度１８０℃で、材料温度１５０℃が３０分間継続
するよう加熱加圧成形して、貫通穴の片側を金属箔でふ
さいだ両面金属箔張り積層板を製造した。上記金属箔張
り積層板の貫通穴を耐酸性インク（ロジン変性フェノー
ル樹脂系レジストインク）で埋め、両面に回路形成用ド
ライフィルムをラミネートし、所定の回路形状に露光、
エッチングし、貫通穴開放側の面に回路（最終的には内
層回路となるので、以下、内層回路という）を形成した
プリント配線板を得た。内層回路表面には、粗化のため
の黒化処理をした。尚、前記耐酸性インクは、回路形成
後溶剤で溶解除去した。図１（ａ）は、このようにして
製造したプリント配線板を示している。すなわち、プリ
プレグを成形した樹脂絶縁層１１の片面には、内層回路
１２が直接に一体化されている。また、樹脂絶縁層１１
の他面には、熱硬化性樹脂Ａの層１３を介して金属箔１
４が一体化されている。そして、金属箔１４は、貫通穴
１５の片側を塞いでいる。 （３）の工程 上記（１ｂ）と同様の工程により、片面に熱硬化性樹脂
Ａの層を有し、もう一方の面に金属箔を一体化した板状
体とし、離型フィルムを剥がした前記板状体にルーター
加工機でＩＣ収容穴となる貫通穴をあけて、本工程で用
いる片面金属箔張り板を用意した。図１（ｂ）は、この
ようにして製造した片面金属箔張り板を示している。す
なわち、プリプレグを成形した樹脂絶縁層２１の片面に
は、金属箔２２が直接に一体化されている。また、樹脂
絶縁層２１の他面には、熱硬化性樹脂Ａの層２３が一体
化されている。貫通穴２４は、貫通穴１５より大寸法と
している。上記（２ｂ）の工程で得たプリント配線板の
貫通穴開放側の面に、前記片面金属箔張り板の熱硬化性
樹脂Ａの層２３側の面を、互いの貫通穴１５，２４の位
置を合わせて重ね、これをステンレス製の鏡面板に挟ん
で圧力８０kgf／cm2、熱盤最高温度１８０℃で、材料温
度１５０℃が３０分間継続するよう加熱加圧成形して一
体化した。図１（ｃ）は、この一体化した状態を示して
いる。貫通穴１５，２４は、段差のあるＩＣ収容穴３１
となっている。Example 1 (corresponding to claim 4) Step of (1b) As the thermosetting resin A, 10 parts by weight of an epoxy resin (bisphenol A type epoxy resin), 80 parts by weight of a rubber component (epoxy-modified acrylic rubber), and a curing agent ( A varnish A containing 10 parts by weight of a novolak type phenol resin) and 1 part by weight of a curing accelerator (imidazole) was prepared. This varnish A is applied to a release film made of polypropylene,
After drying at 150 ° C. for 2 minutes, a release film having a layer of thermosetting resin A on one side was prepared. At this time, the coating amount was adjusted so that the thickness of the layer of the thermosetting resin A after drying was 50 μm. F impregnated with epoxy resin in glass woven fabric and dried
R-4 grade prepreg (1m x 1m, 0.1mm
Thickness) A layer of the thermosetting resin A of the release film is overlapped on one surface of one sheet, and a metal foil (1) is attached on the other surface of the prepreg.
8μm thick electrolytic copper foil), sandwiched between stainless steel mirror plates, pressure 20kgf / cm 2 , hot platen maximum temperature 140 ° C
For 10 minutes. The molded plate had a layer of thermosetting resin A on one side, and the surface was cured and had no tackiness. Step (2b) After a release hole is formed in the plate-like body from which the release film has been peeled off by using a router machine, a metal foil (18 μm thick electrolytic copper foil) is formed on the layer side of the thermosetting resin A. ) Is sandwiched between stainless steel mirror plates, and heated and pressed at a pressure of 80 kgf / cm 2 , a hot platen maximum temperature of 180 ° C., and a material temperature of 150 ° C. for 30 minutes to form one side of the through hole. A double-sided metal foil-clad laminate covered with metal foil was produced. Fill the through-holes of the metal foil-clad laminate with an acid-resistant ink (rosin-modified phenolic resin-based resist ink), laminate a dry film for circuit formation on both sides, and expose to a predetermined circuit shape.
Etching was performed to obtain a printed wiring board having a circuit formed on the surface on the side of the through-hole opening side (the circuit is ultimately referred to as an inner layer circuit, hereinafter referred to as an inner layer circuit). The surface of the inner layer circuit was blackened for roughening. The acid-resistant ink was dissolved and removed with a solvent after forming the circuit. FIG. 1A shows a printed wiring board manufactured in this manner. That is, the inner layer circuit 12 is directly integrated on one surface of the resin insulating layer 11 in which the prepreg is formed. Also, the resin insulating layer 11
On the other side, a metal foil 1 is interposed via a layer 13 of thermosetting resin A.
4 are integrated. The metal foil 14 covers one side of the through hole 15. Step (3) By the same step as the above (1b), a plate-like body having a layer of the thermosetting resin A on one side and a metal foil integrated on the other side, and the release film was peeled off. A through-hole serving as an IC receiving hole was made in the plate-like body by a router machine to prepare a single-sided metal foil-clad board used in this step. FIG. 1B shows a single-sided metal foil-clad board manufactured in this manner. That is, the metal foil 22 is directly integrated with one surface of the resin insulating layer 21 formed by molding the prepreg. Further, a layer 23 of thermosetting resin A is integrated with the other surface of the resin insulating layer 21. The through hole 24 has a larger size than the through hole 15. The surface on the layer 23 side of the thermosetting resin A of the single-sided metal foil-clad board is placed on the surface on the open side of the through hole of the printed wiring board obtained in the above step (2b), with the positions of the through holes 15 and 24 relative to each other. The sheets were sandwiched between stainless steel mirror plates, and heated and pressed to form a unit at a pressure of 80 kgf / cm 2 , a hot platen maximum temperature of 180 ° C., and a material temperature of 150 ° C. for 30 minutes to be integrated. FIG. 1C shows this integrated state. The through holes 15 and 24 are the stepped IC receiving holes 31.
It has become.
【００２０】両表面の金属箔１４，２２を、以下のよう
な工程で回路に加工する。まず、図１（ｄ）に示すよう
に、スルーホールメッキ用穴３３をあけ、ＩＣ収容穴３
１を耐酸性インク３２で埋める。次に、図１（ｅ）に示
すように、スルーホールメッキ（銅メッキ）３４を施
す。このメッキは、スルーホールの壁面以外にも全面に
施すことになる。そして、両面に回路形成用ドライフィ
ルム３５をラミネートし（図１（ｆ））、所定の回路形
状に露光し回路を形成すべき箇所のみ前記ドライフィル
ム３５で覆う（図１（ｇ））。ドライフィルム３５で覆
われていない箇所のメッキおよび金属箔をエッチングし
て除去し、耐酸性インク３２を溶剤で溶解除去した。こ
のようにして、 ＩＣ収容穴３１を有する三層回路のプ
リント配線板を得た（図１（ｈ））。The metal foils 14 and 22 on both surfaces are processed into a circuit by the following steps. First, as shown in FIG. 1D, a through-hole plating hole 33 is formed, and an IC accommodation hole 3 is formed.
1 is filled with an acid-resistant ink 32. Next, as shown in FIG. 1E, through-hole plating (copper plating) 34 is performed. This plating is applied to the entire surface other than the wall surface of the through hole. Then, a dry film 35 for circuit formation is laminated on both sides (FIG. 1 (f)), and is exposed to a predetermined circuit shape, and only the portion where a circuit is to be formed is covered with the dry film 35 (FIG. 1 (g)). The plating and the metal foil at locations not covered by the dry film 35 were removed by etching, and the acid-resistant ink 32 was dissolved and removed with a solvent. In this way, a printed wiring board of a three-layer circuit having the IC accommodation holes 31 was obtained (FIG. 1 (h)).
【００２１】製造したプリント配線板の特性を表１に示
した。表１から明らかなように、穴底面への樹脂のしみ
出しはほとんど発生せず、良好な結果が得られた。半田
耐熱性、銅箔ピール強度もＪＩＳ規格値以上である。Table 1 shows the characteristics of the manufactured printed wiring boards. As is clear from Table 1, the resin did not substantially exude to the bottom of the hole, and good results were obtained. The solder heat resistance and the copper foil peel strength are also JIS standard values or higher.
【００２２】[0022]
【表１】 [Table 1]
【００２３】実施例２（請求項７に相当） 実施例１の（１ｂ），（２ｂ）と同様の工程を経て、プ
リント配線板を準備した。図２（ａ）は、このようにし
て製造したプリント配線板を示している。すなわち、プ
リプレグを成形した樹脂絶縁層１１の片面には、内層回
路１２が直接に一体化されている。また、樹脂絶縁層１
１の他面には、熱硬化性樹脂Ａの層１３を介して金属箔
１４が一体化されている。そして、金属箔１４は、貫通
穴１５の片側を塞いでいる。但し、本実施例では、内層
回路１２と金属箔１４に、厚さの厚い金属箔（３５μｍ
厚の電解銅箔）を用いた。 （３ａ）の工程 ワニスＡをポリプロピレンからなる離型フィルムに塗布
し、１５０℃で２分間乾燥して、片面に熱硬化性樹脂Ａ
の層を有する離型フィルムを準備した。この際、乾燥後
の熱硬化性樹脂Ａの層の厚みが５０μｍとなるよう塗布
量を調整した。ガラス織布にエポキシ樹脂を含浸乾燥し
たＦＲ−４グレードのプリプレグ（１ｍ×１ｍ，０．１
mm厚）１枚の両面に前記離型フィルムの熱硬化性樹脂Ａ
の層側を重ね、これをステンレス製の鏡面板に挟み、圧
力２０kgf／cm2、熱盤最高温度１４０℃で１０分間加熱
加圧成形した。成形した板状体は、両面に熱硬化性樹脂
Ａの層を有しており、その表面は硬化して粘着性はなか
った。離型フィルムを剥がした前記板状体にルーター加
工機でＩＣ収容穴となる貫通穴をあけて、本工程で用い
る板状体とした。図２（ｂ）は、このようにして製造し
た板状体を示している。すなわち、プリプレグを成形し
た樹脂絶縁層２１の両面には、熱硬化性樹脂Ａの層２３
が一体化されている。貫通穴２４は、貫通穴１５より大
寸法としている。図２（ａ）に示したプリント配線板の
貫通穴開放側の面に、図２（ｂ）に示した板状体を、互
いの貫通穴１５，２４の位置を合わせて重ね、板状体の
表面には厚さの薄い金属箔２２（１８μｍ厚の電解銅
箔）を重ねて、これをステンレス製の鏡面板に挟んで圧
力８０kgf／cm2、熱盤最高温度１８０℃で、材料温度１
５０℃が３０分間継続するよう加熱加圧成形して一体化
した。図２（ｃ）は、この一体化した状態を示してい
る。貫通穴１５，２４は、段差のあるＩＣ収容穴３１と
なっている。Example 2 (corresponding to claim 7) A printed wiring board was prepared through the same steps as (1b) and (2b) of Example 1. FIG. 2A shows a printed wiring board manufactured in this manner. That is, the inner layer circuit 12 is directly integrated on one surface of the resin insulating layer 11 in which the prepreg is formed. Also, the resin insulating layer 1
A metal foil 14 is integrated with the other surface of the substrate 1 via a layer 13 of a thermosetting resin A. The metal foil 14 covers one side of the through hole 15. However, in the present embodiment, the thick metal foil (35 μm
(Thick electrolytic copper foil). Step (3a) Varnish A is applied to a release film made of polypropylene, dried at 150 ° C. for 2 minutes, and a thermosetting resin A is applied to one side.
A release film having a layer of was prepared. At this time, the coating amount was adjusted so that the thickness of the layer of the thermosetting resin A after drying was 50 μm. FR-4 grade prepreg (1m x 1m, 0.1m
mm thickness) Thermosetting resin A of the release film on both sides of one sheet
Were sandwiched between stainless steel mirror plates, and heated and pressed at a pressure of 20 kgf / cm 2 and a hot platen maximum temperature of 140 ° C. for 10 minutes. The molded plate had a layer of thermosetting resin A on both surfaces, and the surface was cured and had no tackiness. A through-hole serving as an IC accommodating hole was formed in the plate-like body from which the release film was peeled off using a router machine to obtain a plate-like body used in this step. FIG. 2B shows a plate-like body manufactured in this manner. That is, a layer 23 of thermosetting resin A is provided on both sides of the resin insulating layer 21 formed by molding the prepreg.
Are integrated. The through hole 24 has a larger size than the through hole 15. The plate-like body shown in FIG. 2 (b) is overlapped on the surface of the printed wiring board shown in FIG. A thin metal foil 22 (electrolytic copper foil having a thickness of 18 μm) is layered on the surface of the stainless steel plate, sandwiched between stainless steel mirror plates, with a pressure of 80 kgf / cm 2 , a hot platen maximum temperature of 180 ° C., and a material temperature of 1
It was heated and pressed so that 50 ° C. would be continued for 30 minutes and integrated. FIG. 2C shows this integrated state. The through holes 15, 24 are stepped IC housing holes 31.
【００２４】両表面の金属箔１４，２２を、以下のよう
な工程で回路に加工する。まず、図２（ｄ）に示すよう
に、スルーホールメッキ用穴３３をあける。次に、図２
（ｅ）に示すように、スルーホールメッキ（銅メッキ）
３４を施す。このメッキは、スルーホールの壁面以外に
も全面に施すことになる。そして、両面に回路形成用ド
ライフィルム３５をラミネートし（図２（ｆ））、所定
の回路形状に露光し回路を形成すべき箇所のみ前記ドラ
イフィルム３５で覆う（図２（ｇ））。ドライフィルム
３５で覆われていない箇所のメッキおよび金属箔をエッ
チングして除去した。この際、ＩＣ収容穴３１の底面を
構成する金属箔１４および内層回路１２が著しくエッチ
ングされないよう、エッチング時間は必要最小限とす
る。また、エッチング液が、ＩＣ収容穴３１に溜まらな
いよう、金属箔２２側を下面にする。金属箔１４と内層
回路１２の厚さ（３５μｍ）を金属箔２２の厚さ（１８
μｍ）より厚くしておくことは、上記回路加工時のエッ
チングを容易にする。すなわち、金属箔２２の所定部分
がエッチングされて、金属箔１４と内層回路１２がエッ
チング液にさらされ多少エッチングされても支障がない
ので、エッチング工程の管理が容易になる。このように
して、 ＩＣ収容穴３１を有する三層回路のプリント配
線板を得た（図２（ｈ））。その特性は、表１に示した
実施例１のプリント配線板の特性と同等であった。The metal foils 14 and 22 on both surfaces are processed into a circuit by the following steps. First, as shown in FIG. 2D, a through-hole plating hole 33 is formed. Next, FIG.
As shown in (e), through-hole plating (copper plating)
34 is applied. This plating is applied to the entire surface other than the wall surface of the through hole. Then, a circuit-forming dry film 35 is laminated on both sides (FIG. 2 (f)), and a portion where a circuit is to be formed by exposure to a predetermined circuit shape is covered with the dry film 35 (FIG. 2 (g)). The plating and the metal foil on the portion not covered with the dry film 35 were removed by etching. At this time, the etching time is set to the minimum necessary so that the metal foil 14 and the inner layer circuit 12 constituting the bottom surface of the IC housing hole 31 are not significantly etched. Further, the metal foil 22 side is set to the lower surface so that the etching solution does not accumulate in the IC accommodation hole 31. The thickness (35 μm) of the metal foil 14 and the inner layer circuit 12 is changed to the thickness (18
When the thickness is larger than μm), etching at the time of the circuit processing is facilitated. In other words, since the predetermined portion of the metal foil 22 is etched and the metal foil 14 and the inner layer circuit 12 are exposed to the etchant and slightly etched, there is no hindrance, so that the management of the etching process is facilitated. Thus, a printed wiring board of a three-layer circuit having the IC accommodation holes 31 was obtained (FIG. 2 (h)). The characteristics were the same as those of the printed wiring board of Example 1 shown in Table 1.
【００２５】[0025]
【発明の効果】上述のように、本発明に係る方法によれ
ば、内層と表面に回路を有し絶縁層に当該絶縁層だけを
貫通する穴を設けた多層のプリント配線板を製造しよう
とする場合に、汎用の積層板成形プレスとプリント配線
板製造設備を使用して、回路を１枚のワーク（絶縁層）
上に縦方向・横方向とも複数個配列して形成することが
できる。この方法は、回路を一列に配列してしか製造で
きないＴＡＢテープによる方法に比べて極めて効率的で
ある。また、穴底面への樹脂のしみ出しがない点でも優
れている。As described above, according to the method of the present invention, an attempt is made to manufacture a multilayer printed wiring board having a circuit in an inner layer and a surface and having a hole in an insulating layer penetrating only the insulating layer. When using a general-purpose laminate forming press and printed wiring board manufacturing equipment, the circuit can be converted to a single work (insulating layer).
It can be formed by arranging a plurality of pieces in the vertical and horizontal directions. This method is much more efficient than a method using a TAB tape which can be manufactured only by arranging circuits in a line. It is also excellent in that the resin does not exude to the bottom of the hole.
【図１】本発明に係る実施例の製造工程を示す断面図で
ある。FIG. 1 is a cross-sectional view showing a manufacturing process of an example according to the present invention.
【図２】本発明に係る他の実施例の製造工程を示す断面
図である。FIG. 2 is a sectional view showing a manufacturing process of another embodiment according to the present invention.
【図３】ＩＣ収容穴を有する片面プリント配線板の断面
図である。FIG. 3 is a sectional view of a single-sided printed wiring board having an IC accommodation hole.
１１，２１は樹脂絶縁層 １２は内層回路 １３，２３は熱硬化性樹脂Ａの層 １４，２２は金属箔 １５，２４は貫通穴 ３１はＩＣ収容穴 ３２は耐酸性インク ３３はスルーホール ３４はスルーホールメッキ ３５はドライフィルム 11 and 21 are resin insulating layers 12 are inner layer circuits 13 and 23 are layers of thermosetting resin A 14 and 22 are metal foils 15 and 24 are through holes 31 are IC receiving holes 32 are acid resistant inks 33 are through holes 34 are Through-hole plating 35 is a dry film
───────────────────────────────────────────────────── フロントページの続き (72)発明者 谷口 恵弘 東京都中央区日本橋本町２丁目８番７号 新神戸電機株式会社内 (72)発明者 小川 広義 愛知県豊橋市下地町字瀬上26番地の２ 株 式会社ジーエフ内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshihiro Taniguchi 2-8-7 Nihonbashi Honcho, Chuo-ku, Tokyo Inside Shin-Kobe Electric Machinery Co., Ltd. Inside GF Co., Ltd.
Claims (11)
徴とする多層プリント配線板の製造法。 （１）加熱硬化後においても再加熱により接着性を有す
る加熱硬化した熱硬化性樹脂Ａの層を、樹脂絶縁層の両
面に形成した板状体を用意する工程。 （２）この板状体にＩＣ収容穴となる貫通穴をあけた
後、両面の熱硬化性樹脂Ａの層に回路形成のための金属
箔を重ねて加熱加圧成形により一体化し、金属箔をエッ
チングして所定の回路に加工し、貫通穴の片側を金属箔
でふさいだプリント配線板を得る工程。 （３）上記プリント配線板の貫通穴開放側の面に、片面
金属箔張り板（所定位置に貫通穴をあけてあり、金属箔
のない側の面には加熱硬化後においても再加熱により接
着性を有する加熱硬化した熱硬化性樹脂Ａの層を設けて
ある）の金属箔のない側の面を、互いの貫通穴の位置を
合せて重ね、加熱加圧成形により一体化する工程。1. A method for manufacturing a multilayer printed wiring board, comprising the following steps (1) to (3). (1) A step of preparing a plate-like body in which a layer of a thermosetting resin A, which is adhesively cured by reheating even after heating and curing, is formed on both surfaces of a resin insulating layer. (2) After forming a through hole serving as an IC accommodation hole in this plate-like body, a metal foil for forming a circuit is laminated on the thermosetting resin A layer on both sides, and integrated by heating and pressing to form a metal foil. And etching to form a predetermined circuit to obtain a printed wiring board in which one side of the through hole is covered with metal foil. (3) A single-sided metal foil-clad plate (a through-hole is formed at a predetermined position, and the surface without a metal foil is adhered by reheating even after heat curing) on the surface of the printed wiring board on the side where the through-hole is open. (A layer of heat-cured thermosetting resin A having properties) provided on the side without the metal foil is overlapped with each other by aligning the positions of the through holes, and integrated by heat and pressure molding.
選ばれるいずれかの工程により板状体を製造する工程で
ある請求項１記載の多層プリント配線板の製造法。 （ａ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して、片面
に熱硬化性樹脂Ａの層を有する離型フィルムを準備し、
シート状基材に熱硬化性樹脂を含浸乾燥して得たプリプ
レグの両面に、前記離型フィルムの熱硬化性樹脂Ａの層
側をそれぞれ重ねて、加熱加圧成形により一体化して板
状体とする工程。 （ｂ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを、シート状基材に熱硬化性樹脂を含
浸乾燥して得たプリプレグの両面に塗布乾燥して、両面
に熱硬化性樹脂Ａの層を有するプリプレグを準備し、当
該プリプレグを加熱加圧成形して両面に熱硬化性樹脂Ａ
の層を有する板状体とする工程。 （ｃ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを、シート状基材に熱硬化性樹脂を含
浸乾燥し加熱加圧して得た板状体に塗布乾燥して、両面
に熱硬化性樹脂Ａの層を有する板状体を準備する工程。2. The method for producing a multilayer printed wiring board according to claim 1, wherein the step (1) is a step of producing a plate-like body by any one of the following steps (a) to (c). . (A) A thermosetting resin A having an adhesive property is applied to a release film by reheating even after heat curing, and dried to prepare a release film having a layer of the thermosetting resin A on one surface,
A sheet-like base material is impregnated with a thermosetting resin and dried to obtain a prepreg. Process. (B) A thermosetting resin A having adhesiveness due to reheating even after heat curing is applied to both sides of a prepreg obtained by impregnating and drying a thermosetting resin on a sheet-like substrate, and dried on both sides. A prepreg having a layer of a curable resin A is prepared, and the prepreg is heated and pressed to form a thermosetting resin A on both surfaces.
A step of forming a plate-like body having the above layer. (C) A thermosetting resin A having adhesiveness due to reheating even after heat curing is applied to a sheet obtained by impregnating and drying a thermosetting resin in a sheet-like base material, heating and pressing, and drying. A step of preparing a plate-like body having a layer of thermosetting resin A on both sides.
いても再加熱により接着性を有する熱硬化性樹脂Ａを離
型フィルムに塗布乾燥して粘着性がなくなる程度まで加
熱硬化させ、片面に熱硬化性樹脂Ａの層を有する離型フ
ィルムを用意する工程に置換え、（２）の工程を、（２
ａ）上記離型フィルムに形成した熱硬化性樹脂Ａの層に
ＩＣ収容穴となる貫通穴をあけた後、当該熱硬化性樹脂
Ａの層の両面に回路形成のための金属箔を重ねて加熱加
圧成形により一体化し、金属箔をエッチングして所定の
回路に加工し、貫通穴の片側を金属箔でふさいだプリン
ト配線板を得る工程に置換えた請求項１記載の多層プリ
ント配線板の製造法。3. The step (1) is carried out by (1a) applying a thermosetting resin A having adhesiveness to the release film by reheating even after heating and curing, and heating and curing it until the tackiness is eliminated. Was replaced with a step of preparing a release film having a layer of thermosetting resin A on one side, and the step of (2) was replaced with (2)
a) After forming a through hole serving as an IC housing hole in the thermosetting resin A layer formed on the release film, a metal foil for forming a circuit is laminated on both surfaces of the thermosetting resin A layer. 2. The multilayer printed wiring board according to claim 1, wherein the integrated process is performed by heat and pressure molding, the metal foil is etched to be processed into a predetermined circuit, and a step of obtaining a printed wiring board in which one side of the through hole is covered with the metal foil. Manufacturing method.
面に加熱硬化後においても再加熱により接着性を有する
加熱硬化した熱硬化性樹脂Ａの層を有し、もう一方の面
に金属箔を一体化した板状体を用意する工程に置換え、
（２）の工程を、（２ｂ）前記板状体にＩＣ収容穴とな
る貫通穴をあけた後、熱硬化性樹脂Ａの層側に回路形成
のための金属箔を重ねて加熱加圧成形により一体化し、
金属箔をエッチングして所定の回路に加工し、貫通穴の
片側を金属箔でふさいだプリント配線板を得る工程に置
換えた請求項１記載の多層プリント配線板の製造法。4. The method according to claim 1, wherein the step (1) comprises: (1b) having a layer of the thermosetting resin A which is heat-cured and has an adhesive property by reheating even after heat-curing on one side of the resin insulating layer; Replaced with the process of preparing a plate-like body with metal foil integrated on the surface,
In the step (2), (2b) after forming a through hole serving as an IC receiving hole in the plate-like body, a metal foil for forming a circuit is laminated on the layer side of the thermosetting resin A, and heat and pressure molding is performed. Integrated by
2. The method for producing a multilayer printed wiring board according to claim 1, wherein the metal foil is etched to be processed into a predetermined circuit, and a step of obtaining a printed wiring board in which one side of the through hole is covered with the metal foil is replaced.
り選ばれるいずれかの工程により板状体を製造する工程
である請求項４記載の多層プリント配線板の製造法。 （ａ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して、片面
に熱硬化性樹脂Ａの層を有する離型フィルムを準備し、
シート状基材に熱硬化性樹脂を含浸乾燥して得たプリプ
レグの一方の面に、前記離型フィルムの熱硬化性樹脂Ａ
の層側を重ね、前記プリプレグの他方の面には金属箔を
重ねて、加熱加圧成形により一体化して板状体とする工
程。 （ｂ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを、シート状基材に熱硬化性樹脂を含
浸乾燥して得たプリプレグに塗布乾燥して、片面に熱硬
化性樹脂Ａの層を有するプリプレグを準備し、当該プリ
プレグの熱硬化性樹脂Ａの層を有しない側に金属箔を重
ね、加熱加圧成形により一体化して板状体とする工程。5. The method for producing a multilayer printed wiring board according to claim 4, wherein the step (1b) is a step of producing a plate-like body by any one of the following steps (a) and (b). . (A) A thermosetting resin A having an adhesive property is applied to a release film by reheating even after heat curing, and dried to prepare a release film having a layer of the thermosetting resin A on one surface,
On one surface of a prepreg obtained by impregnating and drying a sheet-shaped substrate with a thermosetting resin, the thermosetting resin A of the release film is applied.
And laminating a metal foil on the other surface of the prepreg, and integrating it by heating and pressing to form a plate. (B) A thermosetting resin A having adhesiveness due to reheating even after heat curing is applied to a prepreg obtained by impregnating and drying a thermosetting resin on a sheet-like base material, and is dried by drying. A step of preparing a prepreg having a layer of resin A, laminating a metal foil on the side of the prepreg not having the layer of thermosetting resin A, and integrating it by heating and pressing to form a plate-like body.
いずれかの方法により製造された片面金属箔張り板を使
用するものである請求項１〜５のいずれかに記載の多層
プリント配線板の製造法。 （ａ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して、片面
に熱硬化性樹脂Ａの層を有する離型フィルムを準備する
工程、シート状基材に熱硬化性樹脂を含浸乾燥して得た
プリプレグの一方の面に、前記離型フィルムの熱硬化性
樹脂Ａの層側を重ね、前記プリプレグの他方の面には金
属箔を重ねて、加熱加圧成形により一体化して板状体と
する工程、そして、離型フィルムを剥がして又は剥がさ
ずに、上記板状体の所定位置に貫通穴をあける方法。 （ｂ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを、シート状基材に熱硬化性樹脂を含
浸乾燥して得たプリプレグに塗布乾燥して、片面に熱硬
化性樹脂Ａの層を有するプリプレグを準備する工程、前
記プリプレグの熱硬化性樹脂Ａの層を有しない側に金属
箔を重ね、加熱加圧成形により一体化して板状体とする
工程、そして、前記板状体の所定位置に貫通穴をあける
方法。 （ｃ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して粘着性
がなくなる程度まで加熱硬化させ、片面に熱硬化性樹脂
Ａの層を有する離型フィルムを準備する工程、前記離型
フィルムの熱硬化性樹脂Ａの層側に金属箔を重ねて加熱
加圧成形により一体化して板状体とする工程、そして、
離型フィルムを剥がして又は剥がさずに、前記板状体の
所定位置に貫通穴をあける方法。6. The method according to claim 1, wherein the step (3) uses a single-sided metal foil-clad board manufactured by any of the following methods (a) to (c). A method for producing the multilayer printed wiring board according to the above. (A) a step of applying a thermosetting resin A having adhesiveness to a release film by reheating even after heat curing and drying the same, and preparing a release film having a layer of the thermosetting resin A on one surface; A prepreg obtained by impregnating and drying a thermosetting resin on a plate-like base material is overlapped on one side of the layer of thermosetting resin A of the release film, and a metal foil is overlapped on the other side of the prepreg. And forming a plate-like body by heat and pressure molding, and a method of making a through-hole at a predetermined position of the plate-like body by peeling off or not peeling off the release film. (B) A thermosetting resin A having adhesiveness due to reheating even after heat curing is applied to a prepreg obtained by impregnating and drying a thermosetting resin on a sheet-like base material, and is dried by drying. A step of preparing a prepreg having a layer of resin A, a step of laminating a metal foil on a side of the prepreg which does not have a layer of thermosetting resin A, and integrating it by heating and pressing to form a plate-like body; A method of making a through hole at a predetermined position on a plate. (C) Even after heating and curing, the thermosetting resin A having adhesiveness is applied to the release film by reheating and dried and heat-cured until the tackiness is eliminated, and the layer of the thermosetting resin A is provided on one surface. A step of preparing a release film, a step of laminating a metal foil on the layer side of the thermosetting resin A of the release film and integrating them by heating and pressing to form a plate-like body, and
A method of forming a through-hole at a predetermined position of the plate-like body with or without peeling off the release film.
の貫通穴開放側の面に、板状体（所定位置に貫通穴をあ
けてあり、両面に加熱硬化後においても再加熱により接
着性を有する加熱硬化した熱硬化性樹脂Ａの層を有す
る）を、互いの貫通穴の位置を合せて重ね、さらに、板
状体の表面に金属箔を重ねて加熱加圧成形により一体化
する工程に置換えた請求項１〜５のいずれかに記載の多
層プリント配線板の製造法。7. The step (3) is performed by: (3a) forming a plate-like body (a through-hole is formed at a predetermined position on the surface of the printed wiring board on the side where the through-hole is open, and reheating even after heat curing on both sides). With a layer of heat-cured thermosetting resin A having an adhesive property), and aligning the positions of the through holes with each other. The method for producing a multilayer printed wiring board according to any one of claims 1 to 5, wherein the method is replaced with a step of forming a multilayer printed wiring board.
のいずれかの方法により製造された板状体を使用するも
のである請求項７記載の多層プリント配線板の製造法。 （ａ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して、片面
に熱硬化性樹脂Ａの層を有する離型フィルムを準備する
工程、シート状基材に熱硬化性樹脂を含浸乾燥して得た
プリプレグの両面に、前記離型フィルムの熱硬化性樹脂
Ａの層側を重ね、加熱加圧成形により一体化して板状体
とする工程、そして、離型フィルムを剥がして又は剥が
さずに、上記板状体の所定位置に貫通穴をあける方法。 （ｂ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを、シート状基材に熱硬化性樹脂を含
浸乾燥して得たプリプレグの両面に塗布乾燥して、両面
に熱硬化性樹脂Ａの層を有するプリプレグを準備する工
程、前記プリプレグを加熱加圧成形して両面に熱硬化性
樹脂Ａの層を有する板状体とする工程、そして、前記板
状体の所定位置に貫通穴をあける方法。 （ｃ）加熱硬化後においても再加熱により接着性を有す
る熱硬化性樹脂Ａを離型フィルムに塗布乾燥して粘着性
がなくなる程度まで加熱硬化させ、片面に熱硬化性樹脂
Ａの層を有する離型フィルムを準備する工程、そして、
離型フィルムを剥がして又は剥がさずに、前記板状体の
所定位置に貫通穴をあける方法。8. The step (3a) includes the following steps (a) to (c):
8. The method for producing a multilayer printed wiring board according to claim 7, wherein a plate-like body produced by any one of the above methods is used. (A) a step of applying a thermosetting resin A having adhesiveness to a release film by reheating even after heat curing and drying the same, and preparing a release film having a layer of the thermosetting resin A on one surface; A step of superposing the layer side of the thermosetting resin A of the release film on both sides of a prepreg obtained by impregnating and drying a thermosetting resin on a plate-shaped base material, and integrating by heat and pressure molding into a plate-like body. And a method of making a through hole at a predetermined position of the plate-like body with or without peeling off the release film. (B) A thermosetting resin A having adhesiveness due to reheating even after heat curing is applied to both sides of a prepreg obtained by impregnating and drying a thermosetting resin on a sheet-like substrate, and dried on both sides. A step of preparing a prepreg having a layer of the curable resin A, a step of heating and pressing the prepreg to form a plate having a layer of the thermosetting resin A on both surfaces, and a predetermined position of the plate How to drill through holes in (C) Even after heating and curing, the thermosetting resin A having adhesiveness is applied to the release film by reheating and dried and heat-cured until the tackiness is eliminated, and the layer of the thermosetting resin A is provided on one surface. Preparing a release film, and
A method of forming a through-hole at a predetermined position of the plate-like body with or without peeling off the release film.
組成物である請求項１〜８のいずれかに記載の多層プリ
ント配線板の製造法。。9. The method for producing a multilayer printed wiring board according to claim 1, wherein the thermosetting resin A is a rubber-modified thermosetting resin composition. .
シ樹脂、エポキシ樹脂と反応性を有するゴム成分、硬化
剤を必須成分とすることを特徴とする請求項９記載の多
層プリント配線板の製造法。10. The multilayer printed wiring board according to claim 9, wherein the rubber-modified thermosetting resin composition contains an epoxy resin, a rubber component reactive with the epoxy resin, and a curing agent as essential components. Manufacturing method.
ある請求項１０記載の多層プリント配線板の製造法。11. The method according to claim 10, wherein the rubber component is an epoxy-modified acrylic rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13546397A JP3594765B2 (en) | 1997-05-26 | 1997-05-26 | Manufacturing method of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13546397A JP3594765B2 (en) | 1997-05-26 | 1997-05-26 | Manufacturing method of multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10326967A true JPH10326967A (en) | 1998-12-08 |
| JP3594765B2 JP3594765B2 (en) | 2004-12-02 |
Family
ID=15152310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13546397A Expired - Fee Related JP3594765B2 (en) | 1997-05-26 | 1997-05-26 | Manufacturing method of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3594765B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060341A (en) * | 2001-08-08 | 2003-02-28 | Mitsubishi Gas Chem Co Inc | Method of manufacturing printed wiring board having minute pattern |
| JP2003069218A (en) * | 2001-08-23 | 2003-03-07 | Mitsubishi Gas Chem Co Inc | Method for manufacturing printed wiring board having extra-fine pattern |
-
1997
- 1997-05-26 JP JP13546397A patent/JP3594765B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060341A (en) * | 2001-08-08 | 2003-02-28 | Mitsubishi Gas Chem Co Inc | Method of manufacturing printed wiring board having minute pattern |
| JP2003069218A (en) * | 2001-08-23 | 2003-03-07 | Mitsubishi Gas Chem Co Inc | Method for manufacturing printed wiring board having extra-fine pattern |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3594765B2 (en) | 2004-12-02 |
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