JPH1110791A - Joining material for manufacture of single metal-applied laminated plate - Google Patents
Joining material for manufacture of single metal-applied laminated plateInfo
- Publication number
- JPH1110791A JPH1110791A JP16918097A JP16918097A JPH1110791A JP H1110791 A JPH1110791 A JP H1110791A JP 16918097 A JP16918097 A JP 16918097A JP 16918097 A JP16918097 A JP 16918097A JP H1110791 A JPH1110791 A JP H1110791A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal
- bonding material
- clad laminate
- sided metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、片面プリント配線
板として使用される片面金属張り積層板を製造する際に
用いられる接合材に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding material used for manufacturing a single-sided metal-clad laminate used as a single-sided printed wiring board.
【０００２】[0002]
【従来の技術】片面に銅箔などの金属箔を積層した片面
金属箔張り積層板を製造するにあたって、特開平７−２
７３４２４号公報等で提供されるような、接合材を用い
る方法がある。すなわちこの接合材としては、例えば、
基材の両面にエポキシ樹脂とシリコン樹脂の混合樹脂を
塗布した離型材や、フッ素樹脂系フィルム離型材や、ト
リアセテートフィルム離型材などが用いられるものであ
り、図２（ａ）のように接合材Ａの両側にそれぞれ複数
枚のプリプレグ３を重ね、さらに各プリプレグ３の最外
層に銅箔等の金属箔４を重ね、これを加熱加圧すること
によって接合材Ａの両面にそれぞれ接合させた状態で図
２（ｂ）のように片面金属張り積層板５を成形すること
ができるものである。2. Description of the Related Art In manufacturing a single-sided metal foil-clad laminate in which a metal foil such as a copper foil is laminated on one side, Japanese Patent Application Laid-Open No.
There is a method using a bonding material as provided in, for example, Japanese Patent No. 73424. That is, as this joining material, for example,
A release material in which a mixed resin of an epoxy resin and a silicone resin is applied to both surfaces of the base material, a release material of a fluororesin film, a release material of a triacetate film, and the like are used. As shown in FIG. A plurality of prepregs 3 are superimposed on both sides of A, respectively, and a metal foil 4 such as a copper foil is superimposed on the outermost layer of each prepreg 3. As shown in FIG. 2B, the single-sided metal-clad laminate 5 can be formed.
【０００３】このように接合材Ａを用いることによっ
て、２枚の片面金属張り積層板５を同時に成形すること
ができるものであり、生産性高く片面金属張り積層板５
を製造することができるものである。そして各片面金属
張り積層板５を接合材Ａから剥がして、各片面金属張り
積層板５に個別に回路印刷、エッチング、ドリル加工等
を行なって、片面プリント配線板に加工することができ
るが、接合材Ａの両面にそれぞれ片面金属張り積層板５
を接合した上記のものを１セットとして、回路印刷、エ
ッチング、ドリル加工等を行なうことによって、接合材
Ａの両面の片面金属張り積層板５を同時に片面プリント
配線板に加工することができるものであり、従ってこの
場合には、加工効率を高く得ることがきるものである。[0003] By using the bonding material A in this manner, two single-sided metal-clad laminates 5 can be simultaneously formed, and the single-sided metal-clad laminate 5 can be formed with high productivity.
Can be manufactured. Then, each single-sided metal-clad laminate 5 is peeled off from the bonding material A, and each single-sided metal-clad laminate 5 is individually printed, etched, drilled, etc., and processed into a single-sided printed wiring board. Single-sided metal-clad laminates 5 on both sides of bonding material A
By bonding the above-mentioned components to one set and performing circuit printing, etching, drilling, and the like, the single-sided metal-clad laminates 5 on both sides of the joining material A can be simultaneously processed into single-sided printed wiring boards. Therefore, in this case, high processing efficiency can be obtained.
【０００４】[0004]
【発明が解決しようとする課題】しかし、接合材Ａとし
て従来から使用されている上記のものを用いると、接合
材Ａに対する片面金属張り積層板５の密着性が不十分で
あり、プリント加工の工程中に接合材Ａから片面金属張
り積層板５が剥離したり、また接合材Ａと片面金属張り
積層板５の間にエッチング液がしみ込んで片面金属張り
積層板５の基板１０の裏面にエッチング液が残ったりす
る等の問題があった。However, when the above-mentioned material conventionally used as the bonding material A is used, the adhesion of the single-sided metal-clad laminate 5 to the bonding material A is insufficient, so that the printing process is difficult. During the process, the single-sided metal-clad laminate 5 is peeled off from the bonding material A, or an etchant soaks between the bonding material A and the single-sided metal-clad laminate 5 to etch the back surface of the substrate 10 of the single-sided metal-clad laminate 5. There were problems such as liquid remaining.
【０００５】本発明は上記の点に鑑みてなされたもので
あり、密着性高く接合して片面金属張り積層板を成形す
ることができ、しかもこの積層板を剥離するときには積
層板に樹脂層の樹脂が転写されて残ったりすることがな
い片面金属張り積層板製造用接合材を提供することを目
的とするものである。[0005] The present invention has been made in view of the above points, it is possible to form a single-sided metal-clad laminate by bonding with high adhesion, and when the laminate is peeled, a resin layer is applied to the laminate. An object of the present invention is to provide a bonding material for manufacturing a single-sided metal-clad laminate in which resin is not transferred and remains.
【０００６】[0006]
【課題を解決するための手段】本発明の請求項１に係る
片面金属張り積層板製造用接合材は、両面にプリプレグ
３を介して金属箔４を配置すると共にこれを加熱加圧す
ることによって、片面金属張り積層板５を両面に接合さ
せて成形するために用いられる接合材Ａにおいて、金属
材１の両側の表面にそれぞれエポキシ樹脂とメラミン樹
脂を混合した熱硬化性樹脂からなる樹脂層２を設けて成
ることを特徴とするものである。The bonding material for manufacturing a single-sided metal-clad laminate according to the first aspect of the present invention is obtained by disposing a metal foil 4 on both sides via a prepreg 3 and heating and pressurizing the metal foil. In a joining material A used for joining and molding a single-sided metal-clad laminate 5 on both sides, a resin layer 2 made of a thermosetting resin mixed with an epoxy resin and a melamine resin is formed on both surfaces of the metal material 1. It is characterized by being provided.
【０００７】また請求項２の発明は、請求項１におい
て、エポキシ樹脂としてビスフェノールＡ型エポキシ樹
脂を用い、エポキシ樹脂１００重量部に対してメラミン
樹脂を１〜１００重量部混合して成ることを特徴とする
ものである。本発明の請求項３に係る片面金属張り積層
板製造用接合材は、両面にプリプレグ３を介して金属箔
４を配置すると共にこれを加熱加圧することによって、
片面金属張り積層板５を両面に接合させて成形するため
に用いられる接合材Ａにおいて、金属材１の両側の表面
にそれぞれエポキシ樹脂とメラミン樹脂とアクリル・ブ
タジエン・メタクリル酸共重合物とポリエステル系樹脂
を混合した熱硬化性樹脂からなる樹脂層２を設けて成る
ことを特徴とするものである。The invention of claim 2 is characterized in that, in claim 1, bisphenol A type epoxy resin is used as the epoxy resin, and 1 to 100 parts by weight of the melamine resin is mixed with 100 parts by weight of the epoxy resin. It is assumed that. The bonding material for manufacturing a single-sided metal-clad laminate according to claim 3 of the present invention is obtained by disposing a metal foil 4 on both sides via a prepreg 3 and heating and pressing the metal foil 4.
In a joining material A used for joining and molding the single-sided metal-clad laminate 5 on both sides, an epoxy resin, a melamine resin, an acryl-butadiene-methacrylic acid copolymer and a polyester It is characterized by having a resin layer 2 made of a thermosetting resin mixed with a resin.
【０００８】また請求項４の発明は、請求項３におい
て、エポキシ樹脂としてビスフェノールＡ型エポキシ樹
脂を用い、エポキシ樹脂１００重量部に対してメラミン
樹脂を１〜１００重量部混合して成ることを特徴とする
ものである。また請求項５の発明は、請求項１乃至４に
おいて、樹脂層２は熱硬化性樹脂をＣステージ状態に硬
化させて形成されていることを特徴とするものである。According to a fourth aspect of the present invention, in the third aspect, a bisphenol A type epoxy resin is used as the epoxy resin, and 1 to 100 parts by weight of the melamine resin is mixed with 100 parts by weight of the epoxy resin. It is assumed that. According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the resin layer 2 is formed by curing a thermosetting resin in a C-stage state.
【０００９】また請求項６の発明は、請求項１乃至５に
おいて、樹脂層２の厚みが０．１〜１０μｍであること
を特徴とするものである。また請求項７の発明は、請求
項１乃至６において、金属材１がアルミニウム箔である
ことを特徴とするものである。A sixth aspect of the present invention is characterized in that, in any of the first to fifth aspects, the thickness of the resin layer 2 is 0.1 to 10 μm. The invention of claim 7 is characterized in that, in claims 1 to 6, the metal material 1 is an aluminum foil.
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。本発明の接合材Ａは、芯材となる金属材１の両面
に樹脂層２，２を設けて形成されるものであり、金属材
１としては、アルミニウム箔や銅箔などの金属箔を用い
ることができる。金属材１としてこのように金属箔を用
いる場合には、アルミニウム箔を使用するのが好まし
い。この金属材１は片面金属張り積層板の製造に一般に
用いられる銅箔に熱膨張が近く、表面が平滑なものが適
している。金属材１として銅箔を使用する場合、厚みの
薄いものを使用するには電解銅箔を使用する必要がある
が、電解銅箔は片面が粗面に形成されており、不適であ
る。これに対してアルミニウム箔は厚みが薄く表面が平
滑化されたものが汎用されており、熱膨張も銅箔に近い
ために、適しているものである。Embodiments of the present invention will be described below. The bonding material A of the present invention is formed by providing resin layers 2 and 2 on both surfaces of a metal material 1 serving as a core material. As the metal material 1, a metal foil such as an aluminum foil or a copper foil is used. be able to. When a metal foil is used as the metal material 1 as described above, it is preferable to use an aluminum foil. The metal material 1 has a thermal expansion similar to that of a copper foil generally used for manufacturing a single-sided metal-clad laminate and has a smooth surface. When a copper foil is used as the metal material 1, it is necessary to use an electrolytic copper foil in order to use a thinner one. However, the electrolytic copper foil is unsuitable because one surface is formed with a rough surface. On the other hand, aluminum foil having a small thickness and a smooth surface is widely used, and is suitable because its thermal expansion is close to that of copper foil.
【００１１】また、樹脂層２を形成する樹脂としては、
エポキシ樹脂とメラミン樹脂からなる熱硬化性樹脂を用
いるものである。エポキシ樹脂とメラミン樹脂を混合し
てブレンド熱硬化性樹脂として使用することができるも
のである。エポキシ樹脂としてはビスフェノールＡ型エ
ポキシ樹脂を用いるのが好ましい。片面金属張り積層板
の製造に使用されるプリプレグは一般にエポキシ樹脂で
作製されているが、このエポキシ樹脂にはビスフェノー
ルＡ型エポキシ樹脂が使用されることが多く、プリプレ
グの樹脂との接合性から樹脂層２を形成する樹脂のエポ
キシ樹脂としてはビスフェノールＡ型エポキシ樹脂が好
ましいのである。エポキシ樹脂とメラミン樹脂の混合量
は、エポキシ樹脂としてビスフェノールＡ型エポキシ樹
脂を用いる場合、エポキシ樹脂１００重量部に対して、
メラミン樹脂１〜１００重量部の範囲が好ましい。メラ
ミン樹脂の混合量が１重量部未満であると、樹脂層２が
硬く脆くなり、後述のように成形した片面金属張り積層
板５の基板１０に樹脂が転写し易くなる。逆にメラミン
樹脂の混合量が１００重量部を超えると、樹脂層２の耐
熱性や耐溶剤性が悪くなり、同様に片面金属張り積層板
５の基板１０に樹脂が転写し易くなる。The resin forming the resin layer 2 includes:
A thermosetting resin composed of an epoxy resin and a melamine resin is used. An epoxy resin and a melamine resin can be mixed and used as a blended thermosetting resin. It is preferable to use a bisphenol A type epoxy resin as the epoxy resin. The prepreg used for manufacturing a single-sided metal-clad laminate is generally made of an epoxy resin, but a bisphenol A type epoxy resin is often used as the epoxy resin. The epoxy resin of the resin forming the layer 2 is preferably a bisphenol A type epoxy resin. When the bisphenol A type epoxy resin is used as the epoxy resin, the mixing amount of the epoxy resin and the melamine resin is based on 100 parts by weight of the epoxy resin.
The range of 1 to 100 parts by weight of the melamine resin is preferred. If the amount of the melamine resin is less than 1 part by weight, the resin layer 2 becomes hard and brittle, and the resin is easily transferred to the substrate 10 of the single-sided metal-clad laminate 5 formed as described later. Conversely, when the mixing amount of the melamine resin exceeds 100 parts by weight, the heat resistance and the solvent resistance of the resin layer 2 are deteriorated, and similarly, the resin is easily transferred to the substrate 10 of the single-sided metal-clad laminate 5.
【００１２】またエポキシ樹脂とメラミン樹脂をベース
とし、さらに剥離強度をコントロールするために、アク
リル・ブタジエン・メタクリル酸共重合物とポリエステ
ル系樹脂を混合して調製した熱硬化性樹脂を用いること
もできる。アクリル・ブタジエン・メタクリル酸共重合
物としては、各共重合成分の重量比率が、アクリル１に
対して、ブタジエンが１〜４、メタクリル酸が０．１〜
２の範囲のものが好ましい。またポリエステル系樹脂と
しては後述する化学構造式（Ｄ）のものなどの熱可塑性
ポリエステル樹脂を用いることができる。これらの配合
量は、エポキシ樹脂としてビスフェノールＡ型エポキシ
樹脂を用いる場合、エポキシ樹脂１００重量部に対し
て、メラミン樹脂１〜１００重量部の範囲が好ましく、
さらにアクリル・ブタジエン・メタクリル酸共重合物は
０〜１０重量部、ポリエステル系樹脂は０〜１重量部の
範囲が好ましい。A thermosetting resin prepared by mixing an acrylic / butadiene / methacrylic acid copolymer and a polyester resin can also be used to control the peel strength based on an epoxy resin and a melamine resin. . As the acryl-butadiene-methacrylic acid copolymer, the weight ratio of each copolymer component is 1 to 4 for butadiene and 0.1 to methacrylic acid for 1 acryl.
A range of 2 is preferred. As the polyester-based resin, a thermoplastic polyester resin such as one having the chemical formula (D) described below can be used. When a bisphenol A type epoxy resin is used as the epoxy resin, the content of the melamine resin is preferably in the range of 1 to 100 parts by weight with respect to 100 parts by weight of the epoxy resin.
Further, the acrylic-butadiene-methacrylic acid copolymer is preferably in a range of 0 to 10 parts by weight, and the polyester resin is preferably in a range of 0 to 1 part by weight.
【００１３】そして、金属材１の両面にそれぞれ熱硬化
性樹脂を塗布して樹脂層２，２を形成することによっ
て、接合材Ａを作製することができるものである。形成
する樹脂層２の厚みは、０．１〜１０μｍの範囲が好ま
しい。樹脂層２の厚みをこの範囲に設定することによっ
て、金属材１への樹脂層２の密着性が良好になり、樹脂
層２が金属材１から剥離して後述のように成形した片面
金属張り積層板５の基板１０に樹脂が転写し難くなるも
のである。The bonding material A can be produced by applying a thermosetting resin to both surfaces of the metal material 1 to form the resin layers 2 and 2, respectively. The thickness of the resin layer 2 to be formed is preferably in the range of 0.1 to 10 μm. By setting the thickness of the resin layer 2 in this range, the adhesiveness of the resin layer 2 to the metal material 1 is improved, and the resin layer 2 is peeled from the metal material 1 to form a one-sided metal This makes it difficult for the resin to transfer to the substrate 10 of the laminate 5.
【００１４】このとき、金属材１に塗布した熱硬化性樹
脂を加熱することによって、樹脂層２をＣステージ状態
にまで完全に硬化させるようにするのが好ましい。樹脂
層２が半硬化のＢステージ状態であると、後述のように
接合材Ａに接合させて成形した片面金属張り積層板５を
接合材Ａから剥離する際の剥離性が悪くなると共に片面
金属張り積層板５の基板１０の背面に樹脂層２が転写す
るおそれがあるので、樹脂層２はＣステージ状態に硬化
させて形成するのが好ましい。At this time, it is preferable that the thermosetting resin applied to the metal material 1 is heated so that the resin layer 2 is completely cured to the C-stage state. When the resin layer 2 is in the semi-cured B-stage state, the single-sided metal-clad laminate 5 bonded and formed to the bonding material A as described later has a poor peeling property when peeled off from the bonding material A, and the single-sided metal Since the resin layer 2 may be transferred to the back surface of the substrate 10 of the laminated laminate 5, it is preferable that the resin layer 2 is formed by curing the resin layer 2 in a C-stage state.
【００１５】上記のようにして作製される接合材Ａを用
いて片面金属張り積層板５を製造するにあたっては、図
１（ａ）に示すように、接合材Ａの両面に複数枚のプリ
プレグ３を重ねると共に、このプリプレグ３の外側に銅
箔などの金属箔４を重ね、これを加熱加圧成形すること
によって、図１（ｂ）のように、プリプレグ３による基
板１０の片側表面に金属箔４が積層された２枚の片面金
属張り積層板５を接合材Ａの両面に成形することができ
るものであり、各片面金属張り積層板５は接合材Ａの表
面に接合されて一体化された状態で成形されるものであ
る。When the single-sided metal-clad laminate 5 is manufactured using the bonding material A manufactured as described above, a plurality of prepregs 3 are provided on both surfaces of the bonding material A as shown in FIG. And a metal foil 4 such as a copper foil is layered on the outside of the prepreg 3 and formed by heating and pressing to form a metal foil 4 on one surface of the substrate 10 by the prepreg 3 as shown in FIG. The two single-sided metal-clad laminates 5 on which the laminates 4 are laminated can be formed on both surfaces of the joining material A. Each single-sided metal-clad laminate 5 is joined and integrated with the surface of the joining material A. It is molded in a state where it is in a state.
【００１６】そして、このように接合材Ａの両面にそれ
ぞれ片面金属張り積層板５を接合したものを１セットと
して、各片面金属張り積層板５に回路印刷、エッチン
グ、ドリル加工等を行なうことによって、接合材Ａの両
面の片面金属張り積層板５を同時に片面プリント配線板
に加工することができるものである。このようにプリン
ト加工するにあたって、接合材Ａの表面にはエポキシ樹
脂とメラミン樹脂をベースとする樹脂層２が形成してあ
り、接合材Ａの表面と片面金属張り積層板５との間の密
着性を高く得ることができる。従って、プリント加工の
工程中に接合材Ａから片面金属張り積層板５が剥離した
り、また接合材Ａと片面金属張り積層板５の間にエッチ
ング液がしみ込んで片面金属張り積層板５の基板１０の
裏面にエッチング液が残ったりするようなことを防ぐこ
とができるものである。またエポキシ樹脂とメラミン樹
脂をベースとする樹脂層２は片面金属張り積層板５の剥
離性も良好であり、片面プリント配線板に加工した後の
片面金属張り積層板５を接合材Ａから剥離する際に、樹
脂層２の樹脂が片面金属張り積層板５の基板１０の背面
に転写して付着するようなことがなくなるものである。
従って、片面プリント配線板に加工した片面金属張り積
層板５の基板１０の背面にシルクスクーン印刷等するに
あたって、片面金属張り積層板５の基板１０に対するイ
ンクの密着性に問題が生じることがなくなり、また片面
プリント配線板に加工した片面金属張り積層板５を二次
成形して多層プリント配線板などの多層板を製造するに
あたって、層間引き剥がし強度に問題が生じることがな
くなるものである。The single-sided metal-clad laminates 5 are bonded to both sides of the bonding material A as a set, and the single-sided metal-clad laminates 5 are subjected to circuit printing, etching, drilling, and the like. The single-sided metal-clad laminate 5 on both sides of the joining material A can be simultaneously processed into a single-sided printed wiring board. In printing in this manner, a resin layer 2 based on an epoxy resin and a melamine resin is formed on the surface of the bonding material A, and the adhesion between the surface of the bonding material A and the single-sided metal-clad laminate 5 is formed. High quality can be obtained. Therefore, the single-sided metal-clad laminate 5 is peeled off from the bonding material A during the printing process, or the etching solution soaks between the bonding material A and the single-sided metal-clad laminate 5 and the substrate of the single-sided metal-clad laminate 5 is removed. It is possible to prevent the etchant from remaining on the back surface of the substrate 10. The resin layer 2 based on an epoxy resin and a melamine resin also has good releasability of the single-sided metal-clad laminate 5, and peels the single-sided metal-clad laminate 5 from the bonding material A after being processed into a single-sided printed wiring board. In this case, the resin of the resin layer 2 is prevented from being transferred and adhered to the back surface of the substrate 10 of the single-sided metal-clad laminate 5.
Therefore, when performing silk screen printing or the like on the back surface of the substrate 10 of the single-sided metal-clad laminate 5 processed into a single-sided printed wiring board, no problem occurs in the adhesion of the ink to the substrate 10 of the single-sided metal-clad laminate 5. Further, when a single-sided metal-clad laminate 5 processed into a single-sided printed wiring board is secondarily formed to produce a multilayer board such as a multilayer printed wiring board, no problem occurs in interlayer peel strength.
【００１７】[0017]
【実施例】以下本発明を実施例によって具体的に説明す
る。 （実施例１）ビスフェノールＡ型エポキシ樹脂（化学構
造式（Ａ）のもの、平均分子量１４９００）１００重
量、メラミン樹脂（化学構造式（Ｂ）のもの、平均分子
量２４１）５０重量部を混合して熱硬化性樹脂を調製し
た。The present invention will be described below in detail with reference to examples. (Example 1) 100 parts by weight of a bisphenol A type epoxy resin (of the chemical structural formula (A), average molecular weight of 14,900) and 50 parts by weight of a melamine resin (of the chemical structural formula (B), average molecular weight of 241) were mixed. A thermosetting resin was prepared.
【００１８】そして、厚み３０μのアルミニウム箔（Ｊ
ＩＳ Ｈ ４１６０ Ａ１Ｎ３０Ｈ１８）を金属材１と
して用い、その両面にグラビアロールコート法で上記の
熱硬化性樹脂をコーティングし、１７０℃のオーブンで
１分間加熱乾燥することによって、Ｃステージ状態の厚
み１μｍの樹脂層２を金属材１の両面に設けた接合材Ａ
を作製した。Then, an aluminum foil (J
Using IS H 4160 A1N30H18) as the metal material 1, the thermosetting resin is coated on both surfaces thereof by a gravure roll coating method, and heated and dried in an oven at 170 ° C. for 1 minute to obtain a C-stage 1 μm thick film. Bonding material A in which resin layer 2 is provided on both sides of metal material 1
Was prepared.
【００１９】（実施例２）実施例１と同じビスフェノー
ルＡ型エポキシ樹脂１００重量、実施例１と同じメラミ
ン樹脂５重量部を混合して熱硬化性樹脂を調製した。こ
の熱硬化性樹脂を用いて、後は実施例１と同様にして、
金属材１の両面にＣステージ状態の厚み３μｍの樹脂層
２を設けた接合材Ａを作製した。Example 2 A thermosetting resin was prepared by mixing 100 parts by weight of the same bisphenol A type epoxy resin as in Example 1 and 5 parts by weight of the same melamine resin as in Example 1. Using this thermosetting resin, the subsequent steps were performed in the same manner as in Example 1.
A bonding material A having a resin layer 2 having a thickness of 3 μm in a C-stage state on both surfaces of a metal material 1 was produced.
【００２０】（実施例３）実施例１と同じビスフェノー
ルＡ型エポキシ樹脂１００重量、実施例１と同じメラミ
ン樹脂８５重量部を混合して熱硬化性樹脂を調製した。
この熱硬化性樹脂を用いて、後は実施例１と同様にし
て、金属材１の両面にＣステージ状態の厚み２μｍの樹
脂層２を設けた接合材Ａを作製した。Example 3 A thermosetting resin was prepared by mixing 100 parts by weight of the same bisphenol A type epoxy resin as in Example 1 and 85 parts by weight of the same melamine resin as in Example 1.
Using this thermosetting resin, a bonding material A having a 2 μm thick resin layer 2 in the C-stage state on both surfaces of the metal material 1 was manufactured in the same manner as in Example 1.
【００２１】（実施例４）実施例１と同じビスフェノー
ルＡ型エポキシ樹脂１００重量、実施例１と同じメラミ
ン樹脂５０重量部、アクリル・ブタジエン・メタクリル
酸共重合物（化学構造式（Ｃ）のもの、平均分子量３０
００）０．４重量部、熱可塑性飽和共重合ポリエステル
樹脂（化学構造式（Ｄ）のもの、平均分子量３０００）
０．１３重量部を混合して熱硬化性樹脂を調製した。こ
の熱硬化性樹脂を用いて、後は実施例１と同様にして、
金属材１の両面にＣステージ状態の厚み４μｍの樹脂層
２を設けた接合材Ａを作製した。(Example 4) 100 parts by weight of the same bisphenol A epoxy resin as in Example 1, 50 parts by weight of a melamine resin as in Example 1, and an acrylic / butadiene / methacrylic acid copolymer (having the chemical structural formula (C)) , Average molecular weight 30
00) 0.4 parts by weight, thermoplastic saturated copolymerized polyester resin (of chemical structural formula (D), average molecular weight 3000)
0.13 parts by weight was mixed to prepare a thermosetting resin. Using this thermosetting resin, the subsequent steps were performed in the same manner as in Example 1.
A bonding material A having a 4 μm thick resin layer 2 in a C-stage state on both surfaces of a metal material 1 was produced.
【００２２】（実施例５）実施例１と同じビスフェノー
ルＡ型エポキシ樹脂１００重量、実施例１と同じメラミ
ン樹脂５０重量部、実施例４と同じアクリル・ブタジエ
ン・メタクリル酸共重合物２．１重量部、実施例４と同
じ熱可塑性飽和共重合ポリエステル樹脂０．６３重量部
を混合して熱硬化性樹脂を調製した。この熱硬化性樹脂
を用いて、後は実施例１と同様にして、金属材１の両面
にＣステージ状態の厚み１μｍの樹脂層２を設けた接合
材Ａを作製した。Example 5 100 parts by weight of the same bisphenol A type epoxy resin as in Example 1, 50 parts by weight of the same melamine resin as in Example 1, and 2.1 parts by weight of the same acryl / butadiene / methacrylic acid copolymer as in Example 4 Parts, 0.63 parts by weight of the same thermoplastic saturated copolymerized polyester resin as in Example 4 were mixed to prepare a thermosetting resin. Using this thermosetting resin, a bonding material A having a 1 μm thick resin layer 2 in a C-stage state on both surfaces of a metal material 1 was manufactured in the same manner as in Example 1.
【００２３】（実施例６）実施例１と同じビスフェノー
ルＡ型エポキシ樹脂１００重量、実施例１と同じメラミ
ン樹脂５０重量部、実施例４と同じアクリル・ブタジエ
ン・メタクリル酸共重合物４．２重量部、実施例４と同
じ熱可塑性飽和共重合ポリエステル樹脂１．２５重量部
を混合して熱硬化性樹脂を調製した。この熱硬化性樹脂
を用いて、後は実施例１と同様にして、金属材１の両面
にＣステージ状態の厚み８μｍの樹脂層２を設けた接合
材Ａを作製した。(Example 6) 100 parts by weight of the same bisphenol A type epoxy resin as in Example 1, 50 parts by weight of the same melamine resin as in Example 1, 4.2 parts by weight of the same acryl-butadiene-methacrylic acid copolymer as in Example 4 And 1.25 parts by weight of the same thermoplastic saturated copolymerized polyester resin as in Example 4, to prepare a thermosetting resin. Using this thermosetting resin, a bonding material A was prepared in the same manner as in Example 1 except that the metal layer 1 was provided with a resin layer 2 having a thickness of 8 μm in a C-stage state on both surfaces.
【００２４】（実施例７）実施例１と同じビスフェノー
ルＡ型エポキシ樹脂１００重量、実施例１と同じメラミ
ン樹脂０．５重量部を混合して熱硬化性樹脂を調製し
た。この熱硬化性樹脂を用いて、後は実施例１と同様に
して、金属材１の両面にＣステージ状態の厚み６μｍの
樹脂層２を設けた接合材Ａを作製した。Example 7 A thermosetting resin was prepared by mixing 100 parts by weight of the same bisphenol A type epoxy resin as in Example 1 and 0.5 parts by weight of the same melamine resin as in Example 1. Using this thermosetting resin, a bonding material A having a 6-μm thick resin layer 2 in a C-stage state on both surfaces of a metal material 1 was manufactured in the same manner as in Example 1.
【００２５】（実施例８）実施例１と同じビスフェノー
ルＡ型エポキシ樹脂１００重量、実施例１と同じメラミ
ン樹脂１２０重量部を混合して熱硬化性樹脂を調製し
た。この熱硬化性樹脂を用いて、後は実施例１と同様に
して、金属材１の両面にＣステージ状態の厚み１５μｍ
の樹脂層２を設けた接合材Ａを作製した。(Example 8) A thermosetting resin was prepared by mixing 100 parts by weight of the same bisphenol A epoxy resin as in Example 1 and 120 parts by weight of the same melamine resin as in Example 1. Using this thermosetting resin, the thickness of the metal material 1 was 15 μm in the C-stage state on both surfaces in the same manner as in Example 1.
The bonding material A provided with the resin layer 2 was prepared.
【００２６】（比較例１）実施例１と同じビスフェノー
ルＡ型エポキシ樹脂１００重量、シリコーン樹脂（ビッ
クケミ−ジャパン（株）製「Ｂｙｋ−３０６）１重量
部、シリカ１０重量部を混合して熱硬化性樹脂を調製し
た。この熱硬化性樹脂を用いて、後は実施例１と同様に
して、金属材１の両面にＣステージ状態の厚み５μｍの
樹脂層２を設けた接合材Ａを作製した。(Comparative Example 1) 100 parts by weight of the same bisphenol A type epoxy resin as in Example 1, 1 part by weight of a silicone resin (“Byk-306” manufactured by BYK Japan KK), and 10 parts by weight of silica were mixed and heat-cured. Using the thermosetting resin, a bonding material A having a 5 μm-thick resin layer 2 in a C-stage state on both surfaces of a metal material 1 was manufactured in the same manner as in Example 1. .
【００２７】[0027]
【化１】 Embedded image
【００２８】上記の実施例１〜８及び比較例１で作製し
た接合材Ａを用い、片面金属箔張り積層板５を製造し
た。すなわち、まずガラス基材（日東紡績社製、ＷＥＡ
１１６Ｅ Ｓ１３６）にエポキシ樹脂を含浸乾燥し
て、樹脂量４２重量％、硬化時間１４０秒のエポキシ樹
脂プリプレグ３を調製し、接合材Ａの両面にこのプリプ
レグ３をそれぞれ２枚重ね、さらに接合材Ａの両面のプ
リプレグ３の外側に厚み３５μｍの銅箔からなる金属箔
４を重ねた。そしてこの構成物の上下にプレートやクッ
ション材をセットし、成形プレス装置で、温度１８０
℃、圧力４０ｋｇ／ｃｍ2 、時間９０分の条件で加熱加
圧成形することによって、板厚２．０ｍｍの２枚の片面
金属張り積層板５を接合材Ａの両面に接合させた状態で
製造した。Using the bonding material A prepared in Examples 1 to 8 and Comparative Example 1, a single-sided metal foil-clad laminate 5 was produced. That is, first, a glass substrate (WEA, manufactured by Nitto Boseki Co., Ltd.)
116E S136) is impregnated with an epoxy resin and dried to prepare an epoxy resin prepreg 3 having a resin amount of 42% by weight and a curing time of 140 seconds, and two prepregs 3 are laminated on both surfaces of the bonding material A, respectively. A metal foil 4 made of a copper foil having a thickness of 35 μm was superposed on the outside of the prepreg 3 on both sides of the above. Then, a plate and a cushion material are set on the upper and lower sides of the component, and a temperature of 180
The two single-sided metal-clad laminates 5 having a thickness of 2.0 mm were bonded to both surfaces of the bonding material A by heating and pressing under conditions of 40 ° C., a pressure of 40 kg / cm 2 and a time of 90 minutes. did.
【００２９】上記のように接合材Ａの表面に接合させた
状態で製造した片面金属張り積層板５について、接合材
Ａと片面金属張り積層板５との引き剥がし強さを測定し
た。結果を表１に示す。次に、このように接合材Ａの両
面にそれぞれ片面金属張り積層板５を接合したものを１
セットとしてエッチング液で処理し、各片面金属張り積
層板５の金属箔４をエッチングした。このようにエッチ
ング処理を行なった際に、実施例１〜８のものは接合材
Ａから片面金属張り積層板５が剥離することはなく、接
合材Ａと片面金属張り積層板５の基板１０との間にエッ
チング液がしみ込むこともなかったが、比較例１のもの
では接合材Ａから片面金属張り積層板５が剥離し、また
接合材Ａと片面金属張り積層板５の基板１０との間にエ
ッチング液がしみ込むものであった。With respect to the single-sided metal-clad laminate 5 manufactured in the state of being bonded to the surface of the bonding material A as described above, the peel strength between the bonding material A and the single-sided metal-clad laminate 5 was measured. Table 1 shows the results. Next, the single-sided metal-clad laminate 5 joined to both sides of the joining material A in this manner is called 1
The set was treated with an etchant to etch the metal foil 4 of each single-sided metal-clad laminate 5. When the etching treatment is performed as described above, in the case of Examples 1 to 8, the single-sided metal-clad laminate 5 does not peel off from the bonding material A, and the bonding material A and the substrate 10 of the single-sided metal-clad laminate 5 Although the etching liquid did not soak between the two, the single-sided metal-clad laminate 5 was peeled off from the bonding material A in the case of Comparative Example 1, and between the bonding material A and the substrate 10 of the single-sided metal-clad laminate 5. The etching solution was soaked into the film.
【００３０】次に、このようにエッチング処理した後
に、接合材Ａから片面金属張り積層板５を剥がし、片面
金属張り積層板５の基板１０の裏面（接合材Ａ側の面）
に樹脂層２の樹脂が転写して付着しているか否を観察し
た。またこのように接合材Ａから剥がした片面金属張り
積層板５の基板１０の裏面にＵＶ硬化インクをシルクス
クリーン印刷し、基板１０のインク密着性を評価した。
インク密着性の評価は、基板１０にＵＶインクをシルク
スクリーンで印刷して照射することによって硬化させ、
硬化させたＵＶインクに縦横１ｍｍ間隔の碁盤目の切り
込みを入れ、粘着テープ（セロテープ）を貼って剥がす
試験を行ない、粘着テープへのＵＶインクの転写量を測
定することによって行なった。そして転写１０％以下を
「○」、転写１０〜５０％を「△」、転写５０％以上を
「×」と判定した。さらに、接合材Ａから剥がした片面
金属張り積層板５の両面に上記のエポキシ樹脂プリプレ
グを２枚ずつ重ねると共にその外側に厚み３５μｍの銅
箔を重ね、温度１７２℃、圧力４０ｋｇ／ｃｍ2 、時間
９０分の条件で加熱加圧して二次成形することによっ
て、板厚０．６ｍｍの３層構成の多層板を製造した。こ
の多層板について層間接着強度を測定した。これらの結
果を表１に示す。Next, after the etching treatment as described above, the single-sided metal-clad laminate 5 is peeled off from the bonding material A, and the back surface of the substrate 10 of the single-sided metal-clad laminate 5 (the surface on the bonding material A side).
It was observed whether or not the resin of the resin layer 2 was transferred and adhered to the substrate. In addition, UV curable ink was silk-screen printed on the back surface of the substrate 10 of the single-sided metal-clad laminate 5 peeled off from the bonding material A in this manner, and the ink adhesion of the substrate 10 was evaluated.
The evaluation of ink adhesion was performed by printing and irradiating UV ink on the substrate 10 with a silk screen and curing the ink.
A test was performed in which a cut was made in a grid at intervals of 1 mm in length and width in the cured UV ink, an adhesive tape (cellotape) was applied and peeled off, and the amount of transfer of the UV ink to the adhesive tape was measured. Then, 10% or less of the transfer was judged as “○”, 10 to 50% of the transfer was judged as “Δ”, and 50% or more of the transfer was judged as “X”. Further, the above-mentioned epoxy resin prepregs were laminated two by two on both sides of the single-sided metal-clad laminate 5 peeled off from the bonding material A, and a 35-μm-thick copper foil was laminated on the outside thereof at a temperature of 172 ° C., a pressure of 40 kg / cm 2 , By heating and pressing under the conditions of 90 minutes and performing secondary molding, a multilayer board having a thickness of 0.6 mm and a three-layer configuration was manufactured. The interlayer bonding strength of this multilayer board was measured. Table 1 shows the results.
【００３１】[0031]
【表１】 [Table 1]
【００３２】表１にみられるように、実施例１〜８のも
のは、接合材Ａと金属張り積層板５の引き剥がし強度が
高く、エッチング後に接合材Ａからの剥離やエッチング
液のしみ込みがなく、多層板の層間接着強度が高いもの
であった。また実施例１〜６のものは、接合材Ａから剥
がした積層板５に接合材Ａの樹脂層２の樹脂が転写して
付着することがなく、インクの密着性にも問題がない
が、樹脂層２におけるエポキシ樹脂に対するメラミン樹
脂の配合量が多い実施例７や少ない実施例８のものは、
樹脂層２の樹脂の転写やインクの密着性に問題があっ
た。As shown in Table 1, in Examples 1 to 8, the peeling strength between the bonding material A and the metal-clad laminate 5 was high, and peeling from the bonding material A and soaking of the etching solution after etching were performed. And the interlayer bonding strength of the multilayer board was high. In the case of Examples 1 to 6, the resin of the resin layer 2 of the bonding material A was not transferred and adhered to the laminate 5 peeled off from the bonding material A, and there was no problem with the ink adhesion. Example 7 and Example 8 in which the blending amount of the melamine resin with respect to the epoxy resin in the resin layer 2 is large,
There was a problem in the transfer of the resin of the resin layer 2 and the adhesion of the ink.
【００３３】[0033]
【発明の効果】上記のように本発明は、両面にプリプレ
グを介して金属箔を配置すると共にこれを加熱加圧する
ことによって、片面金属張り積層板を両面に接合させて
成形するために用いられる接合材を、金属材の表面にそ
れぞれエポキシ樹脂とメラミン樹脂を混合した熱硬化性
樹脂からなる樹脂層を設けて形成するようにしたので、
エポキシ樹脂とメラミン樹脂からなる樹脂層によって、
接合材と片面金属張り積層板との間の密着性を高く得る
ことができ、プリント加工の工程中に接合材から片面金
属張り積層板が剥離したり、接合材と片面金属張り積層
板の間にエッチング液がしみ込んだりすることを防ぐこ
とができるものであり、またエポキシ樹脂とメラミン樹
脂からなる樹脂層は片面金属張り積層板の剥離性も良好
であって、加工した後の片面金属張り積層板を接合材か
ら剥離する際に、樹脂層の樹脂が片面金属張り積層板に
転写して付着するようなことがなくなり、片面金属張り
積層板の背面に対するインクの密着性に問題が生じるこ
とがなくなると共に加工した片面金属張り積層板を二次
成形して多層板を製造するにあたって、層間引き剥がし
強度に問題が生じることがなくなるものである。As described above, the present invention is used to form a single-sided metal-clad laminate by bonding metal foils to both sides by arranging metal foils on both sides via prepregs and applying heat and pressure. Since the bonding material is formed by providing a resin layer made of a thermosetting resin obtained by mixing an epoxy resin and a melamine resin on the surface of the metal material,
By resin layer consisting of epoxy resin and melamine resin,
High adhesion between the bonding material and the single-sided metal-clad laminate can be obtained, the single-sided metal-clad laminate peels off from the bonding material during the printing process, and the etching between the bonding material and the single-sided metal-clad laminate It can prevent the liquid from seeping out.The resin layer made of epoxy resin and melamine resin has good releasability of the single-sided metal-clad laminate. When peeling from the bonding material, the resin of the resin layer is not transferred to and adhered to the single-sided metal-clad laminate, and there is no problem with the adhesion of the ink to the back surface of the single-sided metal-clad laminate. When the processed single-sided metal-clad laminate is subjected to secondary forming to produce a multilayer board, no problem occurs in interlayer peel strength.
【００３４】また本発明は、両面にプリプレグを介して
金属箔を配置すると共にこれを加熱加圧することによっ
て、片面金属張り積層板を両面に接合させて成形するた
めに用いられる接合材を、金属材の表面にそれぞれエポ
キシ樹脂とメラミン樹脂とアクリル・ブタジエン・メタ
クリル酸共重合物とポリエステル系樹脂を混合した熱硬
化性樹脂からなる樹脂層を設けて形成するようにしたの
で、エポキシ樹脂とメラミン樹脂とアクリル・ブタジエ
ン・メタクリル酸共重合物とポリエステル系樹脂からな
る樹脂層によって、接合材と片面金属張り積層板との間
の密着性を高く得ることができ、プリント加工の工程中
に接合材から片面金属張り積層板が剥離したり、接合材
と片面金属張り積層板の間にエッチング液がしみ込んだ
りすることを防ぐことができるものであり、またエポキ
シ樹脂とメラミン樹脂とアクリル・ブタジエン・メタク
リル酸共重合物とポリエステル系樹脂からなる樹脂層は
片面金属張り積層板の剥離性も良好であって、加工した
後の片面金属張り積層板を接合材から剥離する際に、樹
脂層の樹脂が片面金属張り積層板に転写して付着するよ
うなことがなくなり、片面金属張り積層板の背面に対す
るインクの密着性に問題が生じることがなくなると共に
加工した片面金属張り積層板を二次成形して多層板を製
造するにあたって、層間引き剥がし強度に問題が生じる
ことがなくなるものである。Further, the present invention provides a joining material used for joining and molding a single-sided metal-clad laminate on both sides by arranging a metal foil on both sides via a prepreg and heating and pressing the metal foil. Since a resin layer composed of a thermosetting resin mixed with an epoxy resin, a melamine resin, an acrylic / butadiene / methacrylic acid copolymer and a polyester resin is provided on the surface of the material, the epoxy resin and the melamine resin are used. And a resin layer consisting of acrylic-butadiene-methacrylic acid copolymer and polyester resin, it is possible to obtain high adhesion between the bonding material and the single-sided metal-clad laminate, Prevents single-sided metal-clad laminates from peeling and soaking of etchant between bonding material and single-sided metal-clad laminates The resin layer composed of an epoxy resin, a melamine resin, an acrylic butadiene methacrylic acid copolymer, and a polyester resin has good releasability of a single-sided metal-clad laminate, and after processing. When the single-sided metal-clad laminate is peeled from the bonding material, the resin of the resin layer does not transfer to and adhere to the single-sided metal-clad laminate, and there is a problem with the adhesion of the ink to the back surface of the single-sided metal-clad laminate. In addition, when a single-sided metal-clad laminate is subjected to secondary forming to produce a multilayer board, no problem occurs in the interlayer peel strength.
【図１】本発明の実施の形態の一例を示すものであり、
（ａ），（ｂ）はそれぞれ断面図である。FIG. 1 shows an example of an embodiment of the present invention,
(A), (b) is a sectional view, respectively.
【図２】従来例の一例を示すものであり、（ａ），
（ｂ）はそれぞれ断面図である。FIG. 2 shows an example of a conventional example, in which (a),
(B) is a sectional view, respectively.
１ 金属材 ２ 樹脂層 ３ プリプレグ ４ 金属箔 ５ 片面金属張り積層板 Ａ 接合材 Reference Signs List 1 metal material 2 resin layer 3 prepreg 4 metal foil 5 single-sided metal-clad laminate A bonding material
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 1/03 ６３０ Ｈ０５Ｋ 1/03 ６３０Ｈ (72)発明者 藤野 繁 大阪市中央区北久宝寺町１丁目４番８号 株式会社タカラインコーポレーション内──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification symbol FI H05K 1/03 630 H05K 1/03 630H (72) Inventor Shigeru Fujino 1-4-8 Kitakyuhoji-cho, Chuo-ku, Osaka-shi Corporation Inside Takaline Corporation
Claims (7)
すると共にこれを加熱加圧することによって、片面金属
張り積層板を両面に接合させて成形するために用いられ
る接合材において、金属材の両側の表面にそれぞれエポ
キシ樹脂とメラミン樹脂を混合した熱硬化性樹脂からな
る樹脂層を設けて成ることを特徴とする片面金属張り積
層板製造用接合材。1. A joining material used for joining a single-sided metal-clad laminate to both sides and forming the same by heating and pressing a metal foil on both sides via a prepreg and pressing the both sides of the metal material. Characterized in that a resin layer made of a thermosetting resin in which an epoxy resin and a melamine resin are mixed is provided on the surface of each of the above.
エポキシ樹脂を用い、エポキシ樹脂１００重量部に対し
てメラミン樹脂を１〜１００重量部混合して成ることを
特徴とする請求項１に記載の片面金属張り積層板製造用
接合材。2. The single-sided metal cladding according to claim 1, wherein a bisphenol A type epoxy resin is used as the epoxy resin, and 1 to 100 parts by weight of a melamine resin is mixed with respect to 100 parts by weight of the epoxy resin. Bonding material for laminate production.
すると共にこれを加熱加圧することによって、片面金属
張り積層板を両面に接合させて成形するために用いられ
る接合材において、金属材の両側の表面にそれぞれエポ
キシ樹脂とメラミン樹脂とアクリル・ブタジエン・メタ
クリル酸共重合物とポリエステル系樹脂を混合した熱硬
化性樹脂からなる樹脂層を設けて成ることを特徴とする
片面金属張り積層板製造用接合材。3. A bonding material used for bonding a single-sided metal-clad laminate to both sides by forming a metal foil on both sides via a prepreg and applying heat and pressure to the both sides of the metal material. For the production of single-sided metal-clad laminates, characterized in that a resin layer composed of a thermosetting resin obtained by mixing an epoxy resin, a melamine resin, an acryl / butadiene / methacrylic acid copolymer and a polyester resin is provided on the surface of the resin. Bonding material.
エポキシ樹脂を用い、エポキシ樹脂１００重量部に対し
てメラミン樹脂を１〜１００重量部混合して成ることを
特徴とする請求項３に記載の片面金属張り積層板製造用
接合材。4. The single-sided metal cladding according to claim 3, wherein a bisphenol A type epoxy resin is used as the epoxy resin, and 1 to 100 parts by weight of a melamine resin is mixed with 100 parts by weight of the epoxy resin. Bonding material for laminate production.
に硬化させて形成されていることを特徴とする請求項１
乃至４のいずれかに記載の片面金属張り積層板製造用接
合材。5. The resin layer according to claim 1, wherein the resin layer is formed by curing a thermosetting resin to a C-stage state.
5. The bonding material for producing a single-sided metal-clad laminate according to any one of items 1 to 4.
ことを特徴とする請求項１乃至５のいずれかに記載の片
面金属張り積層板製造用接合材。6. The bonding material for producing a single-sided metal-clad laminate according to claim 1, wherein the resin layer has a thickness of 0.1 to 10 μm.
徴とする請求項１乃至６のいずれかに記載の片面金属張
り積層板製造用接合材。7. The bonding material for producing a single-sided metal-clad laminate according to claim 1, wherein the metal material is an aluminum foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16918097A JP3698863B2 (en) | 1997-06-25 | 1997-06-25 | Bonding material for single-sided metal-clad laminate production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16918097A JP3698863B2 (en) | 1997-06-25 | 1997-06-25 | Bonding material for single-sided metal-clad laminate production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1110791A true JPH1110791A (en) | 1999-01-19 |
| JP3698863B2 JP3698863B2 (en) | 2005-09-21 |
Family
ID=15881738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16918097A Expired - Lifetime JP3698863B2 (en) | 1997-06-25 | 1997-06-25 | Bonding material for single-sided metal-clad laminate production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3698863B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002094236A (en) * | 2000-09-11 | 2002-03-29 | Ibiden Co Ltd | Method for manufacturing multilayer circuit board |
| WO2014104490A1 (en) * | 2012-12-31 | 2014-07-03 | 제일모직 주식회사 | Composite material and method for preparing composite material |
| US9637630B2 (en) | 2013-02-21 | 2017-05-02 | Samsung Sdi Co., Ltd. | Resin composition and moulded article using same |
| US9944053B2 (en) | 2012-10-24 | 2018-04-17 | Lotte Advanced Materials Co., Ltd. | Laminate sheet, method of manufacturing the laminate sheet, and article using the laminate sheet |
| US10118370B2 (en) | 2012-09-07 | 2018-11-06 | Lotte Advanced Materials Co., Ltd. | Article and manufacturing method of article |
-
1997
- 1997-06-25 JP JP16918097A patent/JP3698863B2/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002094236A (en) * | 2000-09-11 | 2002-03-29 | Ibiden Co Ltd | Method for manufacturing multilayer circuit board |
| JP4520606B2 (en) * | 2000-09-11 | 2010-08-11 | イビデン株式会社 | Multilayer circuit board manufacturing method |
| US10118370B2 (en) | 2012-09-07 | 2018-11-06 | Lotte Advanced Materials Co., Ltd. | Article and manufacturing method of article |
| US9944053B2 (en) | 2012-10-24 | 2018-04-17 | Lotte Advanced Materials Co., Ltd. | Laminate sheet, method of manufacturing the laminate sheet, and article using the laminate sheet |
| WO2014104490A1 (en) * | 2012-12-31 | 2014-07-03 | 제일모직 주식회사 | Composite material and method for preparing composite material |
| US20150353736A1 (en) * | 2012-12-31 | 2015-12-10 | Cheil Industries Inc. | Composite Material and Method for Preparing Composite Material |
| JP2016502945A (en) * | 2012-12-31 | 2016-02-01 | チェイル インダストリーズ インコーポレイテッド | Composite material and method for producing the composite material |
| US9790369B2 (en) * | 2012-12-31 | 2017-10-17 | Lotte Advanced Materials Co., Ltd. | Composite material and method for preparing composite material |
| US9637630B2 (en) | 2013-02-21 | 2017-05-02 | Samsung Sdi Co., Ltd. | Resin composition and moulded article using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3698863B2 (en) | 2005-09-21 |
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